section 1 - World Intellectual Property Organization
section 1 - World Intellectual Property Organization
section 1 - World Intellectual Property Organization
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37/2000<br />
14 Sep/sep 2000 PCT Gazette - Section I - Gazette du PCT 13433<br />
(54) A METHOD OF PRODUCING PRIN-<br />
TED CIRCUIT BOARDS AND A HEAT<br />
SINK ARRANGEMENT PRODUCED<br />
IN ACCORDANCE WITH THE ME-<br />
THOD<br />
PROCEDE DE PRODUCTION DE<br />
CARTES DE CIRCUITS IMPRIMES<br />
ET AGENCEMENT DE PUITS DE<br />
CHALEUR CORRESPONDANT<br />
(71) TELEFONAKTIEBOLAGET LM<br />
ERICSSON (publ) [SE/SE]; S–126 25<br />
Stockholm (SE).<br />
(72) BERGSTEDT, Leif; Allmänna vägen 6,<br />
S–518 40 Sjömarken (SE). LIGANDER,<br />
Per; Blåsutgatan 17, S–414 56 Göteborg<br />
(SE).<br />
(74) NORIN, Klas; Ericsson Radio Systems<br />
AB, Common Patent Department, S–164 80<br />
Stockholm (SE).<br />
(81) AE AL AM AT AU AZ BA BB BG BR BY<br />
CA CH CN CR CU CZ DE DK DM EE ES<br />
FI GB GD GE GH GM HR HU ID IL IN IS<br />
JP KE KG KP LS LT LU LV MA MD MG<br />
MK MN MW MX NO NZ PL PT RO RU<br />
SD SE SG SI SK SL TJ TM TR TT TZ UA<br />
UG UZ VN YU ZA ZW; AP (GH GM KE<br />
LS MW SD SL SZ TZ UG ZW); EA (AM<br />
AZ BY KG KZ MD RU TJ TM); EP (AT<br />
BE CH CY DE DK ES FI FR GB GR IE IT<br />
LU MC NL PT SE); OA (BF BJ CF CG CI<br />
CM GA GN GW ML MR NE SN TD TG).<br />
Published / Publiée :(c)<br />
(51) 7 H05K 3/40, 3/24, 3/34, H01L 23/498<br />
(11) WO 00/54561<br />
(21) PCT/DE00/00377<br />
(13) A1<br />
(22) 8 Feb/fév 2000 (08.02.2000)<br />
(25) de (26) de<br />
(30) 199 10 078.0 8 Mar/mar 1999<br />
(08.03.1999)<br />
DE<br />
(43) 14 Sep/sep 2000 (14.09.2000)<br />
(54) METHOD FOR IMPROVING THE MA-<br />
NUFACTURING SAFETY OF WELD<br />
JOINTS<br />
PROCEDE PERMETTANT<br />
D’AUGMENTER LA SECURITE DE<br />
FABRICATION DE LIAISONS SOU-<br />
DEES<br />
(71) ROBERT BOSCH GMBH [DE/DE]; Postfach<br />
30 02 20, D–70442 Stuttgart (DE).<br />
(for all designated States except / pour tous<br />
les États désignés sauf US)<br />
(72, 75) SCHWAIGER, Jürgen [DE/DE]; Hopfengartenstrasse<br />
57/a, D–72766 Reutlingen<br />
(DE). BECKER, Rolf [DE/DE]; Schillerstrasse<br />
6/1, D–72793 Pfullingen (DE).<br />
(81) JP US; EP (AT BE CH CY DE DK ES FI<br />
FR GB GR IE IT LU MC NL PT SE).<br />
(51) 7 H05K 9/00, H04N 5/222<br />
(11) WO 00/54562 (13) A1<br />
(21) PCT/US00/05715<br />
(22) 7 Mar/mar 2000 (07.03.2000)<br />
(25) en (26) en<br />
(30) 09/265,815 10 Mar/mar 1999<br />
(10.03.1999)<br />
(43) 14 Sep/sep 2000 (14.09.2000)<br />
US<br />
(54) METHOD AND APPARATUS FOR<br />
SUPPRESSING ELECTROMAGNETIC<br />
EMISSIONS FROM A BUS INTER-<br />
FACE<br />
MENT<br />
WITH ELECTRONIC EQUIP-<br />
PROCEDE ET APPAREIL DE SUP-<br />
PRESSION D’EMISSIONS ELECTRO-<br />
MAGNETIQUES D’UNE INTERFACE<br />
DE BUS DOTEE D’UN EQUIPEMENT<br />
ELECTRONIQUE<br />
(71) GENERAL INSTRUMENT CORPORA-<br />
TION [US/US]; 101 Tournament Drive,<br />
Horsham, PA 19044 (US).<br />
(72) GROFF, Donald, E.; 2113 Rebecca Drive,<br />
Hatfield, PA 19440 (US).<br />
(74) NICHOLS, Steven, L.; Rader, Fishman<br />
& Grauer PLLC, Lion Building, 1233 20th<br />
Street, NW, Washington, DC 20036 (US).<br />
(81) AL AM AT AU AZ BA BB BG BR BY CA<br />
CH CN CU CZ DE DK EE ES FI GB GD<br />
GE GH GM HR HU ID IL IN IS JP KE KG<br />
KP KR KZ LC LK LR LS LT LU LV MD<br />
MG MK MN MW MX NO NZ PL PT RO<br />
RU SD SE SG SI SK SL TJ TM TR TT UA<br />
UG UZ VN YU ZW; AP (GH GM KE LS<br />
MW SD SL SZ TZ UG ZW); EA (AM AZ<br />
BY KG KZ MD RU TJ TM); EP (AT BE<br />
CH CY DE DK ES FI FR GB GR IE IT LU<br />
MC NL PT SE); OA (BF BJ CF CG CI CM<br />
GA GN GW ML MR NE SN TD TG).<br />
Published / Publiée :(c)<br />
(51) 7 H05K 13/00, 13/04<br />
(11) WO 00/54563 (13) A1<br />
(21) PCT/DE00/00484<br />
(22) 21 Feb/fév 2000 (21.02.2000)<br />
(25) de (26) de<br />
(30) 199 10 110.8 8 Mar/mar 1999<br />
(08.03.1999)<br />
(43) 14 Sep/sep 2000 (14.09.2000)<br />
DE<br />
(54) DEVICE FOR FITTING ELECTRIC<br />
COMPONENTS ON SUBSTRATES<br />
DISPOSITIF PERMETTANT DE DEPO-<br />
SER DES COMPOSANTS ELEC-<br />
TRIQUES SUR DES SUBSTRATS<br />
(71) SIEMENS AKTIENGESELLSCHAFT<br />
[DE/DE]; Wittelsbacherplatz 2, D–80333<br />
München (DE).<br />
(for all designated States except / pour tous<br />
les États désignés sauf US)<br />
(72, 75) MEHDIANPOUR, Mohammad<br />
[IR/DE]; Heltauer Strasse 39, D–81829<br />
München (DE).<br />
(74) SIEMENS AKTIENGESELLSCHAFT;<br />
Postfach 22 16 34, D–80506 München (DE).<br />
(81) CN JP KR US; EP (AT BE CH CY DE DK<br />
ES FI FR GB GR IE IT LU MC NL PT SE).<br />
(51) 7 H05K 13/04<br />
(11) WO 00/54564 (13) A1<br />
(21) PCT/DE00/00612<br />
(22) 1 Mar/mar 2000 (01.03.2000)<br />
(25) de (26) de<br />
(30) 199 09 775.5 5 Mar/mar 1999<br />
(05.03.1999)<br />
(43) 14 Sep/sep 2000 (14.09.2000)<br />
DE<br />
(54) DEVICE FOR FITTING A SUBSTRATE<br />
WITH A FLIP CHIP<br />
DISPOSITIF D’IMPLANTATION DE<br />
PUCES A PROTUBERANCES SUR UN<br />
SUBSTRAT<br />
(71) SIEMENS AKTIENGESELLSCHAFT<br />
[DE/DE]; Wittelsbacherplatz 2, D–80333<br />
München (DE).<br />
(for all designated States except / pour tous<br />
les États désignés sauf US)<br />
(72, 75) SCHIEBEL, Günter [DE/DE]; Halske<br />
Strasee 7, D–81379 München (DE).<br />
(74) SIEMENS AKTIENGESELLSCHAFT;<br />
Postfach 22 16 34, D–80506 München (DE).<br />
(81) CN JP KR US; EP (AT BE CH CY DE DK<br />
ES FI FR GB GR IE IT LU MC NL PT SE).<br />
Published / Publiée :(c)