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330 Appendix F. Glossary HIP HMDS HOPG HP HPHT HPLC HREM HRTEM HT c i.d. IC IC icd IGC IMEC IP IPE IR ISDN ITO I-V JFCC JIM JRCAT JSPS K KOH KTH LCD LCT LCVP LED LIGA LINK LPPCVD LSI LTMC Hot isostatic press Hexamethyl-disilazane Highly oriented pyrolitic graphic (U.S.) Hewlett-Packard High pressure/high temperature High performance liquid chromatography High resolution electron microscope/microscopy High resolution transmission electron microscope (see also HREM) High superconducting transition temperature Inner diameter (France) Institut Curie Integrated circuit internal coordinate dynamics Inert gas condensation (Belgium) Interuniversity MicroElectronics Center Ionization potential (Switzerland) Institute of Experimental Physics at EPFL Infrared Integrated Services Digital Network Indium tin oxide Current-voltage (Japan) Japan Fine Ceramic Center Japanese Institute of Metals (Japan) Joint Research Center for Atom Technology Japan Society for the Promotion of Science Degrees kelvin Potassium hydroxide (Sweden) Royal Institute of Technology Liquid crystal display Liquid crystal templating Laser-induced chemical vapor precipitation Light-emitting diode (German acronym) Lithographie, Galvanoformung, Abformung (U.K.) nanotechnology programme Laser particle precipitation-aided chemical vapor deposition Large scale integration/integrated (circuits) Layered transition metal chalcogenide
Appendix F. Glossary 331 MA MBE mCP MD MEL-ARI MEMS MFM microSQUID MIMIC MITI MOCVD Monbusho MOS MOSFET MOVPE MPI MRAM MR-CI MRI MSC MTJ mTM MWNT NAIR NASA nc NCA NCAP NCCE NDL NEDO NEIMO NEMD NEOME Mechanical alloying Molecular beam epitaxy Microcontact printing Molecular dynamics (Europe, ESPRIT) Microelectronics Advanced Research Initiative Microelectromechanical systems Magnetic force microscopy Micro-superconducting quantum interference device Micromolding in capillaries (Japan) Ministry of International Trade and Industry Metal organic chemical vapor deposition (Japan) Ministry of Education, Science, Sports, and Culture Metal oxide semiconductor Metal oxide semiconductor field-effect transistor Metal organic vapor phase epitaxy (Germany) Max Planck Institute(s) Magnetic random access memory Multireference configuration interaction Magnetic resonance imaging (U.S., California Institute of Technology) Materials and Process Simulation Center Magnetic tunnel junction Microtransfer molding Multiwalled nanotube (Japan) National Institute for Advanced Interdisciplinary Research (U.S.) National Aeronautic and Space Administration Nanocrystalline Nanoparticle chain aggregate Nematic curvilinear aligned phase material (U.S., NSF) National Center for Computational Electronics (Taiwan) National Nano Device Laboratories (Japan) New Energy and Industrial Technology Development Organization Newton-Euler inverse mass operator method for modeling Nonequilibrium molecular dynamics (Switzerland) Network for Excellence on Organic Materials for Electronics
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National Science and Technology Cou
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WTEC Panel on NANOSTRUCTURE SCIENCE
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ABSTRACT This report reviews the st
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Foreword Timely information on scie
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Foreword iii collaboration and thus
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Contents Foreword Table of Contents
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List of Figures 1.1 Organization of
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List of Figures ix 5.12 Granular GM
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List of Tables ES.1 Technological I
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Executive Summary Richard W. Siegel
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Executive Summary xix past decade,
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Executive Summary xxi TABLE ES.2. C
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Executive Summary xxiii blocks, and
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Chapter 1 Introduction and Overview
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1. Introduction and Overview 3 •
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1. Introduction and Overview 5 worl
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1. Introduction and Overview 7 grow
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1. Introduction and Overview 9 lead
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1. Introduction and Overview 11 2.
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1. Introduction and Overview 13 It
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Chapter 2 Synthesis and Assembly Ev
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2. Synthesis and Assembly 17 transi
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2. Synthesis and Assembly 19 probe
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2. Synthesis and Assembly 21 by adj
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2. Synthesis and Assembly 23 blocks
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2. Synthesis and Assembly 25 Self-A
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2. Synthesis and Assembly 27 Figure
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2. Synthesis and Assembly 29 us to
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2. Synthesis and Assembly 31 Brotzm
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2. Synthesis and Assembly 33 Siegel
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Chapter 3 Dispersions and Coatings
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3. Dispersions and Coatings 37 exis
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3. Dispersions and Coatings 39 more
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3. Dispersions and Coatings 41 into
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3. Dispersions and Coatings 43 of N
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3. Dispersions and Coatings 45 oppo
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3. Dispersions and Coatings 47 Kanz
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Chapter 4 High Surface Area Materia
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4. High Surface Area Materials 51 w
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4. High Surface Area Materials 53 F
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4. High Surface Area Materials 55 T
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4. High Surface Area Materials 57 s
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4. High Surface Area Materials 59 T
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4. High Surface Area Materials 61 F
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4. High Surface Area Materials 63 m
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4. High Surface Area Materials 65 I
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Chapter 5 Functional Nanoscale Devi
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5. Functional Nanoscale Devices 69
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Chapter 6 Bulk Behavior of Nanostru
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6. Bulk Behavior of Nanostructured
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Chapter 7 Biologically Related Aspe
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7. Biologically Related Aspects of
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Chapter 8 Research Programs on Nano
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8. Research Programs on Nanotechnol
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APPENDICES Appendix A. Biographies
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Appendix A. Biographies of Panelist
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Appendix B. Site Reports—Europe S
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Appendix B. Site Reports—Europe 1
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Appendix C. European Roundtable Dis
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Appendix D. Site Reports—Japan OV
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Page 353 and 354: Appendix F. Glossary 2DEG A/D AAAR
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Page 359 and 360: Appendix F. Glossary 333 PVDF QCA Q
Page 361 and 362: Appendix F. Glossary 335 WTEC XAS X
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