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Developments in Ceramic Materials Research

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250<br />

Li Chen<br />

Figure 3. Vertical sidewall formed <strong>in</strong> SiO 2 cavity after anisotropy dry etch<strong>in</strong>g.<br />

Figure 4. Clean back cathode contact revealed <strong>in</strong>side the SiO 2 cavity.<br />

The ceramic samples were re-loaded back <strong>in</strong>to the electron beam evaporation system.<br />

When a base pressure and a specific elevated temperature of the system were reached, an<br />

alum<strong>in</strong>ium part<strong>in</strong>g layer was deposited on the gate molybdenum layer. This was achieved by<br />

rotat<strong>in</strong>g the sample holders at a slant angle with respect to the evaporation alum<strong>in</strong>ium source,<br />

while the alum<strong>in</strong>ium evaporation process was tak<strong>in</strong>g place. The reasons for tilt<strong>in</strong>g the sample<br />

holders and keep them rotat<strong>in</strong>g dur<strong>in</strong>g the process are for the follow<strong>in</strong>g purposes. First, it<br />

prevents the alum<strong>in</strong>ium evaporant from deposit<strong>in</strong>g onto the back contact electrode layer<br />

through the cavity open<strong>in</strong>gs previously formed; second, it will produce smaller alum<strong>in</strong>ium<br />

apertures than the gate holes underneath, which is useful for the follow<strong>in</strong>g metal lift-off

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