Callister - An introduction - 8th edition

I6 • Index
Electrical wires, aluminum and
copper, 731–732
Electric dipole moment, 759
Electric dipoles, see Dipoles
Electric field, 722, 727, G4
Electrochemical cells, 677–678
Electrochemical reactions, 675–682
Electrodeposition, 677
Electrode potentials, 677–678
values of, 679
Electroluminescence, 856, G4
Electrolytes, 678, G4
Electromagnetic radiation, 841–843
interactions with atoms/electrons,
843–844
Electromagnetic spectrum, 841–842
Electron band structure, see
Energy bands
Electron cloud, 22, 33
Electron configurations, 24–26, G4
elements, 25
periodic table and, 26
stable, 25
Electronegativity, 26–27, 33, G4
influence on solid solubility, 95
values for the elements, 27
Electroneutrality, 472, G4
Electron gas, 725
Electronic conduction, 722, 755
Electronic polarization, 512,
762–763, 844, 849, G9
Electron microscopy, 109–111
Electron mobility, 727
influence of dopant content on,
742, 743
influence of temperature on,
742, 743
selected semiconductors, 734
Electron orbitals, 21
Electron probability distribution, 22
Electrons, 19–20
conduction process, 735, 748–749
role, diffusion in ionic
materials, 476
energy bands, see Energy bands
energy levels, 21–24
free, see Free electrons
scattering, 727, 783
in semiconductors, 734–739
temperature variation of
concentration, 740–741
spin, 23, 805
valence, 25
Electron states, G4
Electron transitions, 844–845
metals, 845–846
nonmetals, 849–852
Electron volt, 31, G4
Electropositivity, 26, G4
Electrorheological fluids, 12
Elongation, percent, 166
selected materials, A11–A15
selected metals, 168
selected polymers, 572
Embrittlement:
hydrogen, 699–700
temper, 377
Embryo, phase particle, 346
Emf series, 678–680
Emitter, 750–751
Endurance limit, 257. See also
Fatigue limit
Energy:
activation, see Activation energy
bonding, 29, 31, G1
current concerns about, 13–14, 876
free, 285, 345–349, G5
grain boundary, 103
photon, 843
surface, 102
vacancy formation, 92
Energy band gap, see Band gap
Energy bands, 722–725
structures for metals, insulators,
and semiconductors, 724
Energy levels (states), 21–24,
723–724
Energy and materials, 877
Energy product, magnetic, 822–823
Engineering stress/strain, 154, G12
Entropy, 285, 345, 588
Environmental considerations and
materials, 875–883
Epoxies:
degradation resistance, 708
polymer-matrix composites, 650
repeat unit structure, A36
trade names, characteristics,
applications, 598
Equilibrium:
definition of, 285
phase, 285, G4
Equilibrium diagrams, see Phase
diagrams
Erosion-corrosion, 698, G4
Error bars, 181
Error function, Gaussian, 129
Etching, 108, 109
Ethane, 535
Ethers, 536
Ethylene, 534
polymerization, 537
Ethylene glycol (structure), 609
Euro coins, alloys used for, 416
Eutectic isotherm, 299
Eutectic phase, 308, G4
Eutectic reactions, 299, 307, G4
iron-iron carbide system, 321
Eutectic structure, 307, G4
Eutectic systems:
binary, 298–311
microstructure development,
305–311
Eutectoid, shift of position, 330
Eutectoid ferrite, 325
Eutectoid reactions, 314, G4
iron-iron carbide system, 321
kinetics, 357–358
Eutectoid steel, microstructure
changes/development, 322–324
Exchange current density, 685
Excited states, 844, G4
Exhaustion, in extrinsic
semiconductors, 741
Expansion, thermal, see Thermal
expansion
Extrinsic semiconductors, 736–739, G4
electron concentration vs.
temperature, 741
exhaustion, 741
saturation, 741
Extrusion, G4
clay products, 519
metals, 418–419
polymers, 613–614
F
Fabrication:
ceramics, 513
clay products, 518–523
fiber-reinforced composites,
657–660
metals, 417–422
Face-centered cubic structure,
47–48, G4
anion stacking (ceramics), 460–461
Burgers vector for, 204
close packed planes (metals),
69–71
slip systems, 203
Factor of safety, 183, 248
Failure, mechanical, see Creep;
Fatigue; Fracture
Faraday constant, 680
Fatigue, 255–265, G4
corrosion, 264
crack initiation and propagation,
259–261
cyclic stresses, 255–256
environmental effects, 264–265
low- and high-cycle, 259
polymers, 580, 581
probability curves, 258–259
thermal, 264