section 1 - World Intellectual Property Organization

42/1998
22 Oct/oct 1998 PCT Gazette - Section I - Gazette du PCT 14847
(54) • ADHESIVE FOR ELECTROLESS PLATING,
RAW MATERIAL COMPOSITION FOR PRE-
PARING ADHESIVE FOR ELECTROLESS
PLATING AND PRINTED WIRING BOARD
• ADHESIF UTILE POUR EFFECTUER LE
DEPOT AUTOCATALYTIQUE, COMPOSI-
TION DE MATIERE BRUTE UTILE POUR
PREPARER L’ADHESIF POUR DEPOT
AUTOCATALYTIQUE ET CARTE IMPRIMEE
(71) IBIDEN CO., LTD. [JP/JP]; 1, Kanda–cho
2–chome, Ogaki–shi, Gifu 503–0917 (JP).
(for all designated States except / pour tous les États
désignés sauf US)
(72, 75) ASAI, Motoo [JP/JP]; Ibiden Co., Ltd., 1–1,
Kitakata, Ibigawa–cho, Ibi–gun, Gifu 501–0601
(JP). ONO, Yoshitaka [JP/JP]; Ibiden Co.,
Ltd., 1–1, Kitakata, Ibigawa–cho, Ibi–gun, Gifu
501–0601 (JP). KAWADE, Masato [JP/JP]; Ibiden
Co., Ltd., 1–1, Kitakata, Ibigawa–cho, Ibi–gun,
Gifu 501–0601 (JP). NODA, Kouta [JP/JP];
Ibiden Co., Ltd., 1–1, Kitakata, Ibigawa–cho,
Ibi–gun, Gifu 501–0601 (JP). NISHIWAKI,
Youko [JP/JP]; Ibiden Co., Ltd., 1–1, Kitakata,
Ibigawa–cho, Ibi–gun, Gifu 501–0601 (JP).
(74) OGAWA, Junzo; Kobikikan Ginza Building, 8–9,
Ginza 2–chome, Chuo–ku, Tokyo 104–0061 (JP).
(81) CN KR SG US; EP (AT BE CH CY DE DK ES FI
FR GB GR IE IT LU MC NL PT SE).
(11) WO 98/47329
(21) PCT/JP98/01725
(13) A1
(22) 15 Apr/avr 1998 (15.04.1998)
(25) ja (26) ja
(31) 9/97736 (32) 15 Apr/avr 1997
(15.04.1997)
(33) JP
(31) 9/155201 (32) 12 Jun/juin 1997
(12.06.1997)
(33) JP
(31) 9/335465 (32) 5 Dec/déc 1997
(05.12.1997)
(33) JP
(31) 9/335466 (32) 5 Dec/déc 1997
(05.12.1997)
(33) JP
(43) 22 Oct/oct 1998 (22.10.1998)
(51) 6 H05K 3/18, 3/38, 3/46, C23C 18/24, C09J
201/00
(54) • ADHESIVE FOR ELECTROLESS PLATING,
FEEDSTOCK COMPOSITION FOR PREPA-
RING ADHESIVE FOR ELECTROLESS PLA-
TING, AND PRINTED WIRING BOARD
•
ADHESIF UTILE POUR EFFECTUER LE
DEPOT AUTOCATALYTIQUE, COMPOSI-
TION DE PRODUIT DE DEPART UTILE
POUR PREPARER DE L’ADHESIF POUR
DEPOT CATALYTIQUE ET CARTE IMPRI-
MEE
(71) IBIDEN CO., LTD. [JP/JP]; 1, Kanda–cho
2–chome, Ogaki–shi, Gifu 503–0917 (JP).
(for all designated States except / pour tous les États
désignés sauf US)
(72, 75) ASAI, Motoo [JP/JP]; Ibiden Co., Ltd., 1–1,
Kitakata, Ibigawa–cho, Ibi–gun, Gifu 501–0601
(JP). ONO, Yoshitaka [JP/JP]; Ibiden Co.,
Ltd., 1–1, Kitakata, Ibigawa–cho, Ibi–gun, Gifu
501–0601 (JP). KAWADE, Masato [JP/JP]; Ibiden
Co., Ltd., 1–1, Kitakata, Ibigawa–cho, Ibi–gun,
Gifu 501–0601 (JP). NODA, Kouta [JP/JP];
Ibiden Co., Ltd., 1–1, Kitakata, Ibigawa–cho,
Ibi–gun, Gifu 501–0601 (JP). NISHIWAKI,
Youko [JP/JP]; Ibiden Co., Ltd., 1–1, Kitakata,
Ibigawa–cho, Ibi–gun, Gifu 501–0601 (JP).
(74) OGAWA, Junzo; Kobikikan Ginza Building, 8–9,
Ginza 2–chome, Chuo–ku, Tokyo 104–0061 (JP).
(81) CN KR SG US; EP (AT BE CH CY DE DK ES FI
FR GB GR IE IT LU MC NL PT SE).
(11) WO 98/47330
(21) PCT/SG98/00025
(13) A1
(22) 9 Apr/avr 1998 (09.04.1998)
(25) en (26) en
(31) 9701173–8 (32) 11 Apr/avr 1997
(11.04.1997)
(33) SG
(43) 22 Oct/oct 1998 (22.10.1998)
(51) 6 H05K 3/30, 3/34, B23K 3/06, 3/08
(54) • SOLDER BALL LOADING MECHANISM
• MECANISME DE CHARGEMENT POUR
GLOBULES DE SOUDURE
(71) ADVANCED SYSTEMS AUTOMATION LI-
MITED [SG/SG]; 65–A Jalan Tenteram #04–08,
St. Michael’s Industrial Estate, Singapore 328958
(SG).
(72) TAN, Chin, Hiang; Blk. 142, Petir Road #10–292,
Singapore 670124 (SG). SEE TOH, Weng, Sang;
Blk. 71, Jalan Dua #03–07, Singapore 390071
(SG).
(74) LAWRENCE Y.D. HO & ASSOCIATES; Thongsia
Building, 30 Bideford Road #07–01, Singapore
229922 (SG).
(81) CA CN JP; EP (AT BE CH CY DE DK ES FI FR
GB GR IE IT LU MC NL PT SE).
(11) WO 98/47331 (13) A1
(21) PCT/JP98/01748
(22) 16 Apr/avr 1998 (16.04.1998)
(25) ja (26) ja
(31) 9/99216 (32) 16 Apr/avr 1997 (33) JP
(16.04.1997)
(43) 22 Oct/oct 1998 (22.10.1998)
(51) 6 H05K 3/46
(54) • WIRING BOARD, WIRING BOARD FABRI-
CATION METHOD, AND SEMICONDUCTOR
PACKAGE
• TABLEAU DE CONNEXIONS, SON PRO-
CEDE DE FABRICATION ET BOITIER DE
SEMI–CONDUCTEUR
(71) KABUSHIKI KAISHA TOSHIBA [JP/JP]; 72,
Horikawa–cho, Saiwai–ku, Kawasaki–shi, Kanagawa
210–0913 (JP).
(for all designated States except / pour tous les États
désignés sauf US)
(72, 75) SHIMADA, Osamu [JP/JP]; 2–16–12–1–202,
Honmachi, Fuchu–shi, Tokyo 183–0027 (JP).
FUKUOKA, Yoshitaka [JP/JP]; 293–64–26–3,
Otsuka, Hachioji–shi, Tokyo 192–0352 (JP).
TAKAGI, Akihiko [JP/JP]; 1743, Kurohama,
Hasuda–shi, Saitama 349–0101 (JP).
SASAOKA, Kenji [JP/JP]; 3–15–27, Minamikurihara,
Zama–shi, Kanagawa 228–0015 (JP).
(74) SUYAMA, Saichi; Kandahigashiyama Building,
1, Kandatacho 2–chome, Chiyoda–ku, Tokyo
101–0046 (JP).
(81) JP KR US.
(11) WO 98/47332 (13) A1
(21) PCT/US98/07220
(22) 13 Apr/avr 1998 (13.04.1998)
(25) en (26) en
(31) 60/044,327 (32) 16 Apr/avr 1997
(16.04.1997)
(31) 09/054,263 (32) 3 Apr/avr 1998
(03.04.1998)
(33) US
(33) US
(43) 22 Oct/oct 1998 (22.10.1998)
(51) 6 H05K 3/46
(54) • POSITIVE WORKING PHOTODEFINABLE
RESIN COATED METAL FOR MASS PRO-
DUCTION OF MICROVIAS IN MULTILAYER
PRINTED WIRING BOARDS
• METAL REVETU DE RESINE POSI-
TIVE PHOTO–DEFINISSABLE POUR
PRODUCTION DE MASSE DE TROUS
D’INTERCONNEXION A L’ECHELLE MI-
CROSCOPIQUE DANS DES TABLEAUX DE
CONNEXIONS MULTICOUCHE IMPRIMES
(71) ALLIEDSIGNAL INC. [US/US]; 101 Columbia
Road, P.O. Box 2245, Morristown, NJ 07962–2245
(US).
(72) XU, Chengzeng; 51 Mapledale Avenue, Succasunna,
NJ 07876 (US). YARDLEY, James, T.;
40 Macculloch Street, Morristown, NJ 07960 (US).
HAAS, David; 527 Shackmaxon Drive, Westfield,
NJ 07090 (US). VALLANCE, Michael; W5787
Thistledown Drive, La Crosse, WI 54601 (US).
GOTRO, Jeffrey, Thomas; 2820 Prairie Clover
Place, Onalaska, WI 54650 (US). PETTI, Michael,
A.; 170 Pinyon Pine Court North, Buffalo
Grove, IL 60089 (US).
(74) CRISS, Roger, H.; AlliedSignal Inc., Law Dept.,
(E. Iannarone), 101 Columbia Road, P.O. Box
2245, Morristown, NJ 07962–2245 (US).
(81) CA JP KR SG; EP (AT BE CH CY DE DK ES FI
FR GB GR IE IT LU MC NL PT SE).
(11) WO 98/47333
(21) PCT/US98/07225
(13) A1
(22) 13 Apr/avr 1998 (13.04.1998)
(25) en (26) en
(31) 60/044,069 (32) 16 Apr/avr 1997
(16.04.1997)
(33) US
(31) 09/054,264 (32) 3 Apr/avr 1998
(03.04.1998)
(33) US
(43) 22 Oct/oct 1998 (22.10.1998)
(51) 6 H05K 3/46
(54) • FABRICATION OF HIGH DENSITY MUL-
TILAYER INTERCONNECT PRINTED CIR-
CUIT BOARDS
• PRODUCTION DE TABLEAUX
D’INTERCONNEXIONS MULTICOUCHE
IMPRIMES
(71) ALLIEDSIGNAL INC. [US/US]; 101 Columbia
Road, P.O. Box 2245, Morristown, NJ 07962–2245
(US).
(72) XU, Chengzeng; 51 Mapledale Avenue, Succasunna,
NJ 07876 (US). YARDLEY, James, T.;
40 Macculloch Street, Morristown, NJ 07960 (US).
HAAS, David; 527 Shackmaxon Drive, Westfield,
NJ 07090 (US). VALLANCE, Michael; W5787
Thistledown Drive, La Crosse, WI 54601 (US).
GOTRO, Jeffrey, Thomas; 2820 Prairie Clover
Place, Onalaska, WI 54650 (US). PETTI, Michael,
A.; 170 Pinyon Pine Court North, Buffalo
Grove, IL 60089 (US).
(74) CRISS, Roger, H.; AlliedSignal Inc., Law Dept.
(E. Iannarone), 101 Columbia Road, P.O. Box
2245, Morristown, NJ 07962–2245 (US).
(81) CA JP KR SG; EP (AT BE CH CY DE DK ES FI
FR GB GR IE IT LU MC NL PT SE).
(11) WO 98/47334 (13) A1
(21) PCT/SE98/00516
(22) 20 Mar/mar 1998 (20.03.1998)