Photonic crystals in biology
Photonic crystals in biology
Photonic crystals in biology
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Poster Session, Tuesday, June 15<br />
Theme A1 - B702<br />
Temperature and thickness dependence of the gra<strong>in</strong> boundary s catter<strong>in</strong>g of the Ni-Si Silicide Films<br />
Formed at 500 C by Rapid Thermal Anneal<strong>in</strong>g of the Ni/Si Films<br />
G. Utlu 1 *, N.Artunç 1 S.Selvi 1<br />
1 Department of Physics, Ege University, 00, Turkey<br />
Abstract-In this study, Ni-Si silicide films with 18-290 nm thicknesses are studied as a function of temperature and film thickness over the<br />
temperature range of 100-900 °K. The most strik<strong>in</strong>g behavior is that the variation of the resistivity of the Ni-Si silicide films with temperature<br />
exhibits an unusual temperature-dependent behavior with respect to those of the transition and un-transition metals. We have also shown t hat <strong>in</strong><br />
the temperature range of (100-Tm) °K paralel-resistor formula is reduced to Matthiessen’s rule and D Debye temperature is <strong>in</strong>dependent of the<br />
temperature for a given thickness range, whereas at high temperatures it <strong>in</strong>creases slightly with thickness. We have found that for the<br />
temperature range of (100-Tm) °K, l<strong>in</strong>eer variation of the resistivity of the Ni-Si silicide films with temperature is caused from both the gra<strong>in</strong>boundary<br />
scatter<strong>in</strong>g and electron-phonon scatter<strong>in</strong>g and resistivity data could be analyzed very well <strong>in</strong> terms of the Mayadas-Schatzkes (M-S)<br />
model.<br />
In recent years silicides, <strong>in</strong>termetallic co mpounds of silicon<br />
and transition metals, have received much attention because of<br />
their wide application <strong>in</strong> very large-scale <strong>in</strong>tegrated circuits<br />
(VLSI) and ultra large-scale <strong>in</strong>tegrated circuits (ULSI) [1-3].<br />
Because they show metallic behavior with low electrical<br />
resistivity, high electro-migration resistance, high thermal<br />
stability and resistance to acids [1, 4]. Due to these properties,<br />
they have been proposed as candidates for replac<strong>in</strong>g alum<strong>in</strong>um<br />
alloys for applications <strong>in</strong> microelectronics [3-5].Metal silicides<br />
can be synthesized by various techniques, e.g. solid-state<br />
reaction of th<strong>in</strong> metal films deposited on Si wafer, explosive<br />
silicidation, react ive deposition, and ion implantation [6-9]<br />
In this study, the first aim is to deposit Ni th<strong>in</strong> films, with<br />
thicknesses of 7.0 –89 nm, onto n-type Si(100) substrate by<br />
thermal evaporation technique, and then to anneal these Ni /Si<br />
bilayers by rapid thermal anneal<strong>in</strong>g (RTA) process for 60 s at<br />
500 C, so as to synthesize NiSi (n ickel mono-silicide) silicide<br />
films by solid-state reaction technique. The second aim is to<br />
<strong>in</strong>vestigate the temperature dependence of the electrical<br />
resistivity of Ni-Si silicides over the temperature range 100-<br />
900 °K. And the f<strong>in</strong>al aim is to analyze the resistivity data of<br />
Ni-Si silicides <strong>in</strong> terms of the M-S gra<strong>in</strong> boundary scatter<strong>in</strong>g<br />
model, and calculate the R reflection coefficient of the films.<br />
The correlation of Ni–Si silicide formation with its electrical<br />
and morphological properties is also established.<br />
The temperature-dependent resistivity measurements of our<br />
Ni-Si silicide films with thickness of 18-290 nm are studied as<br />
a function of temperature and film thickness over the<br />
temperature range of 100-900 °K. The most strik<strong>in</strong>g behavior<br />
is that the variation of the resistivity of the Ni-Si silicide films<br />
with temperature exhibits an unusual temperature-dependent<br />
behavior with respect to those of the transition and untransition<br />
metals. Our measurements show that the total<br />
resistivity of the Ni-Si silicide films <strong>in</strong>creases l<strong>in</strong>early with<br />
temperature up to a Tm temperature, at which resistivity<br />
reaches a maximum, thereafter Tm it decreases rapidly and<br />
f<strong>in</strong>ally is zero at 800 °K. Moreover, <strong>in</strong> this study, Tm<br />
temperature is found to decreases with both decreas<strong>in</strong>g film<br />
thickness and anneal<strong>in</strong>g temperature / or Si concentration and<br />
to shift from 610 °K to 490 °K with decreas<strong>in</strong>g film thickness<br />
from 290 to 18 nm, correspond<strong>in</strong>g to <strong>in</strong>creased concentration<br />
of Si <strong>in</strong> the lattice.<br />
Paralel–rezistör formula uses for analys<strong>in</strong>g of the<br />
temperature dependent resistivity datas for several th<strong>in</strong> film<br />
and metal silicid film <strong>in</strong> a wide temperature range (4-1000) °K<br />
[10-13]. We have shown that <strong>in</strong> the temperature range of<br />
(100-Tm) °K paralel-resistor formula is reduced to<br />
Matthiessen’s rule and D Debye temperature is <strong>in</strong>dependent<br />
of the temperature for a given thickness range, whereas at high<br />
temperatures it <strong>in</strong>creases slightly with thickness. D Debye<br />
temperature are found to be about 400-430 K for all the Ni-Si<br />
films.<br />
We have also shown that for the temperature range of (100-<br />
Tm) °K, l<strong>in</strong>eer variation of the resistivity of the Ni-Si silicide<br />
films with temperature is caused from both the gra<strong>in</strong>-boundary<br />
scatter<strong>in</strong>g and electron-phonon scatter<strong>in</strong>g and resistivity data<br />
could be analyzed very well <strong>in</strong> terms of the Mayadas-<br />
Schatzkes(M-S)model. Theoretical and experimental values of<br />
Reflection coefficients are calculated by analyz<strong>in</strong>g resistivity<br />
data us<strong>in</strong>g M-S model and f.d =f(d) plots respectively.<br />
Accord<strong>in</strong>g to our analysis, for a given temperature R <strong>in</strong>creases<br />
with decreas<strong>in</strong>g film thickness, whereas it is almost constant<br />
over a thickness range of 200-67 nm and 47-18 nm, for which<br />
silicide films have almost same phases. For room temperature<br />
(T=295 °K) the average values of theoretical and experimental<br />
reflection coefficient are calculated to be R th = 0.44, R th = 0.66<br />
and R exp = 0.46, R exp = 0.67 by tak<strong>in</strong>g an average over the<br />
thickness ranges of 200-67 nm and 47-18 nm respectively.<br />
Accord<strong>in</strong>g to our XRD, RBS and SEM measurements for the<br />
thickness of 200-67 n m Ni, Ni 3 Si and NiSi silicide phases<br />
coexist, while NiSi and Si-rich silicide phases are present over<br />
the range of 47-18 nm. This phase transformation with<br />
decreas<strong>in</strong>g film thickness should be responsible for the<br />
<strong>in</strong>crease observed <strong>in</strong> the values of both R reflection coefficient<br />
(or the gra<strong>in</strong> boundary resistivity) and total resistivity of all<br />
the Ni-Si silicide films.<br />
Correspond<strong>in</strong>g author: gokhan.utlu@ege.edu.tr<br />
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[2] M.A. Nicolet, S.S.Lau, <strong>in</strong>: N.G. E<strong>in</strong>spruch (Ed.),<br />
VLSI Electronic Microstructures Science,6,Academic pres, New York,(1983).<br />
[3] Y. Hu and S. P. Tay, J. Vac. Sci. Technol. A 16, 1820 (1998).<br />
[4] A.H. Reader et al, Rep.Prog. Phys. 56 1397 (1992).<br />
[5] J.P. Gamb<strong>in</strong>o, E.G. Colgan, Mater. Chem. Phys. 52, 99 (1998).<br />
[6] B.A. Julies et al, Th<strong>in</strong> Solid Films, 347,201 (1999).<br />
[7] S. Abhaya et al, Appl. Surf. Sci. 253,3799 (2007).<br />
[8] L.A Clevenger, C.V. Thomson, K.N. Tu, J. Appl. Phys. 67 (1990) 2894.<br />
[9] Gi Bum Kim et al, J. Vac. Sci. Technol.B 21, 1319 (2003).<br />
[10] M. Gurvitch, Physical Review B, 24, 7404 (1981).<br />
[11] M.Milewits et al, Physical Review B, 13, 5199 (1976).<br />
[12] F. Nava and K.N. Tu, Journal of Applied Physics, 61, 1085 (1987).<br />
[13] F. Nava, K.N. Tu, O. Thomas, J.P. Senateur, R. Madar, A. Borghesi, G.<br />
Guizzetti and O. BiSi, Materials Science Reports, 9, 141 (1993).<br />
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