Online proceedings - EDA Publishing Association

24-26 September 2008, Rome, ItalySession 6: Acquisition and analysis of thermal dataLASER SCANNING THERMOMECHANICAL IMAGING OF MICROELECTRONIC DEVICES . . . . . . . . . . . . . 183Stéphane Grauby, Amine Salhi, Jean-Michel Rampnoux, Wilfrid Claeys and Stefan Dilhaire, Université Bordeaux 1,FranceA DUAL APPROACH TO DETERMINE THE THERMAL IMPEDANCE OF BIPOLAR TRANSISTORS . . . . . . 190Alain Xiong, Raphael Sommet, Antonio De Souza and Raymond Quere, XLIM, FranceSession 7: SensorsULTRA-HIGH TEMPERATURE (>300C) SUSPENDED THERMODIODE IN SOI CMOS TECHNOLOGY. . . . 195F. Udrea, S. Santra, P. K. Guha, S. Z. Ali and I. Haneef, University of Cambridge, UKPOSSIBILITIES FOR HUMIDITY SENSING WITH THERMAL TRANSIENT TESTING ON POROUSSTRUCTURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200András Vass-Várnai, MicReD Ltd., Hungary; Peter Furjes, MFA, Hungary; and Marta Rencz, BME, HungaryEVALUATION OF AN ELECTRICAL METHOD FOR DETECTION OF DIE ATTACH IMPERFECTIONS INSMART POWER SWITCHES USING TRANSIENT THERMAL FEM SIMULATIONS . . . . . . . . . . . . . . . . . . . . . . . 204Vladimír Koel, Michael Glavanovics, KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Austria;and Erich Scheikl, Infineon Technology, AustriaEmbedded tutorial: LED standardisationFriday, September 26 th , 2008ON THE STANDARDISATION OF THERMAL CHARACTERISATION OF LEDS PART I: COMPARISONWITH IC PACKAGES AND PROPOSAL FOR ACTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208Clemens Lasance, Philips, Eindhoven, The NetherlandsON THE STANDARDISATION OF THERMAL CHARACTERISATION OF LEDS PART II: PROBLEMDEFINITION AND POTENTIAL SOLUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213Clemens Lasance, Philips, Eindhoven, The Netherlands; and András Poppe, Budapest Univ. of Technology andEconomics, HungarySession 8: ElectrothermalPRACTICAL CHIP-CENTRIC ELECTRO-THERMAL SIMULATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220Renaud Gillon, Patricia Joris, AMI Semiconductor Belgium BVBA, Belgium; Herman Oprins, Bart Vandevelde,IMEC vzw, Belgium; Adi Srinivasan and Rajit Chandra, GRADIENT DA, Inc., USAELECTRO-THERMAL ANALYSIS OF ELECTRIC DOUBLE-LAYER CAPACITORS . . . . . . . . . . . . . . . . . . . . . . . . 224Caroline Pascot, Philippe Guillemet and Yves Scudeller, Université de Nantes, FranceCONSIDERATION OF THERMAL EFFECTS IN LOGIC SIMULATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229Gergely Nagy, György Horváth and András Poppe, Budapest University of Technology and Economics, HungaryELECTRO-THERMAL INVESTIGATION OF OLEDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235László Pohl, Ernö Kollár, Zsolt Kohári and András Poppe, BME, HungaryAuthor Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241©EDA Publishing/THERMINIC 2008 XISBN: 978-2-35500-008-9