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274 Appendix D. Site Reports—Japan FUTURE DIRECTIONS The final year for this five-year program on synergy ceramics is 1998. It is anticipated that this program will continue in the pursuit of the synthesis of nanoporous materials for absorbing oil and identified particulates; the preparation ligands include ferrous materials such as ferrous disilicate; also of interest is the synthesis of ceramic materials with polymers that have low coefficient of friction similar to teflon. RESPONSE TO WTEC QUESTIONNAIRE Attached below are discussions on cluster engineering by Dr. Sakae Tanemura in response to the technical questions posed by the WTEC panel before the visit. NIRIN’s Research Activities on “Cluster Engineering” by Prof. Dr. Sakae Tanemura Scientific Drivers Those important to cluster engineering are as follows: new phenomena (cluster and surface interaction in both soft and hard collision cases; cluster coalescence and/or diffusion on the surface; solid state properties of assembled and/or embedded clusters). Applications Cluster itself is nanoscale material and shows the size-dependent quantum effect. If we can use a size-controlled cluster as a building block for nanostructure fabrication on a surface, we can fabricate new types of electronics (multiemitter-type resonance transistor, multitunnel junctions, and new magnetic devices having multivalued recordings with superhigh density). We will accomplish this by the combination of any materials and generally any substrates. “Cluster engineering” will help to break through some of the present difficulties faced by silicon technologies for nanostructures and will be a promising complement to silicon technologies. Critical Parameters to Control To move a high density size controlled cluster beam from the source to another vacuum vessel for deposition (for deposition by soft landing and/or
Appendix D. Site Reports—Japan 275 hard collision); to identify a cluster source; and deal with cooling and filtration will require specific knowledge for installation to operate effectively. To realize soft landing and/or hard collision deposition of clusters on a substrate, and to have ion optics to accelerate and deaccelerate ionized clusters will require specific designing skill. To control the assembled parameters (parameters to control selfdiffusion, migration and/or coalescence of deposited clusters, as well as the surface crystallinity of the substrate), including introduction of regular steps and/or kinks and termination of crystal bonds of surface atoms, will require extensive systematic research. Current Status These investigations have just begun with the cluster groups in Japan, the United States, and Europe, and the work is at a fundamental stage. Rapid progress will be expected within three to five years if certain research resources are available. Time Scale to Completion and Manufacturability It is difficult to estimate the time scale for ultimate application. This will be very much affected by the nanoscale requirements by semiconductor and memory industries. We must identify needs for large capacity and high speed memory requiring relatively small amounts of power. R&D Philosophy Our philosophy, directions, and basic concept are described in published brochures. Overall Japanese R&D Activities on Cluster Engineering I don’t know the overall R&D of nanotechnology throughout Japan. The definition of nanotechnology should be defined clearly. As far as I am concerned with cluster engineering in Japan, here are the other leading laboratories and/or persons working in this area: 1. JRCAT and NAIR (AIST, MITI) at Tsukuba: Atom Technologies group, particularly Dr. Y. Kanayama, (“Atom Technologies” project is a typical national project on nanostructures and being well funded by AIST, MITI) 2. Metal & Inorganic Material Institute, Tohoku Univ. at Sendai: Profs. K. Suzuki, K. Sumiyama and A. Kasuya. They are funded by “Strategic
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National Science and Technology Cou
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WTEC Panel on NANOSTRUCTURE SCIENCE
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ABSTRACT This report reviews the st
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Foreword Timely information on scie
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Foreword iii collaboration and thus
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Contents Foreword Table of Contents
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List of Figures 1.1 Organization of
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List of Figures ix 5.12 Granular GM
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List of Tables ES.1 Technological I
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Executive Summary Richard W. Siegel
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Executive Summary xix past decade,
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Executive Summary xxi TABLE ES.2. C
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Executive Summary xxiii blocks, and
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Chapter 1 Introduction and Overview
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1. Introduction and Overview 3 •
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1. Introduction and Overview 5 worl
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1. Introduction and Overview 7 grow
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1. Introduction and Overview 9 lead
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1. Introduction and Overview 11 2.
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1. Introduction and Overview 13 It
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Chapter 2 Synthesis and Assembly Ev
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2. Synthesis and Assembly 17 transi
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2. Synthesis and Assembly 19 probe
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2. Synthesis and Assembly 21 by adj
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2. Synthesis and Assembly 23 blocks
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2. Synthesis and Assembly 25 Self-A
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2. Synthesis and Assembly 27 Figure
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2. Synthesis and Assembly 29 us to
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2. Synthesis and Assembly 31 Brotzm
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2. Synthesis and Assembly 33 Siegel
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Chapter 3 Dispersions and Coatings
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3. Dispersions and Coatings 37 exis
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3. Dispersions and Coatings 39 more
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3. Dispersions and Coatings 41 into
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3. Dispersions and Coatings 43 of N
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3. Dispersions and Coatings 45 oppo
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3. Dispersions and Coatings 47 Kanz
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Chapter 4 High Surface Area Materia
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4. High Surface Area Materials 51 w
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4. High Surface Area Materials 53 F
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4. High Surface Area Materials 55 T
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4. High Surface Area Materials 57 s
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4. High Surface Area Materials 59 T
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4. High Surface Area Materials 61 F
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4. High Surface Area Materials 63 m
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4. High Surface Area Materials 65 I
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Chapter 5 Functional Nanoscale Devi
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5. Functional Nanoscale Devices 69
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Chapter 6 Bulk Behavior of Nanostru
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6. Bulk Behavior of Nanostructured
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Chapter 7 Biologically Related Aspe
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7. Biologically Related Aspects of
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Chapter 8 Research Programs on Nano
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8. Research Programs on Nanotechnol
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APPENDICES Appendix A. Biographies
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Appendix A. Biographies of Panelist
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Appendix B. Site Reports—Europe S
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Appendix B. Site Reports—Europe 1
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Appendix C. European Roundtable Dis
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Appendix E. Site Reports—Taiwan 3
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Appendix F. Glossary 2DEG A/D AAAR
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Appendix F. Glossary 329 ESPRIT ESR
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Appendix F. Glossary 331 MA MBE mCP
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Appendix F. Glossary 333 PVDF QCA Q
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Appendix F. Glossary 335 WTEC XAS X
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