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172 Appendix B. Site Reports—Europe stamps to transfer a pattern of self-assembling molecular layers to a substrate. The project he described encompasses both the science and pretechnology assessments of various high-resolution contact processing techniques like microcontact printing and microfluidic networks. The group has demonstrated the use of microfluidic networks for delivery of functionally distinct biomolecules onto targeted regions of a substrate and their application in localized biological assays. Stamps of very high quality and stability have been developed, and critical dimensions smaller than 50 nm have been achieved with microcontact printing. Wanda Andreoni described the activities in computational materials science and the application of ab initio (Car-Parrinello) molecular dynamics techniques to various problems in science and technology, e.g., fullerenes, carbon nanotubes, and organic light-emitting structures for displays, catalysis, and chemical reactions. Some of this work is in direct support of ongoing local projects.
Appendix B. Site Reports—Europe 173 Site: Interuniversity Microelectronics Center (IMEC) Kapeldreef 75 B-3001 Leuven, Belgium Tel: (32) 16-281211; Fax (32) 16-229400 http://www.imec.be/ Date Visited: 16 October 1997 WTEC: Hosts: E. Hu (report author) Dr. Marc Van Rossum, Head VLSI Materials and Technologies, Advanced Semiconductor Processing Div. Dr. John Randall, TI on assignment to IMEC Dr. Wijm Magnus, PHANTOMS coordinator Dr. Chris Van Hoof, Senior Researcher, Materials and Packaging Division Dr. Jan Genoe, software specialist – 8-band solver Dr. Jo deBoeck, Senior Researcher, Novel Materials and Components Group BACKGROUND IMEC (Interuniversity Microelectronics Center) was begun in 1984 by the Flanders government to strengthen the potential of Flemish universities and to strengthen the infrastructure in microelectronics. The general mission of IMEC is to strengthen local industry, set up new industry, and attract new industry by carrying out advanced, focused research. Initially, the lead-time on industrial technology was estimated to be five to ten years; actual operation has led to carrying out projects in the nearer-term future (3-10 years, or even under 3 years). The initial investment was ~ $80 million and 150 people. Currently, IMEC has >700 people, 100 of whom are nonpayroll (industrial participants, students with grants), and a >$80 million budget, of which ~ 50% derives from the government, and 50% is contract research. RESEARCH AND DEVELOPMENT HIGHLIGHTS The WTEC team’s host at IMEC was Dr. Marc Van Rossum, the Head of VLSI Materials and Technologies in the Advanced Semiconductor Processing Division. He spoke of three main areas of research being carried
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National Science and Technology Cou
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WTEC Panel on NANOSTRUCTURE SCIENCE
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ABSTRACT This report reviews the st
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Foreword Timely information on scie
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Foreword iii collaboration and thus
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Contents Foreword Table of Contents
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List of Figures 1.1 Organization of
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List of Figures ix 5.12 Granular GM
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List of Tables ES.1 Technological I
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Executive Summary Richard W. Siegel
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Executive Summary xix past decade,
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Executive Summary xxi TABLE ES.2. C
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Executive Summary xxiii blocks, and
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Chapter 1 Introduction and Overview
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1. Introduction and Overview 3 •
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1. Introduction and Overview 5 worl
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1. Introduction and Overview 7 grow
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1. Introduction and Overview 9 lead
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1. Introduction and Overview 11 2.
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1. Introduction and Overview 13 It
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Chapter 2 Synthesis and Assembly Ev
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2. Synthesis and Assembly 17 transi
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2. Synthesis and Assembly 19 probe
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2. Synthesis and Assembly 21 by adj
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2. Synthesis and Assembly 23 blocks
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2. Synthesis and Assembly 25 Self-A
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2. Synthesis and Assembly 27 Figure
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2. Synthesis and Assembly 29 us to
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2. Synthesis and Assembly 31 Brotzm
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2. Synthesis and Assembly 33 Siegel
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Chapter 3 Dispersions and Coatings
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3. Dispersions and Coatings 37 exis
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3. Dispersions and Coatings 39 more
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3. Dispersions and Coatings 41 into
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3. Dispersions and Coatings 45 oppo
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3. Dispersions and Coatings 47 Kanz
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Chapter 4 High Surface Area Materia
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4. High Surface Area Materials 51 w
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4. High Surface Area Materials 53 F
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4. High Surface Area Materials 55 T
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4. High Surface Area Materials 57 s
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4. High Surface Area Materials 59 T
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4. High Surface Area Materials 61 F
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4. High Surface Area Materials 63 m
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4. High Surface Area Materials 65 I
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Chapter 5 Functional Nanoscale Devi
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5. Functional Nanoscale Devices 69
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Chapter 6 Bulk Behavior of Nanostru
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6. Bulk Behavior of Nanostructured
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Chapter 7 Biologically Related Aspe
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7. Biologically Related Aspects of
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Page 177 and 178: APPENDICES Appendix A. Biographies
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Appendix D. Site Reports—Japan OV
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Appendix F. Glossary 2DEG A/D AAAR
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Appendix F. Glossary 329 ESPRIT ESR
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Appendix F. Glossary 331 MA MBE mCP
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Appendix F. Glossary 333 PVDF QCA Q
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Appendix F. Glossary 335 WTEC XAS X
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