Developments in Ceramic Materials Research

More documents

Recommendations

Info

250 Li Chen Figure 3. Vertical sidewall formed in SiO 2 cavity after anisotropy dry etching. Figure 4. Clean back cathode contact revealed inside the SiO 2 cavity. The ceramic samples were re-loaded back into the electron beam evaporation system. When a base pressure and a specific elevated temperature of the system were reached, an aluminium parting layer was deposited on the gate molybdenum layer. This was achieved by rotating the sample holders at a slant angle with respect to the evaporation aluminium source, while the aluminium evaporation process was taking place. The reasons for tilting the sample holders and keep them rotating during the process are for the following purposes. First, it prevents the aluminium evaporant from depositing onto the back contact electrode layer through the cavity openings previously formed; second, it will produce smaller aluminium apertures than the gate holes underneath, which is useful for the following metal lift-off
Field Emission Display on Ceramic 251 process. The thickness of this buffered aluminium layer was around 0.2 µm. The sample holders were turned back to their normal position after the aluminium deposition process. The molybdenum micro cone forming process is the key process to produce the micro field emitters. Sample holders were rotating as satellites around their orbit centre, from which the molybdenum evaporation source was located 600 mm below; the sample holders were also spinning on their own axis during the deposition process so as to form cone structures inside the gate cavities. Radiation energy transmitted from the halogen lamp heaters to the ceramic samples during the deposition was in an attempt to release the stress building up upon the deposited film. In order to fully form conical shape, the thickness of molybdenum film was monitored during the process to be just beyond an empirical value. Over dose deposition of molybdenum not only leads to material wasted unnecessarily, but also increases the risk of a thin film peeling, which is due to an extensive stress built in a thick molybdenum film. A SEM photograph shows a cross section of a molybdenum cone tip after deposition process in the Figure 5. The final photo lithography process to pattern the top molybdenum film into opening windows is designed for the lift-off process. The mask aligner was re-used here for this lithography patterning. Followed the lithography and photo resist developing process, a wet etching method was employed to etch away the molybdenum down to the aluminium layer through the photo resist mask opening windows. The lift off process was performed in a fresh NaOH solution to dissolve the aluminium buffer layer, and thus lifting materials above. The entire fabrication process ended with nitrogen blow-dry of the samples. Figure 6 shows an array of the micro field emitters after the entire fabrication processes. The emitter tips with gate structures are evenly distributed. Figure 5. Micro cone tip formed after molybdenum deposition. Vertical crystallized molybdenum film on the top layer and larger grain structure with irregular shape ceramic substrate in the low layer are visible.
Page 3:
DEVELOPMENTS IN CERAMIC MATERIALS R
Page 6 and 7:
Copyright © 2007 by Nova Science P
Page 9 and 10:
PREFACE Ceramics are refractory, in
Page 11 and 12:
Preface ix crystals is discussed. A
Page 13:
Preface xi spectra and the directio
Page 16 and 17:
2 Leslie G. Cecil comprehensive dat
Page 18 and 19:
4 Leslie G. Cecil Ringle et al. (19
Page 20 and 21:
6 Leslie G. Cecil The main architec
Page 22 and 23:
8 Leslie G. Cecil can study “the
Page 24 and 25:
10 Leslie G. Cecil Middleton et al.
Page 26 and 27:
12 Leslie G. Cecil The laser ablate
Page 28 and 29:
14 Leslie G. Cecil There are two ge
Page 30 and 31:
16 Leslie G. Cecil distinct recipes
Page 32 and 33:
18 Leslie G. Cecil second group (Fi
Page 34 and 35:
20 Leslie G. Cecil The Vitzil-Orang
Page 36 and 37:
22 Leslie G. Cecil Table 3. Mahalan
Page 38 and 39:
24 Leslie G. Cecil Ixlú and Ch’i
Page 40 and 41:
26 Leslie G. Cecil structures (D. R
Page 42 and 43:
28 Leslie G. Cecil paste and Macanc
Page 44 and 45:
30 Leslie G. Cecil Bieber, A. M. Jr
Page 46 and 47:
32 Leslie G. Cecil Kepecs, S. M., a
Page 48 and 49:
34 Leslie G. Cecil Schele, L., Grub
Page 50 and 51:
36 Z. C. Li, Z. J. Pei and C. Tread
Page 52 and 53:
Page 54 and 55:
Page 56 and 57:
Page 58 and 59:
Page 60 and 61:
Page 62 and 63:
Page 64 and 65:
Page 66 and 67:
Page 68 and 69:
54 T. T. Basiev, V. A. Demidenko, K
Page 70 and 71:
Page 72 and 73:
Page 74 and 75:
Page 76 and 77:
62 I, % 100 80 60 40 20 0 T. T. Bas
Page 78 and 79:
Page 80 and 81:
Page 82 and 83:
68 Fluorescence, a.u. 1 T. T. Basie
Page 84 and 85:
70 Fluorescence, a.u. 1 0.1 0.01 0.
Page 86 and 87:
Page 88 and 89:
Page 90 and 91:
Page 92 and 93:
78 k, cm -1 20 18 16 14 12 10 8 6 4
Page 94 and 95:
Page 96 and 97:
82 Photon counts 300 250 200 150 10
Page 98 and 99:
84 Fluorescence, a.u. I transfer ,
Page 100 and 101:
86 ln(I transfer (t)) -4.2 -4.4 -4.
Page 102 and 103:
88 Fluorescence, a.u. I transfer ,
Page 104 and 105:
Page 106 and 107:
Page 108 and 109:
Page 111 and 112:
In: Developments in Ceramic Materia
Page 113 and 114:
Synthesis, Spectroscopic and Magnet
Page 115 and 116:
a c Synthesis, Spectroscopic and Ma
Page 117 and 118:
Page 119 and 120:
Transmission Transmission Transmiss
Page 121 and 122:
Page 123 and 124:
Page 125 and 126:
Page 127 and 128:
Page 129 and 130:
Page 131 and 132:
Page 133 and 134:
Page 135 and 136:
Page 137 and 138:
Sm (J/Kmol) Sm (J/Kmol) 15 10 5 Syn
Page 139 and 140:
Page 141 and 142:
Page 143 and 144:
Page 145 and 146:
Intensity (a.u.) Intensity (a.u.) 8
Page 147 and 148:
Page 149 and 150:
Page 151 and 152:
Page 153 and 154:
Page 155 and 156:
Page 157 and 158:
The Use of Ceramic Pots in Old Wors
Page 159 and 160:
Page 161 and 162:
Page 163 and 164:
3.2. Wall-in Positions The Use of C
Page 165 and 166:
Page 167 and 168:
Page 169 and 170:
Page 171 and 172:
IACC ( τ ) = t2 ∫ The Use of Cer
Page 173 and 174:
Page 175 and 176:
where σ res is the scattering cros
Page 177 and 178:
Page 179 and 180:
D50 0.8 0.7 0.6 0.5 0.4 0.3 The Use
Page 181 and 182:
Definition (D50) 1 0.95 0.9 0.85 0.
Page 183 and 184:
Page 185 and 186:
Page 187 and 188:
Page 189 and 190:
Modeling of Thermal Transport in Ce
Page 191 and 192:
Page 193 and 194:
Page 195 and 196:
Page 197 and 198:
Page 199 and 200:
Page 201 and 202:
Page 203 and 204:
Page 205 and 206:
q x = Modeling of Thermal Transport
Page 207 and 208:
Page 209 and 210:
Page 211 and 212:
Page 213 and 214: Modeling of Thermal Transport in Ce
Page 223: Modeling of Thermal Transport in Ce
Page 226 and 227: 212 R. Ramesh, H. Kara, Ron Stevens
Page 234 and 235: 220 ε S 33 R. Ramesh, H. Kara, Ron
Page 256 and 257: 242 Development of Display Technolo
Page 258 and 259: 244 Li Chen technology moved to the
Page 260 and 261: 246 Li Chen The continuing evolutio
Page 262 and 263: 248 Li Chen the back contact cathod
Page 266 and 267: 252 Li Chen Figure 6. Molybdenum mi
Page 268 and 269: 254 Li Chen Figure 8(a). I-V curve
Page 270 and 271: 256 Li Chen Figure 9. Life time tes
Page 272 and 273: 258 Figure 11(a). Plasma generated
Page 274 and 275: 260 Li Chen [13] C.A. Spindt, K.R.
Page 276 and 277: 262 S. Ardizzone, C. L. Bianchi, G.
Page 295 and 296: A absorption spectra, 66, 67, 77, 7
Page 297 and 298: correlation function, 156 corrosion
Page 299 and 300: group membership, 13, 20, 21, 22, 2
Page 301 and 302: microstructure(s), x, xi, 73, 74, 2
Page 303 and 304: efraction index, 61 refractive inde
Page 305 and 306: time, vii, ix, 1, 3, 7, 8, 11, 26,
show all

Developments in Ceramic Materials Research

Create successful ePaper yourself

Delete template?

Save as template?