Nanostructure Science and Technology - World Technology ...

More documents

Recommendations

Info

306 Appendix D. Site Reports—Japan Site: ULVAC Japan, Ltd. Vacuum Metallurgical Company (VMC) 516 Yokota, Sanbu-cho, Sanbu-gun Chiba 289-12, Japan Fax: (81) 467-87 3383 Date Visited: 23 July 1997 WTEC: Hosts: D. Shaw (report author), C. Koch, R.W. Siegel, C. Uyehara Dr. Chikara Hayashi Dr. Masaaki Oda BACKGROUND The Vacuum Metallurgical Company (VMC) is a subsidiary of ULVAC Japan, Ltd., which is a relatively large conglomerate of 30 companies employing over 3,500 people. The principal products of VMC include sputtering targets; complex shaped Ti-alloy cast parts; reactive and refractory metal sheet, wire, and shapes; and service coating for processing equipment for semiconductors, display panels, etc. VMC’s ultrafine-particle (UFP) business is based on early work by Dr. Hayashi and colleagues on gas-phase particle nucleation (evaporation and condensation) and deposition by using nanoparticles dispersed in tiny gas jets (in the 10 micron diameter range). VMC commercialized magnetic UFP in 1971, and Dr. Hayashi (at the time, president of ULVAC) served as the leader of a UFP project in Japan’s Exploratory Research in Advanced Technology (ERATO) program from 1981-1986. ERATO has been supported by the now renamed government organization, Japan Science and Technology Corporation (JST). The UFP project investigated the physical, chemical, and biological properties of nanoparticles. Over the years, VMC has improved the magnetic UFP technique and now offers a large quantity of metallic and organic particles; gas-evaporation and gas-deposition equipment for producing fine pattern of contacts and conductive lines for electronic devices; and UFP paste (dispersed liquid) with coating system. RESEARCH AND DEVELOPMENT HIGHLIGHTS Although the basic design of the induction-heating chamber for the ultrafine-particle generation was developed by Hayashi and Oda in the
Appendix D. Site Reports—Japan 307 1970s, the performance of the chamber has been steadily improved through a series of government-subsidized R&D programs at VMC. At present, there is an impressive list of UFPs that are produced in large scales under reasonably controlled conditions. These include chain-aggregate ferromagnetic UFPs, metallic (e.g., Au, Ag, Cu, Pd, Ni, Al, Sn, etc.) isolated UFPs, and coated UFPs (e.g., ZnO-coated Cu and polymer-coated Fe). These particles are used for the formation of thick films for various applications, including electronics, optics, etc. Application fields presently being pursued by VMC are shown in Table D.1. CONCLUDING REMARKS VMC is in many ways similar to Nanophase Technologies Corporation in the United States. They both use the principle of gas-phase condensation for particle generation. Both are market-driven companies that try to break into various new markets. Thus, their targeted markets, as shown in Table D.1, are very similar. At the present time, the UFP revenue for VMC is about $4 million. Dr. Hayashi indicated that he hopes to increase the UFP business in VMC to about $10 million in two or three years. TABLE D.1. UFP Applications and Processes at VMC Applications Coating Methods Effects ELECTRONICS Metalizing of ceramic parts (Eliminating electric discharge) Formation of electrodes of chip condensers Formation of test circuits Repairing of electric circuit of LCDs or PDPs Formation of electric circuits Dipping or printing Dipping Drawing with a microdispenser Repainting with a microdispenser Screen printing Reduce processes and materials (replacing vacuum deposition) Decrease firing temperature OPTICS Coating of infrared reflectors Dipping Reduce processes Coating of laser reflectors Repairing of reflectors ARTS Decoration of ceramics or glass utensils Pad painting Reduce processes, decrease firing temperature Coating of accessories Dipping Replace electroplating Replacing of gold leaf Spraying Reduce processes
Page 1 and 2:
National Science and Technology Cou
Page 3 and 4:
WTEC Panel on NANOSTRUCTURE SCIENCE
Page 5 and 6:
ABSTRACT This report reviews the st
Page 7 and 8:
Foreword Timely information on scie
Page 9 and 10:
Foreword iii collaboration and thus
Page 11 and 12:
Contents Foreword Table of Contents
Page 13 and 14:
List of Figures 1.1 Organization of
Page 15 and 16:
List of Figures ix 5.12 Granular GM
Page 17 and 18:
List of Tables ES.1 Technological I
Page 19 and 20:
Executive Summary Richard W. Siegel
Page 21 and 22:
Executive Summary xix past decade,
Page 23 and 24:
Executive Summary xxi TABLE ES.2. C
Page 25 and 26:
Executive Summary xxiii blocks, and
Page 27 and 28:
Chapter 1 Introduction and Overview
Page 29 and 30:
1. Introduction and Overview 3 •
Page 31 and 32:
1. Introduction and Overview 5 worl
Page 33 and 34:
1. Introduction and Overview 7 grow
Page 35 and 36:
1. Introduction and Overview 9 lead
Page 37 and 38:
1. Introduction and Overview 11 2.
Page 39 and 40:
1. Introduction and Overview 13 It
Page 41 and 42:
Chapter 2 Synthesis and Assembly Ev
Page 43 and 44:
2. Synthesis and Assembly 17 transi
Page 45 and 46:
2. Synthesis and Assembly 19 probe
Page 47 and 48:
2. Synthesis and Assembly 21 by adj
Page 49 and 50:
2. Synthesis and Assembly 23 blocks
Page 51 and 52:
2. Synthesis and Assembly 25 Self-A
Page 53 and 54:
2. Synthesis and Assembly 27 Figure
Page 55 and 56:
2. Synthesis and Assembly 29 us to
Page 57 and 58:
2. Synthesis and Assembly 31 Brotzm
Page 59 and 60:
2. Synthesis and Assembly 33 Siegel
Page 61 and 62:
Chapter 3 Dispersions and Coatings
Page 63 and 64:
3. Dispersions and Coatings 37 exis
Page 65 and 66:
3. Dispersions and Coatings 39 more
Page 67 and 68:
3. Dispersions and Coatings 41 into
Page 69 and 70:
3. Dispersions and Coatings 43 of N
Page 71 and 72:
3. Dispersions and Coatings 45 oppo
Page 73 and 74:
3. Dispersions and Coatings 47 Kanz
Page 75 and 76:
Chapter 4 High Surface Area Materia
Page 77 and 78:
4. High Surface Area Materials 51 w
Page 79 and 80:
4. High Surface Area Materials 53 F
Page 81 and 82:
4. High Surface Area Materials 55 T
Page 83 and 84:
4. High Surface Area Materials 57 s
Page 85 and 86:
4. High Surface Area Materials 59 T
Page 87 and 88:
4. High Surface Area Materials 61 F
Page 89 and 90:
4. High Surface Area Materials 63 m
Page 91 and 92:
4. High Surface Area Materials 65 I
Page 93 and 94:
Chapter 5 Functional Nanoscale Devi
Page 95 and 96:
5. Functional Nanoscale Devices 69
Page 97 and 98:
Page 99 and 100:
Page 101 and 102:
Page 103 and 104:
Page 105 and 106:
Page 107 and 108:
Page 109 and 110:
Page 111 and 112:
Page 113 and 114:
Page 115 and 116:
Page 117 and 118:
Page 119 and 120:
Chapter 6 Bulk Behavior of Nanostru
Page 121 and 122:
6. Bulk Behavior of Nanostructured
Page 123 and 124:
Page 125 and 126:
Page 127 and 128:
Page 129 and 130:
Page 131 and 132:
Page 133 and 134:
Page 135 and 136:
Page 137 and 138:
Page 139 and 140:
Chapter 7 Biologically Related Aspe
Page 141 and 142:
7. Biologically Related Aspects of
Page 143 and 144:
Page 145 and 146:
Page 147 and 148:
Page 149 and 150:
Page 151 and 152:
Page 153 and 154:
Page 155 and 156:
Page 157 and 158:
Chapter 8 Research Programs on Nano
Page 159 and 160:
8. Research Programs on Nanotechnol
Page 161 and 162:
Page 163 and 164:
Page 165 and 166:
Page 167 and 168:
Page 169 and 170:
Page 171 and 172:
Page 173 and 174:
Page 175 and 176:
Page 177 and 178:
APPENDICES Appendix A. Biographies
Page 179 and 180:
Appendix A. Biographies of Panelist
Page 181 and 182:
Page 183 and 184:
Page 185 and 186:
Appendix B. Site Reports—Europe S
Page 187 and 188:
Appendix B. Site Reports—Europe 1
Page 189 and 190:
Page 191 and 192:
Page 193 and 194:
Page 195 and 196:
Page 197 and 198:
Page 199 and 200:
Page 201 and 202:
Page 203 and 204:
Page 205 and 206:
Page 207 and 208:
Page 209 and 210:
Page 211 and 212:
Page 213 and 214:
Page 215 and 216:
Page 217 and 218:
Page 219 and 220:
Page 221 and 222:
Page 223 and 224:
Page 225 and 226:
Page 227 and 228:
Page 229 and 230:
Page 231 and 232:
Page 233 and 234:
Page 235 and 236:
Page 237 and 238:
Page 239 and 240:
Page 241 and 242:
Page 243 and 244:
Page 245 and 246:
Page 247 and 248:
Appendix C. European Roundtable Dis
Page 249 and 250:
Page 251 and 252:
Page 253 and 254:
Page 255 and 256:
Page 257 and 258:
Page 259 and 260:
Page 261 and 262:
Page 263 and 264:
Page 265 and 266:
Page 267 and 268:
Page 269 and 270:
Appendix D. Site Reports—Japan OV
Page 271 and 272:
Appendix D. Site Reports—Japan 24
Page 273 and 274:
Page 275 and 276:
Page 277 and 278:
Page 279 and 280:
Page 281 and 282: Appendix D. Site Reports—Japan 25
Page 331: Appendix D. Site Reports—Japan 30
Page 339 and 340: Appendix E. Site Reports—Taiwan O
Page 341 and 342: Appendix E. Site Reports—Taiwan 3
Page 353 and 354: Appendix F. Glossary 2DEG A/D AAAR
Page 355 and 356: Appendix F. Glossary 329 ESPRIT ESR
Page 357 and 358: Appendix F. Glossary 331 MA MBE mCP
Page 359 and 360: Appendix F. Glossary 333 PVDF QCA Q
Page 361 and 362: Appendix F. Glossary 335 WTEC XAS X
show all

Nanostructure Science and Technology - World Technology ...

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?