Third Day Poster Session, 17 June 2010 - NanoTR-VI

Poster Session, Thursday, June 17
Theme F686 - N1123
Hexagonal Boron Nitride (h-BN)/Polyimide Hybrid Films
Canan Kızılkaya * , Yusuf Mülazim, M.Vezir Kahraman, Nilhan Kayaman Apohan, Atilla Güngör
Marmara University, Department of Chemistry 34722 Istanbul/Turkey
Abstract - Polyimide (PI)/hexagonal boron nitride (h-BN) hybrid materials were prepared from a polyimide precursor
and functionalized h-BN with a silane coupling agent by thermal imidization technique. Their surface morphologies,
structures and thermal performances were determined. The thermal characteristics of PI/ h-BN hybrid films were found
to be better than the polyimide without h-BN.
Aromatic polyimide films have aroused a great deal of
interest as one of the attractive precursors for producing
carbon and graphite films in recent years. Compared with
most organic polymeric materials, PI exhibits superior
thermal stability and mechanical strength. Therefore, a
large number of PI compositions have been extensively
investigated and most of them are well-suited for use as
matrix resins, adhesives, and coatings for highperformance
applications in the aerospace, electric, and
micro-electronic industries [1,2].
Boron nitride is a ceramic material that is isoelectronic
with carbon. Much like carbon, it exists in multiple
allotropic forms. The most common structure of boron
nitride is the hexagonal form (h-BN). Hexagonal boron
nitride has a graphite-like structure with strong bonding
within the planar, fused, six-membered rings and weak van
der waals bonding in-between layers. Along the c-axis for
h-BN, boron and nitrogen atoms are stacked above each
other in alternating layers [ 3]. Because of its properties, it
has found uses in heat conductivity applications, electrical
insulation applications, corrosion resistance applications,
lubrication applications, personal care applications, and as
a plastic additive [4].
In the present study, Polyimide (PI)/hexagonal boron
nitride (h-BN) hybrid materials were prepared from a
polyamic acid as a polyimide precursor and modified h-
BN with a silane coupling agent. Aminoalkoxysilane is
one of the most widely adopted silane coupling agents for
the modification of various oxide surfaces. This agent,
uses for surface treatment of the filler to improve the
affinity between filler and matrix, thereby significantly
increasing the thermal properties of the composite. In
silane acts as a bridge to connect the ceramic filler and the
polymer matrix together, because it has two different
chemical structures at the two ends of the molecule. The
morphological, mechanical, and thermal properties of the
polyimide hybrid films with different h-BN content were
characterized.
In conclusion, h-BN containing PI hybrid materials were
prepared. ATR-FTIR study indicates that the inorganic
network had formed during imidization. The
morphological study proved that the h-BN particles in the
polyimide matrix is dispersed homogeneously. The
thermal stability of the hybrid materials improved with the
increasing amount of h-BN in the compositions. The
Limiting Oxygen Index results increased from 32.0 to
42.6. The h-BN containing hybrid materials show fire
resistance than the pure polyimide. The mechanical
properties show that the polyimides/h-BN hybrid materials
are hard and brittle compared with pure polyimide. The
solvent and chemical resistance experiments for all
materials show good performance.
Figure 1: SEM Micrographs of PI/h-BN 0.5
*Corresponding author: ckizilkaya@gmail.com
[1] C.Kızılkaya ,S. Karataş , N. K. Apohan , A. Güngör, Journal
of Applied Polymer Science, 115, 3256-3264, (2010).
[2] S Karatas, N.K. Apohan, H. Demirer, A. Gungor Polym.
Adv. Technol., 18,490–496 (2007)
[3] M.T. Huang, H. Ishida, Surf. Interface Anal.,37, 621–627
(2005).
[4] J. Eichler, C. Lesniak, J European Ceramic Society, 28,1105–
1109, ( 2008).
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6th Nanoscience and Nanotechnology Conference, zmir, 2010 706