section 1 - World Intellectual Property Organization

44/2002
21950 PCT Gazette - Section I - Gazette du PCT 31 Oct/oct 2002
AT LIMITED, 2381-1, Kitagejo, Fujii-cho,
Nirasaki-shi, Yamanashi 407-8511 (JP).
(74) SUYAMA, Saichi; Kanda Higashiyama
Bldg., 1, Kandata-cho 2-chome, Chiyoda-ku,
Tokyo 101-0046 (JP).
(81) CN KR US.
(84) EP (AT BE CH CY DE DK ES FI FR GB GR
IE IT LU MC NL PT SE TR).
(51) 7 H01L 21/316
(11) WO 02/086958 (13) A1
(21) PCT/EP02/04345
(22) 19 Apr/avr 2002 (19.04.2002)
(25) de (26) de
(30) 101 19 741.1 23 Apr/avr 2001 DE
(23.04.2001)
(43) 31 Oct/oct 2002 (31.10.2002)
(54) METHOD AND DEVICE FOR THE
PRODUCTION OF PROCESS GASES
PROCEDE ET DISPOSITIF PERMET-
TANT DE PRODUIRE UN GAZ DE
TRAVAIL
(71) MATTSON THERMAL PRODUCTS
GMBH [DE/DE]; Daimlerstrasse 10, 89160
Dornstadt (DE).
(for all designated States except / pour tous
les États désignés sauf US)
(72, 75) ROTERS, Georg [DE/DE]; Weseler
Strasse 37, 48249 Dülmen (DE). MADER,
Roland [DE/DE]; Ursulers 2, 87452 Altusried
(DE). SOMMER, Helmut [DE/DE];
Haldenweg 9, 73326 Deggingen (DE). ER-
LIKH, Genrih [US/US]; 377 Michelle
Lane, Daly City, CA 94015 (US). PASHUT,
Yeh uda [US/US]; 570 Crystalberry Terrace,
San Jose, CA 95129 (US).
(81) CA CN IL JP KR SG US.
(84)EA(AMAZBYKGKZMDRUTJTM);EP
(ATBECHCYDEDKESFIFRGBGRIE
IT LU MC NL PT SE TR).
Published / Publiée : (c)
(51) 7 H01L 21/321
(11) WO 02/086959
(21) PCT/US02/09180
(13) A2
(22) 27 Mar/mar 2002 (27.03.2002)
(25) en (26) en
(30) 09/818,751 27 Mar/mar 2001
(27.03.2001)
US
(43) 31 Oct/oct 2002 (31.10.2002)
(54) POST-PLANARIZATION CLEAN-UP
NETTOYAGE DE POST-PLANARISA-
TION
(71) MICRON TECHNOLOGY, INC.
[US/US]; 8000 South Federal Way, Boise, ID
83716 (US).
(72) ANDREAS, Michael, T.; 1400 Hill Road,
Boise, ID 83702 (US).
(74) LEFFERT, Thomas, W.; FoggSliferPolglaze
Leffert & Jay, P.A., P.O. Box 581009,
Minneapolis, MN 55458-1009 (US).
(81) AE AG AL AM AT AU AZ BA BB BG BR
BY BZ CA CH CN CO CR CU CZ DE DK
DM DZ EC EE ES FI GB GD GE GH GM
HR HU ID IL IN IS JP KE KG KP KR KZ
LC LK LR LS LT LU LV MA MD MG MK
MN MW MX MZ NO NZ OM PH PL PT RO
RU SD SE SG SI SK SL TJ TM TN TR TT
TZ UA UG UZ VN YU ZA ZM ZW.
(84)AP(GHGMKELSMWMZSDSLSZTZ
UG ZM ZW); EA (AM AZ BY KG KZ MD
RU TJ TM); EP (AT BE CH CY DE DK ES
FI FR GB GR IE IT LU MC NL PT SE TR);
OA(BFBJCFCGCICMGAGNGQGW
ML MR NE SN TD TG).
(51) 7 H01L 21/322
(11) WO 02/086960
(21) PCT/US02/12712
(13) A1
(22) 22 Apr/avr 2002 (22.04.2002)
(25) en (26) en
(30) 60/285,180 20 Apr/avr 2001
(20.04.2001)
US
(30) 60/345,165 21 Dec/déc 2001
(21.12.2001)
US
(43) 31 Oct/oct 2002 (31.10.2002)
(54) METHOD FOR THE PREPARATION OF
A SILICON WAFER HAVING STABI-
LIZED OXYGEN PRECIPITATES
PROCEDE DE PREPARATION D’UNE
PLAQUETTE EN SILICIUM PRESEN-
TANT DES PRECIPITES D’OXYGENE
STABILISES
(71) MEMC ELECTRONIC MATERIALS,
INC. [US/US]; P.O. Box 8, 501 Pearl Drive,
St. Peters, MO 63376 (US).
(72) BORGINI, Marco; c/o MEMC Electronic
Materials, S.p.A., Viale Gherzi 31, I-28100
Novara (IT). GAMBARO, Daniela; c/o
MEMC Electronic Materials, S.p.A., Viale
Gherzi 31, I-28100 Novara (IT). RAVANI,
Marco; c/o MEMC Electronic Materials,
S.p.A., Viale Gherzi 31, I-28100 Novara (IT).
RIES, Michael, J.; 4207 Eagle Rock Court,
St. Charles, MO 63304 (US). SACCHETTI,
Laura; MEMC Electronic Materials, S.p.A.,
Viale Gherzi 31, I-28100 Novara (IT). STAN-
DLEY, Robert, W.; c/o MEMC Electronic
Materials, Inc., 501 Pearl Drive, P.O. Box
8, St. Peters, MO 63376 (US). FALSTER,
Robert, J.; 22 Compton Terrace, London
N1 2UN (GB). STINSON, Mark, G.; 572
Crestview, East Alton, IL 62024 (US).
(74) SCHUTH, Richard, A. et al. / etc.; One
Metropolitan Square, Suite 1600, St. Louis,
MO 63102 (US).
(81) JP KR.
(84)EP(ATBECHCYDEDKESFIFRGBGR
IE IT LU MC NL PT SE TR).
(51) 7 H01L 21/4763, 23/48, C25D 5/02
(11) WO 02/086961
(21) PCT/US02/10500
(13) A1
(22) 4 Apr/avr 2002 (04.04.2002)
(25) en (26) en
(30) 60/286,273 24 Apr/avr 2001
(24.04.2001)
US
(30) 10/108,614 27 Mar/mar 2002
(27.03.2002)
US
(43) 31 Oct/oct 2002 (31.10.2002)
(54) ELECTROPOLISHING METAL LAY-
ERSONWAFERSHAVINGTRENCHES
OR VIAS WITH DUMMY STRUC-
TURES
POLISSAGE ELECTROLYTIQUE DE
COUCHES METALLIQUES SUR DES
PLAQUETTES POURVUES DE TRAN-
CHEES OU TROUS D’INTERCON-
NEXION A FAUSSES STRUCTURES
(71) ACM RESEARCH, INC. [US/US]; Suite
610, 46520 Fremont Boulevard, Fremont, CA
94538 (US).
(72) WANG, Hui; 38855 Litchfield Court, Fremont,
CA 94536 (US). YIH, Peihaur; 37171
Sycamore Street #824, Newark, CA 94560
(US).
(74) YIM, Peter, J. et al. / etc.; Morrison & Foerster
LLP, 425 Market Street, San Francisco,
CA 94105-2482 (US).
(81) CA CN IL JP KR SG.
(84)EP(ATBECHCYDEDKESFIFRGBGR
IE IT LU MC NL PT SE TR).
Published / Publiée : (c)
(51) 7 H01L 21/66
(11) WO 02/086962 (13) A1
(21) PCT/US02/05949
(22) 25 Feb/fév 2002 (25.02.2002)
(25) en (26) en
(30) 09/841,762 24 Apr/avr 2001 US
(24.04.2001)
(43) 31 Oct/oct 2002 (31.10.2002)
(54) METHOD AND APPARATUS FOR IM-
PROVING RESOLUTION OF OBJECTS
IN A SEMICONDUCTOR WAFER
PROCEDE ET APPAREIL PERMET-
TANT D’AMELIORER LA RESOLU-
TION D’OBJETS SUR UNE TRANCHE
SEMI-CONDUCTRICE
(71) MENTOR GRAPHICS CORPORA-
TION [US/US]; 8005 S.W. Boeckman Road,
Wilsonville, OR 97070-7777 (US).
(for all designated States except / pour tous
les États désignés sauf US)
(72, 75) PELL, Edwin, A., III [US/US]; 216
Long Pond Road, Rhinebeck, NY 12572
(US).
(74) SCOTTI, Robert, F.; Klarquist Sparkman,
LLP, One World Trade Center, Suite 1600,
121 SW Salmon Street, Portland, OR 97204
(US).
(81) AE AG AL AM AT AU AZ BA BB BG BR
BY BZ CA CH CN CO CR CU CZ DE DK
DM DZ EC EE ES FI GB GD GE GH GM
HR HU ID IL IN IS JP KE KG KP KR KZ
LC LK LR LS LT LU LV MA MD MG MK
MN MW MX MZ NO NZ OM PH PL PT RO
RU SD SE SG SI SK SL TJ TM TN TR TT
TZ UA UG US UZ VN YU ZA ZM ZW.
(84)AP(GHGMKELSMWMZSDSLSZTZ
UG ZM ZW); EA (AM AZ BY KG KZ MD
RUTJTM);EP(ATBECHCYDEDKES
FI FR GB GR IE IT LU MC NL PT SE TR);
OA(BFBJCFCGCICMGAGNGQGW
ML MR NE SN TD TG).
(51) 7 H01L 21/68, 21/02, B65G 49/07
(11) WO 02/086963 (13) A1
(21) PCT/JP02/03391
(22) 4 Apr/avr 2002 (04.04.2002)
(25) ja (26) ja
(30) 2001-121735 19 Apr/avr 2001
(19.04.2001)
(43) 31 Oct/oct 2002 (31.10.2002)
JP