Summary

Chapter 11: Advanced Personal Computers 21Figure 11-15 CPU and Heat Sink/Fan AssemblyNoteYou must apply thermal compound between the new CPU and the heat sink/fan assembly. This isbecause the surface of the heat sink and CPU is not entirely flat, and if you place the heat sink directlyon the CPU, there might be gaps that you cannot see. Air conducts heat poorly, and the gaps havea negative effect on heat transfer. By applying a thermal compound that has a high thermal conductivity,you improve the heat conductivity between the heat sink and CPU.With some types of BIOS, you can view thermal settings to determine whether there are anyproblems with the CPU and the heat sink/fan assembly. Third-party software applicationscan report CPU temperature information in an easy-to-read format. Refer to the motherboardor CPU user documentation to determine whether the chip is operating in the correcttemperature range. Some CPU and case fans turn on and off automatically depending on theCPU temperature and the internal case temperature. The temperatures are measured throughthermal probes built into the fan assembly, or internal circuitry in the CPU.Upgrade and Configure RAMIncreasing the amount of system RAM almost always improves overall system performance.Prior to upgrading or replacing the RAM, there are some questions you must answer:■■■■What type of RAM does the motherboard currently use?Can the RAM be installed one module at a time, or should it be grouped into matchingbanks?Are there any available RAM slots?Does the new RAM chip match the speed, latency, type, and voltage of the existing RAM?