HVAC Control in the New Millennium.pdf - HVAC.Amickracing

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HVAC Control in the New MillenniumEdition, Chilton Book Company: Radnor, PA, 1995.“The Connectivity Revolution,” Wireless Systems Design, Vol. 3 No. 9,September 1998, pp. 1-3.Redman, Jim, “Upgrades Enhance Capability,” Industrial Computing,Vol. 18 No. 5, April 1999, pp. 22-25.TigerDirect.com Catalog, Vol. X Issue 1, 2000, p. 107.Internet: www.home.cnet.com/specialreports/0-6014-7-818759.html,Neumann, Alicia and Kristina Blachere, “Nanotechnology WillChange the World,” November 1999, pp. 1-2.Internet: www.foresight.org/EOC/EOC.Chapter_1.html, Ulmer, Kevin,“Engines of Creation,” November 1999, pp. 1-10.©2001 by The Fairmont Press, Inc. All rights reserved.
Advanced HVAC Control, Information Technology and Open Systems 131Chapter 4Advanced HVAC Control,Information TechnologyAnd Open SystemsClean rooms represent space areas that are used for testing/analysis laboratories, in medical, military and electronic processingindustries. The optimization of clean room controls isan important area in the future of HVAC controls. Many ofthese concepts will be finding their way into building automation.The production of semiconductors must take place in a clean roomenvironment. Optimization of the clean room control system can reducethe cost of operation and the number of product defects. In semiconductormanufacturing, an area of 100,000 square feet (9290 square meters)can have a daily production worth of over $1 million.Semiconductor ManufacturingThe overall semiconductor fabrication process consists of the patterningof a sequence of successive layers. The patterning steps aretransferred into layers of the final system. The sequence of layers is usedto build up an integrated system.One process is the creation of a silicon dioxide insulating layeron the surface of a silicon wafer and the selective removal of sectionsof the insulating layer. This step begins with a bare polished siliconwafer. The wafer is exposed to oxygen in a high-temperature furnaceto grow a uniform layer of silicon dioxide on its surface. After thewafer is cooled, it is coated with a thin film of organic resist material.©2001 by The Fairmont Press, Inc. All rights reserved.
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HVAC ControlIn the New Millenniumby
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Table of ContentsChapter 1Chapter 2
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The use of wireless LANs may double
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munication technologies, predict th
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ing automation. This will continue
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Heat, Ventilation and Damper Contro
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PC-based Control, Software and Bus
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Computer Networks and Security 265C
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Computer Networks and SecurityInter
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Computer Networks and Securitystruc
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Computer Networks and Securityther
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Computer Networks and Securitywork.
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Computer Networks and Securitylogic
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Computer Networks and Securitythey
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Computer Networks and Security• n
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Computer Networks and Securitywork
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Computer Networks and SecurityMany
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Computer Networks and SecurityPure
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Computer Networks and SecurityThe m
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Computer Networks and Securityavail
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Computer Networks and SecuritySever
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Computer Networks and SecurityEffic
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Computer Networks and Security 305C
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Computer Networks and Security(CAD)
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Computer Networks and Securityand f
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Computer Networks and Securitymost
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Computer Networks and Securityconne
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Computer Networks and Securitytion
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Building Automation, Wireless Techn
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Table 9-4. Internet Services——
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