LCLS Conceptual Design Report - Stanford Synchrotron Radiation ...

More documents

Recommendations

Info

L C L S C O N C E P T U A L D E S I G N R E P O R T face of the jaw. A spoiler of thickness ~1 Xo (≡ 3.77 cm) will do the job. The shower multiplicity in the titanium alloy at that depth is ( ) − Π e ~6. The effective heat source term is S1 X ~ 4500 W/cm 3 , the resulting single pulse temperature rise for the standard beam parameters is ∆Tpulse ~11°C, and the consequential thermal stress rise is σth ~ 2.14 × 10 7 N/m 2 (3100) psi
L C L S C O N C E P T U A L D E S I G N R E P O R T Two effects, namely the geometric wall wakefield and the resistive wall wakefield, can negatively influence beam performance. The 6 mm OD × 5 mm ID stainless steel tubing needs to have a small surface roughness. Various roughness-reducing procedures have been investigated. The semiconductor industry has an ongoing need for ultra pure gas transport systems, and much R&D effort was invested in recent years to satisfy these demands. Present state-of-the-art technology identified fully austenitic stainless steel Type 316-L with very stringent chemical composition limits as a successful starting material. It is extruded into seamless tubing with special high quality dies, to great straightness, and under very clean conditions. The tubing is then cleaned and electropolished in lengths up to 6 m. Tubing with a surface roughness of Ra ~125 nm (rms) is readily available off the shelf and for modest cost. Flat surfaces are readily electropolished to Ra ~50 nm, and such a value might also be achievable inside a tube with more R&D effort. Another quantity in surface roughness evaluation is the total peak-to-valley depth of roughness, Rt or Rmax, which varies from 4 to 12 times the Ra value. An R&D program is underway at SLAC/SSRL to use such high quality industrial tubing as starting material and then improve the surface quality to Ra < 100 nm (rms) by further electropolishing. The best results to date from small samples (12 to 15 mm long × 5 to 6 mm wide) cut out at random locations from 0.5 m long tubing sections showed Ra values from a best of 10 nm to the 50 nm (rms) range. The azimuthal values were always somewhat lower than the longitudinal ones. The measurements were made with an atomic force microscope and distances traversed with the stylus were ~55 µm azimuthally and ~70 µm longitudinally. It appears that the surface quality of the commercial products can be significantly improved to achieve values of surface roughness that will not negatively impact the performance of the <strong>LCLS</strong> undulator. Electro-polishing 3.4 m long tubing sections will, however, present additional challenges. Since stainless steel has a high electrical resistivity, the resistive wall wake is increased. To reduce this effect, a thin layer of copper (> skin depth) is deposited onto the highly electropolished surface using a thin nickel substrate for better adhesion. This process is then followed by further electro-polishing the copper surface. Best values achieved to date are Ra ~120 nm (rms), but further refinements in the process are possible and should make the surface inside the undulator vacuum chamber smooth enough that it does not materially degrade the electron beam. 8.8.2 Vacuum System Requirements and Description The vacuum system for the undulator must have the following attributes to provide a good environment for the electron and photon beams: • The vacuum system components must provide low impedance to avoid producing beam instabilities and minimize higher-order mode heating. • Adequate pumping must be provided to maintain a low beamline pressure (
Page 1 and 2:
Linac Coherent Light Source (LCLS)
Page 3 and 4:
L C L S C O N C E P T U A L D E S I
Page 5 and 6:
Page 7 and 8:
Preface This Conceptual Design Repo
Page 9 and 10:
Page 11 and 12:
Table of Contents 1 Executive Summa
Page 13 and 14:
Page 15 and 16:
Page 17 and 18:
Page 19 and 20:
Page 21 and 22:
Page 23 and 24:
Page 25:
Page 28 and 29:
6. Two experiment halls L C L S C O
Page 30 and 31:
Page 32 and 33:
Page 34 and 35:
Page 36 and 37:
Page 38 and 39:
2.7.1.7 Conventional Facilities L C
Page 40 and 41:
Page 42 and 43:
Page 44 and 45:
Page 46 and 47:
Page 49 and 50:
3 TECHNICAL SYNOPSIS Scientific Bas
Page 51 and 52:
Page 53 and 54:
Page 55 and 56:
Page 57:
Page 60 and 61:
Page 62 and 63:
Page 64 and 65:
Page 66 and 67:
Page 68 and 69:
Page 70 and 71:
Page 72 and 73:
Page 74 and 75:
Page 76 and 77:
Page 78 and 79:
Page 80 and 81:
Page 82 and 83:
Page 84 and 85:
Page 86 and 87:
Page 89 and 90:
5 TECHNICAL SYNOPSIS FEL Parameters
Page 91 and 92:
Page 93 and 94:
and the total peak beam power L C L
Page 95 and 96:
Page 97 and 98:
Page 99 and 100:
Page 101 and 102:
Page 103 and 104:
Page 105 and 106:
5.4.2.2 Case II - High Charge Limit
Page 107 and 108:
Page 109 and 110:
Page 111 and 112:
Page 113 and 114:
∆P ∆I sat pl / P / I sat pk L C
Page 115 and 116:
Page 117 and 118:
5.9 Summary L C L S C O N C E P T U
Page 119 and 120:
6 Injector TECHNICAL SYNOPSIS The i
Page 121 and 122:
Page 123 and 124:
Page 125 and 126:
εn,x (µm) 4 3 2 1 4-2001 8560A95
Page 127 and 128:
Page 129 and 130:
Page 131 and 132:
Page 133 and 134:
Page 135 and 136:
Page 137 and 138:
Page 139 and 140:
Quantum Yield (electrons/photon) 10
Page 141 and 142:
Bz (T) 0.3 0.2 0.1 1-2002 8560A92 L
Page 143 and 144:
Page 145 and 146:
Page 147 and 148:
Page 149 and 150:
Page 151 and 152:
Page 153 and 154:
Master Clock 9.917 MHz x8 x6 x6 Df
Page 155 and 156:
Page 157 and 158:
Page 159 and 160:
1-2002 8560A198 Linac Center Line L
Page 161 and 162:
Page 163 and 164:
Page 165 and 166:
B z (kG) 3 2 1 4-2001 8560A91 L C L
Page 167 and 168:
Page 169 and 170:
γε x,y (µm) 3 2 1 0 3-2001 8560A
Page 171 and 172:
γεx,y (µm) yn 10 0 -10 -10 0 10
Page 173 and 174:
σ γ /γ 0 (percent) ∆N/N 0.02 0
Page 175 and 176:
5 0 -5 5 0 -5 5 0 -5 L C L S C O N
Page 177 and 178:
Table 6.5 PARMELA Output Parameters
Page 179 and 180:
gama x (micro.m) 3 2 1 0 0 L C L S
Page 181 and 182:
∆E/E 0 (%) ∆N/N 0 -1 -2 0.02 0
Page 183 and 184:
Page 185:
Page 188 and 189:
Page 190 and 191:
Page 192 and 193:
Page 194 and 195:
Page 196 and 197:
Page 198 and 199:
Page 200 and 201:
Page 202 and 203:
Page 204 and 205:
〈∆E/E 0 〉 /% I pk /I pk0 0.1
Page 206 and 207:
Page 208 and 209:
Page 210 and 211:
Page 212 and 213:
Page 214 and 215:
Page 216 and 217:
β (m) 35 30 25 20 15 10 5 0 K21_1B
Page 218 and 219:
Page 220 and 221:
β (m) 60 50 40 30 20 10 0 L C L S
Page 222 and 223:
Page 224 and 225:
Page 226 and 227:
Page 228 and 229:
Page 230 and 231:
Page 232 and 233:
Page 234 and 235:
Page 236 and 237:
Page 238 and 239:
Page 240 and 241:
Page 242 and 243:
Page 244 and 245:
Page 246 and 247:
Page 248 and 249:
Page 250 and 251:
Page 252 and 253:
Page 254 and 255:
Page 256 and 257:
economic reasons. L C L S C O N C E
Page 258 and 259:
Page 260 and 261:
Page 262 and 263:
Page 264 and 265:
Page 266 and 267:
Page 268 and 269:
Phase [deg. S-band] L C L S C O N C
Page 270 and 271:
Page 272 and 273:
New Solid-State Sub-Booster and Ele
Page 274 and 275:
Page 276 and 277:
Page 278 and 279:
7.8.2 Bunch Length Diagnostics L C
Page 280 and 281:
Page 282 and 283:
Page 284 and 285:
Page 286 and 287:
Page 288 and 289:
Page 290 and 291:
Page 292 and 293:
Page 294 and 295:
Page 296 and 297:
Magnet String Location Existing, Ne
Page 298 and 299: L C L S C O N C E P T U A L D E S I
Page 304 and 305: 8.1 Overview 8.1.1 Introduction L C
Page 326 and 327: Mu in the pole, for mu
Page 354 and 355: Gasload (Torr-l/sec-cm) (x10 -12 )
Page 368 and 369: 8.10.4 Conclusion L C L S C O N C E
Page 376 and 377: x θ j > 0 L C L S C O N C E P T U
Page 386 and 387: Quad ∆X/µm Quad ∆Y/µm −500
Page 388 and 389: ∆X/µm ∆Y/µm L C L S C O N C E
Page 392 and 393: 8.13.2 Undulator Cell Structure L C
Page 398 and 399:
Page 400 and 401:
Page 402 and 403:
Page 404 and 405:
Page 406 and 407:
Page 408 and 409:
9.2 Layout and Optics 9.2.1 Experim
Page 410 and 411:
Fast Valve L C L S C O N C E P T U
Page 412 and 413:
Page 414 and 415:
0.01 10 -4 10 -6 10 -8 10 -10 10 -1
Page 416 and 417:
Page 418 and 419:
Table 9.5 Mirror requirements L C L
Page 420 and 421:
Refractive Focusing System L C L S
Page 422 and 423:
Page 424 and 425:
Pulse Split/Delay L C L S C O N C E
Page 426 and 427:
Page 428 and 429:
Page 430 and 431:
Figure 9.20 LCLS Ion Chamber L C L
Page 432 and 433:
Page 434 and 435:
9.4.3.2 Pulse Length L C L S C O N
Page 436 and 437:
9.4.3.6 Divergence L C L S C O N C
Page 438 and 439:
10 Conventional Facilities TECHNICA
Page 440 and 441:
1-2002 8560A198 Linac Center Line L
Page 442 and 443:
Page 444 and 445:
Figure 10.6 Near hall floor plan 10
Page 446 and 447:
Page 449 and 450:
11 Controls TECHNICAL SYNOPSIS The
Page 451 and 452:
Page 453 and 454:
Page 455 and 456:
11.5.3 Motion Controls L C L S C O
Page 457 and 458:
Page 459:
Page 462 and 463:
12.1 Procedural Overview L C L S C
Page 464 and 465:
Page 466 and 467:
Page 468 and 469:
Page 470 and 471:
Page 472 and 473:
Page 474 and 475:
Page 476 and 477:
Page 478 and 479:
Page 481 and 482:
13 Environment, Safety and Health a
Page 483 and 484:
Table 13-1 Hazard Identification an
Page 485 and 486:
13.1 Ionizing Radiation The design
Page 487 and 488:
Table 13-2 Minimum Training Require
Page 489 and 490:
Page 491 and 492:
Page 493 and 494:
Page 495:
13.10 SLAC References L C L S C O N
Page 498 and 499:
L C L S D E S I G N S T U D Y R E P
Page 500 and 501:
Page 502 and 503:
Page 504 and 505:
Page 506 and 507:
Page 508 and 509:
Page 510 and 511:
Page 512 and 513:
Page 515 and 516:
15 TECHNICAL SYNOPSIS Work Breakdow
Page 517 and 518:
Page 519 and 520:
A A.1 FEL-Physics A.1.1 Performance
Page 521 and 522:
A.2 Photo-Injector A.2.1 Gun-Laser
Page 523 and 524:
A.2.3.2 Electron Beam L C L S C O N
Page 525 and 526:
A.2.4.7 Vacuum L C L S C O N C E P
Page 527 and 528:
Page 529 and 530:
Page 531 and 532:
Page 533 and 534:
A.3.8 DL-2 A.3.8.1 Subsystem L C L
Page 535 and 536:
A.4 Undulator A.4.1 Undulator A.4.1
Page 537 and 538:
Page 539 and 540:
Page 541 and 542:
Page 543 and 544:
B Control Points B.1 Injector Contr
Page 545 and 546:
Page 547 and 548:
C Glossary ACO Anneaux Collisions O
Page 549 and 550:
Page 551 and 552:
Page 553:
show all

LCLS Conceptual Design Report - Stanford Synchrotron Radiation ...

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?