BSIM3v3.2.2 MOSFET Model - The University of Texas at Dallas

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Non-Uniform Doping and Small Channel Effects on Threshold VoltageAs channel length L decreases, ∆V th will increase, and in turn V th willdecrease. If a MOSFET has a LDD structure, N d in Eq. (2.1.14) is thedoping concentration in the lightly doped region. V bi in a LDD-MOSFETwill be smaller as compared to conventional MOSFET’s; therefore thethreshold voltage reduction due to the short channel effect will be smallerin LDD-MOSFET’s.As the body bias becomes more negative, the depletion width will increaseas shown in Eq. (2.1.17). Hence ∆V th will increase due to the increase in l t .The term:VTideal+ K1 Φs−Vbs− K2Vbswill also increase as V bs becomes more negative (for NMOS). Therefore,the changes inVTideal+ K1 Φs−Vbs− K2Vbsand in ∆V th will compensate for each other and make V th less sensitive toV bs . This compensation is more significant as the channel length isshortened. Hence, the V th of short channel MOSFET’s is less sensitive tobody bias as compared to a long channel MOSFET. For the same reason,the DIBL effect and the channel length dependence of V th are stronger asV bs is made more negative. This was verified by experimental data shownin Figure 2-3 and Figure 2-4. Although Liu et al. found an accelerated V throll-off and non-linear drain voltage dependence [10] as the channelbecame very short, a linear dependence of V th on V ds is nevertheless a goodapproximation for circuit simulation as shown in Figure 2-4. This figureshows that Eq. (2.1.13) can fit the experimental data very well.2-10 BSIM3v3.2.2 Manual Copyright © 1999 UC Berkeley
Non-Uniform Doping and Small Channel Effects on Threshold VoltageFurthermore, Figure 2-5 shows how this V th model can fit various channellengths under various bias conditions.Figure 2-3. Threshold voltage versus the drain voltage at different body biases.Figure 2-4. Channel length dependence of threshold voltage.BSIM3v3.2.2 Manual Copyright © 1999 UC Berkeley 2-11
Page 1 and 2: BSIM3v3.2.2 MOSFET ModelUsers’ Ma
Page 5 and 6: Table of ContentsCHAPTER 1: Introdu
Page 7 and 8: CHAPTER 6: Parameter Extraction 6-1
Page 9 and 10: APPENDIX C: References C-1APPENDIX
Page 11 and 12: CHAPTER 1: Introduction1.1 General
Page 14 and 15: Non-Uniform Doping and Small Channe
Page 28 and 29: Mobility Modelµeffµ=01 + ( E E )e
Page 30 and 31: Bulk Charge Effectµ eff Ev = , E <
Page 32 and 33: Strong Inversion Drain Current (Lin
Page 34 and 35: Strong Inversion Current and Output
Page 42 and 43: Subthreshold Drain CurrentV1 PSCBE2
Page 44 and 45: Effective Channel Length and Widthd
Page 46 and 47: Poly Gate Depletion EffectNgateFigu
Page 48 and 49: Poly Gate Depletion Effect1.00Tox=8
Page 50 and 51: Poly Gate Depletion EffectBSIM3v3.2
Page 52 and 53: Poly Gate Depletion Effect2-40 BSIM
Page 54 and 55: Unified Channel Charge Density Expr
Page 56 and 57: Unified Channel Charge Density Expr
Page 58 and 59: Unified Mobility Expression∆QVF(
Page 60 and 61: Unified Linear Current ExpressionI=
Page 62 and 63: Unified Vdsat ExpressionLet V ds =V
Page 64 and 65: Single Current Expression for All O
Page 67 and 68: KAPITEL 7RESULTAT OCH REKOMMENDATIO
Page 69 and 70: CHAPTER 4: Capacitance ModelingAccu
Page 71 and 72: Geometry Definition for C-V Modelin
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Methodology for Intrinsic Capacitan
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Page 83 and 84:
Charge-Thickness Capacitance Modelp
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Charge-Thickness Capacitance Modelw
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Extrinsic CapacitanceFigure 4-4 ill
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Extrinsic Capacitance2( V + δ ) 4
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CHAPTER 5: Non-Quasi Static Model5.
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Model FormulationFigure 5-1. Quasi-
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Model Formulationwhere elm is the E
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Model Formulationwhere i represents
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CHAPTER 6: Parameter ExtractionPara
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Extraction ProcedureWOrthogonal Set
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Extraction ProcedureInitial Guess o
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Extraction Procedureoptimization. (
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Extraction ProcedureStep 7Extracted
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Extraction ProcedureB0, B1Fitting T
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Extraction ProcedureStep 20Extracte
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Notes on Parameter Extraction6.4.2
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Notes on Parameter ExtractionnC-1.
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CHAPTER 6: Parameter ExtractionPara
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Extraction ProcedureWOrthogonal Set
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Extraction ProcedureInitial Guess o
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Extraction Procedureoptimization. (
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Extraction ProcedureStep 7Extracted
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Extraction ProcedureB0, B1Fitting T
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Extraction ProcedureStep 20Extracte
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Notes on Parameter Extraction6.4.2
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Notes on Parameter ExtractionnC-1.
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CHAPTER 7: Benchmark Test ResultsA
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Benchmark Test ResultsIds (A)1.E-02
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Benchmark Test Resultsgm/Ids (mho/A
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CHAPTER 8: Noise Modeling8.1 Flicke
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Flicker NoiseNlC=ox( V −V− min(
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Noise Model Flag8.3 Noise Model Fla
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CHAPTER 9: MOS Diode Modeling9.1 Di
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Diode IV ModelJssw= Js0sw⎛ E⎜
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MOS Diode Capacitance Model9.1.3 Mo
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MOS Diode Capacitance Model(9.18)Cj
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MOS Diode Capacitance Model(9.26)Cj
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MOS Diode Capacitance Model(9.32)
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APPENDIX A: Parameter ListA.1 Model
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DC ParametersSymbolsused inequation
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C-V Model ParametersSymbolsused ine
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dW and dL ParametersA.5 dW and dL P
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Temperature ParametersSymbolsused i
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Process ParametersSymbolsused inequ
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Model Parameter NotesK2( γ1−γ)(
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Model Parameter NotesCgdo = dlc * C
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APPENDIX B: Equation ListB.1 I-V Mo
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I-V ModelC C V C V D L effDL effdsc
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I-V ModelEsatsat= 2νµ effB.1.5 Ef
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I-V ModelB.1.8 Polysilicon Depletio
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Capacitance Model EquationsTRdsw( T
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Capacitance Model EquationsB.2.2.2
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Capacitance Model EquationsQ inv= 0
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Capacitance Model Equationsif (V ds
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Capacitance Model Equations⎡Q W L
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Capacitance Model EquationsVgsteff
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Capacitance Model Equations(i) 50/5
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Capacitance Model EquationsAbulk0
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Capacitance Model Equations(3) capM
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Capacitance Model EquationsδQsub=
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APPENDIX C: References[1] G.S. Gild
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[18] M.C. Jeng, "Design and Modelin
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[35] K.K. Hung et al, “A Physics-
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APPENDIX D: Model Parameter Binning
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AC and Capacitance ParametersD.3 AC
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NQS ParametersD.4 NQS ParametersSym
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Temperature ParametersD.6 Temperatu
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Process ParametersSymbolsused inequ
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