Fig. 4 The true stress-strain curves for cast state <strong>and</strong> ECAPed with 4 passes at different temperatures. Fig. 5 (a) though (c) showed the OM microstructures <strong>of</strong> the materials processed at 200, 150 <strong>and</strong> 100 °C after compression tests <strong>and</strong> Fig. 5 (d) exhibited the microstructure <strong>of</strong> the material processed at room temperature. Fig. 5 demonstrated that there were no twins when the grain size was less than 5 µm, but some twins existed in the grains about 5 µm or larger, as in Fig. 5 (b). Combining this feature with the compression behaviours in Fig. 4, it might conclude that strain hardening was, at least partially, attributed to mechanical twining. In addition, the high yield stress <strong>and</strong> low ductility for the materials ECAPed at 150 <strong>and</strong> 100 ˚C may due to formation <strong>of</strong> texture during the BP-ECAP. Cisar [10] <strong>and</strong> Kim [19] etc have reported that ECAP processing makes basal plan parallel to extrusion direction results in Schmid factor closed to 0, which is also makes yield strength increase <strong>and</strong> ductility decrease. Fig. 5 The microstructure <strong>of</strong> compressive deformed samples: (a) 200 ºC; (b) 150 ºC; (c) 100 ºC; (e) room temperature (SEM). 94
Conclusions (1) The large grains in the as-cast pure Mg were successfully refined into submicron sized grains using BP-ECAP at room temperature without cracks. (2) The compressive tests at room temperature showed that the yield strength might decrease as the grain size was reduced into submicron level. However, the ductility was significantly enhanced due to submicron grain size. (3) Strong strain hardening was attributed to large grain sizes, which was larger than 10 µm. Deformation twining, might contribute to the yield strength for the pure Mg materials having grains larger than 5 µm. References: [1] Y.T. Zhu, J.Y. Huang, J. Gubicza, T. Ungár, Y.M. Wang, E. Ma, R.Z. Valiev, J. Mater. Res. 18 (2003) 1908. [2] D. Jia, Y.M. Wang, K.T. Ramesh, E. Ma, Y.T. Zhu, R.Z. Valiev, Appl. Phys. Lett. 79 (2001) 611. [3] R. Valiev, Nature Mater. 3 (2004) 511. [4] Z. Horita, K. Ohashi, T. Fujita, K. Kaneko, T.G. Langdon, Adv. Mater. 17 (2005) 1599. [5] K. Matsubara, Y. Miyahara, Z. Horita, T. G. Langdon. Acta Mater. 51 (2003) 3073. [6] K. Xia , J. T. Wang, X. Wu, G. Chen, M. Gurvan. Mater. Sci. Eng. A 410-411 (2005)324. [7] C. Mallikarjuna, S. M. Shashidhara, U. S. Mallik. Mater. Design. 30 (2009) 1638. [8] P. L. Sun, P. W. Kao, C. P. Chang. Mater. Sci. Eng. A. 283 (2000) 82. [9] M. Furukawa, Y. Ma, Z. Horita, M. Nemoto, R. Z. Valiev, T. G. Langdon. Mater. Sci. Eng. A. 241 (1998) 122. [10] L. Cisar, Y. Yoshida, S. Kamado, Y. Kojima, F. Watanabe. Mater. Sci. Forum. 419-4 (2003) 249. [11] E. J. Kwak, C. H. Bok, M. H. Seo, H. S. Kim. Mater. Trans. 49 (2008) 1006. [12] X. Zhao, W. Fu, X. Yang, T. G. Langdon. Scripta Mater. 59 (2008) 542. [13] J. Koike, R. Ohyama. Acta Mater. 53 (2005) l963. [14] N. Ogawa, M. Shiomi, K. Osakada. Int J Mach Tool Manu. 42 (2002) 607. [15] W. M. Gan, M. Y. Zheng, H. Chang, B. Schwebke. J. Alloys. Comp. 470 (2009) 256. [16] A. Yamashita, Z. Horita, T. G. Langdon. Mater. Sci. Eng. A 300 (2001) 142. [17] K. Matsubara, Y. Miyahara, Z. Horita, T. G. Langdon. Metall. Mater. Trans. A 35 (2004) 1735. [18] S. Y. Chang, S. W. Lee, K. M. Kang, S. Kamado, Y. Kojima. Mater. Trans. 45 (2004) 488. [19] W. J. Kim, S. I. Hong, Y. S. Kim, S. H. Mind, H. T. Jeong, J. D. Lee. Acta Mater. 51 (2003) 3293. 95
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The 3 rd VACPS Research Workshop Pr
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Organizing Committee Victorian Asso
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Preface On the occasion of the publ
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Paper as a low-cost base material f
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Acknowledgements We gratefully ackn
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Career planning and Job Interview i
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