Developments in Ceramic Materials Research

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240 R. Ramesh, H. Kara, Ron Stevens and C. R. Bowen [20] Bowen, C.R, Parry, A, Kara, H and Mahon, S.W, J. European Ceram. Soc. 2001, 21, 1463-1467. [21] Ramesh, R, Kara, H and Bowen, C.R, Ferroelectrics 2002, 273, 383-388. [22] Hayward, G and Hossack, J.A, IEEE Trans. Ultason. Ferroelec. Freq. Control, 1991, 38, 618-629. [23] Ramesh, R, Durga Prasad, C, Vinod Kumar, T.K, Gavane, L.A and Vishnubhatla, R.M.R, Ultrasonics 2006, 44, 341-349. [24] Qi, W and Cao, W, Ultrasonic imaging, 1996, 18, 1-9. [25] Ramesh, R, Kara, H, Stevens, R, Jayasundare, N, Humphrey’V and Bowen, C.R, Integrated Ferroelectrics 2004, 64, 201-206. [26] Tuttle, B.A, Smay, J.E, Cesarano, J.D, Voigt, J.A and Olson, W.R, 25th Ann. Int. Conf. on Advanced Ceramics and Composites, January 21-26, 2001, Cocoa Beach, Florida. [27] Safari, A, Danforth, S.C, Jafari, M and Allahverdi, M, 25th Ann. Int. Conf. on Advanced Ceramics and Composites, January 21-26, 2001, Cocoa Beach, Florida. [28] Rittenmyer, K, Shrout, T, Schulze, W.A and Newnham, R.E, Ferroelectrics 41, 1982, 189-195. [29] Skinner, D.P, Newnham, R.E, Cross, L.E, Mat. Res. Bull., 13, 1978, 599-607. [30] Creedon, M.J, Gopalakrishnan, S and Schulze, W.A, Ferroelectrics 1995, 299-302. [31] J. Saggio-Woyansky, Scott, C.E and Minnear, W.P, American Ceramic Society Bulletin, 71, 1992, 1674-1682. [32] Bowen, C.R and Kara, H, Materials Chemistry and Physics, 75, 2002,.45-49. [33] Bowen, C.R, Perry, A, Kara, H and Mahon, S.W, J. Eur. Ceram. Soc. 21, 2001,1463- 1467. [34] Smith, W.A, Shaulov, A.A and Auld, B.A, Ferroelectrics 91, 1989, 155. [35] IEEE Standard on piezoelectricity ANSI/ IEEE Std – 176, 1978, The Institute of Electrical and Electronics Engineers Inc, New York. [36] Banno, H, Jpn. J. Appl. Phys. Part I, 32, 1993, 4214-4217. [37] Dunn, M.L and Taya, M, J. Am. Ceram. Soc. 76, 1993, 1697-1706. [38] Hayward, G and Hossack, J.A, IEEE Trans. Ultason. Ferroelec. Freq. Control, 38, 1991, 618-629. [39] Ramesh, R, Kara, H and Bowen, C.R, Computational Materials Science, 30, 2004, 397- 403. [40] Ramesh, R, Kara, H and Bowen, C.R, Ultrasonics 43, 2005, 173-181. [41] Hydrophones – their characteristics and applications, in Introduction to underwater acoustics, Band K Application note, Bruel and Kjaer, Denmark. [42] Berlincourt, D and Krueger, H.H.A, Important properties of Morgan Matroc piezoelectric ceramics, TP-226, Morgan Matroc Ltd. U.K [43] Creedon, M.J and Schulze, W.A, Proceedings of the 10th IEEE International Symposium on Applications of Ferroelectrics 1996, 527-530. [44] Creedon, M.J, Gopalakrishnan, S and Schulze, W.A, Proceedings of the 9th IEEE International Symposium on Applications of Ferroelectrics 1995, 299-302. [45] Lange, F.F and Miller, K.T, Adv. Ceram. Mater. 2, 1987, 827–31. [46] Kara, H, Perry, A, Stevens, R and Bowen, C.R, Ferroelectrics 265, 2002, 317-332.
In: Developments in Ceramic Materials Research ISBN 978-1-60021-770-8 Editor: Dena Rosslere, pp. 241-260 © 2007 Nova Science Publishers, Inc. Chapter 8 FIELD EMISSION DISPLAY ON CERAMIC Li Chen The University of York, Heslington, York, YO10 5DD, UK ABSTRACT Scientific advances concerning many ceramic materials have enabled technological breakthroughs globally. The superior combinations of thermal, insulating, electrical and mechanical properties have become the basis of huge applications in the packaging of microelectronics and power semiconductors. Miniaturization and integration of metal via into ceramic substrate make it feasible to construct multilayer circuit inter connections. This advantage provides the possibility to mount electronics component and circuitry directly onto both side of ceramic substrate. This packaging advance makes ceramic very attractive to field emission display application. Field emission display is able to combine the high quality images and large viewing angles of cathode ray tube, while delivering it in the flatness attributed to liquid crystal display, and utilizing just a fraction of the electrical power required by plasma display panel. Field emission display is predicted to be one of the most promising flat panel displays that will take off in the future. Currently relying on the semiconductor thin film micro-fabrication technology, field emission displays are fabricated mostly on soda-lime glass substrate. Although this is compatible to the liquid crystal display technology, the row and column electrodes of a field emission display have to be allocated to the sides of glass substrate. Furthermore, the existing technology still has difficulties to deliver large area micro field emitters with acceptable uniformity. If the key components of micro field emitter matrix pixels can be produced entirely on the front side of ceramic substrate, and are electrically connected to the backside drive and control circuit through the micro via, this allows construction of micro field emitters right up to the edge of ceramic substrate. In addition, a large size display can be constructed by tiling ceramic substrates precisely. In this chapter, the micro-fabrication of field emitters on ceramic substrate is presented. Electron emission characteristics of these micro field emitters were studied, and results from the microstructures are analysed.
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DEVELOPMENTS IN CERAMIC MATERIALS R
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Copyright © 2007 by Nova Science P
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PREFACE Ceramics are refractory, in
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Preface ix crystals is discussed. A
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Preface xi spectra and the directio
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2 Leslie G. Cecil comprehensive dat
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4 Leslie G. Cecil Ringle et al. (19
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6 Leslie G. Cecil The main architec
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8 Leslie G. Cecil can study “the
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10 Leslie G. Cecil Middleton et al.
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12 Leslie G. Cecil The laser ablate
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16 Leslie G. Cecil distinct recipes
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18 Leslie G. Cecil second group (Fi
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20 Leslie G. Cecil The Vitzil-Orang
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22 Leslie G. Cecil Table 3. Mahalan
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24 Leslie G. Cecil Ixlú and Ch’i
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26 Leslie G. Cecil structures (D. R
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28 Leslie G. Cecil paste and Macanc
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32 Leslie G. Cecil Kepecs, S. M., a
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34 Leslie G. Cecil Schele, L., Grub
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36 Z. C. Li, Z. J. Pei and C. Tread
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62 I, % 100 80 60 40 20 0 T. T. Bas
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70 Fluorescence, a.u. 1 0.1 0.01 0.
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78 k, cm -1 20 18 16 14 12 10 8 6 4
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82 Photon counts 300 250 200 150 10
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84 Fluorescence, a.u. I transfer ,
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88 Fluorescence, a.u. I transfer ,
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In: Developments in Ceramic Materia
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Synthesis, Spectroscopic and Magnet
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a c Synthesis, Spectroscopic and Ma
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Transmission Transmission Transmiss
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Sm (J/Kmol) Sm (J/Kmol) 15 10 5 Syn
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IACC ( τ ) = t2 ∫ The Use of Cer
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where σ res is the scattering cros
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D50 0.8 0.7 0.6 0.5 0.4 0.3 The Use
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Definition (D50) 1 0.95 0.9 0.85 0.
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Modeling of Thermal Transport in Ce
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time, vii, ix, 1, 3, 7, 8, 11, 26,
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