LCLS Conceptual Design Report - Stanford Synchrotron Radiation ...

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Table 6.3 Laser System Requirements. 6-26 ♦ I NJECTOR L C L S C O N C E P T U A L D E S I G N R E P O R T Parameter Requirement Operating wavelength 260-270 nm (for Cu cathodes) Pulse repetition rate 120 Hz Number of micropulses per pulse 1 Pulse energy on cathode a >500 µJ Laser spot radius on cathode b 0.71 mm rms Pulse rise time (10-90%) 0.5 ps Pulse length 2.9 ps rms Longitudinal pulse shape Various, but nominally uniform Transverse pulse shape Various, but nominally uniform Homogeneity on cathode 10% ptp Optical energy jitter (in UV) ≤2% rms Laser-to-rf phase jitter ≤0.5 ps rms Laser spot diameter jitter at cathode 1% peak-to-peak Pointing jitter
L C L S C O N C E P T U A L D E S I G N R E P O R T section on stability. Fourier-relay optics (described below), beginning with a primary aperture between the two amplifiers and continuing to the final optics platform next to the gun, are used to maintain a good transverse mode while efficiently filling the pumped volume of the Ti:sapphire crystals. In amplifiers for picosecond and especially sub-picosecond pulses, the peak power must be limited to avoid damage to optical components and nonlinearities. Chirped pulse amplification [37] is used to reduce the peak power in the amplifier. The large bandwidth of the Ti:sapphire oscillator, which enables it to produce the 0.5-ps rise time required for the shaped pulse, also permits the pulse to be stretched to hundreds of picoseconds. In the dispersive region between a pair of gratings, different wavelengths take different optical paths. The resulting space, time, and wavelength correlations are then used to stretch the pulse. After amplification, the process can be reversed to compress the pulse to the original or any greater width. In addition, the oscillator’s large bandwidth allows the pulse to be shaped in time by manipulating its Fourier transform under computer control (see below). Figure 6.14 includes the pulse shaper and stretcher after the oscillator and a compressor after the amplifier. An additional low-power compressor after the oscillator is used as a diagnostic for the pulse shaper. It compresses the pulses from the 89-MHz train that are not selected by the Pockels-cell gate. A cross-correlator using a portion of the oscillator light can then probe the resulting pulse shape. 6-27 ♦ I NJECTOR
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Linac Coherent Light Source (LCLS)
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L C L S C O N C E P T U A L D E S I
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Preface This Conceptual Design Repo
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Table of Contents 1 Executive Summa
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6. Two experiment halls L C L S C O
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2.7.1.7 Conventional Facilities L C
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3 TECHNICAL SYNOPSIS Scientific Bas
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5 TECHNICAL SYNOPSIS FEL Parameters
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〈∆E/E 0 〉 /% I pk /I pk0 0.1
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β (m) 35 30 25 20 15 10 5 0 K21_1B
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β (m) 60 50 40 30 20 10 0 L C L S
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economic reasons. L C L S C O N C E
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Phase [deg. S-band] L C L S C O N C
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New Solid-State Sub-Booster and Ele
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7.8.2 Bunch Length Diagnostics L C
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Magnet String Location Existing, Ne
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8.1 Overview 8.1.1 Introduction L C
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Mu in the pole, for mu
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Gasload (Torr-l/sec-cm) (x10 -12 )
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8.10.4 Conclusion L C L S C O N C E
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x θ j > 0 L C L S C O N C E P T U
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Quad ∆X/µm Quad ∆Y/µm −500
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∆X/µm ∆Y/µm L C L S C O N C E
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8.13.2 Undulator Cell Structure L C
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9.2 Layout and Optics 9.2.1 Experim
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Fast Valve L C L S C O N C E P T U
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0.01 10 -4 10 -6 10 -8 10 -10 10 -1
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Table 9.5 Mirror requirements L C L
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Refractive Focusing System L C L S
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Pulse Split/Delay L C L S C O N C E
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Figure 9.20 LCLS Ion Chamber L C L
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9.4.3.2 Pulse Length L C L S C O N
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9.4.3.6 Divergence L C L S C O N C
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10 Conventional Facilities TECHNICA
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1-2002 8560A198 Linac Center Line L
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Figure 10.6 Near hall floor plan 10
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11 Controls TECHNICAL SYNOPSIS The
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11.5.3 Motion Controls L C L S C O
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12.1 Procedural Overview L C L S C
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13 Environment, Safety and Health a
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Table 13-1 Hazard Identification an
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13.1 Ionizing Radiation The design
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Table 13-2 Minimum Training Require
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13.10 SLAC References L C L S C O N
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L C L S D E S I G N S T U D Y R E P
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15 TECHNICAL SYNOPSIS Work Breakdow
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A A.1 FEL-Physics A.1.1 Performance
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A.2 Photo-Injector A.2.1 Gun-Laser
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A.2.3.2 Electron Beam L C L S C O N
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A.2.4.7 Vacuum L C L S C O N C E P
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A.3.8 DL-2 A.3.8.1 Subsystem L C L
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A.4 Undulator A.4.1 Undulator A.4.1
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B Control Points B.1 Injector Contr
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C Glossary ACO Anneaux Collisions O
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