Online proceedings - EDA Publishing Association

24-26 September 2008, Rome, ItalyTable of ContentsWednesday, September 24 th , 2008Invited speaker 1: CFD for Electronics Cooling: MCAD and EDA Embedded vs. StandaloneCFD FOR ELECTRONICS COOLING: MCAD AND EDA EMBEDDED vs. STAND-ALONE . . . . . . . . . . . . . . . . . 1John Parry, Flomerics, Hampton Court, UKSession 1: MeasurementsTRIANGULATION METHOD FOR STRUCTURE FUNCTIONS OF MULTI-DIRECTIONAL HEAT-FLOWS . . 8Lorenzo Codecasa, Dario D’Amore and Paolo Maffezzoni, Politecnico di Milano, ItalyTRANSIENT DUAL INTERFACE MEASUREMENT OF THE RTH-JC OF POWER PACKAGES . . . . . . . . . . . . . 14Dirk Schweitzer, Infineon Technologies AG, GermanyEVALUATION OF SHORT PULSE THERMAL TRANSIENT MEASUREMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Vladimir Szekely, Budapest University of Technology & Economics, HungaryNEW APPROACH FOR THERMAL INVESTIGATION OF A III-V POWER TRANSISTOR . . . . . . . . . . . . . . . . . . 26Maxime Fontaine, Eric Joubert, Olivier Latry, Pascal Dherbecourt and Mohamed Ketata, LEMI, FranceSession 2: Reliability issuesENSURING TEMPERATURE-INSENSITIVITY OF DUAL-VT DESIGNS THROUGH ITD-AWARESYNTHESIS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Andrea Calimera, Politecnico di Torino, Italy; Ruth Iris Bahar, Brown University, USA; Enrico Macii and MassimoPoncino, Politecnico di Torino, ItalyMANAGING LEAKAGE POWER AND RELIABILITY IN HOT CHIPS USING SYSTEM FLOORPLANNINGAND SRAM DESIGN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Aseem Gupta, Amin Djahromi, Ahmed Eltawil, Fadi Kurdahi, Nikil Dutt, University of California Irvine, USA;Kamal Khouri and Magdy Abadir, Freescale Semiconductor Inc., USAASSESMENT OF DIE ATTACH QUALITY BY ANALYSIS OF CIRCUIT THERMAL RESPONSE SPECTRUM 43Marcin Janicki, Technical University of Lodz, Poland; Bjorn Vermeersch, Jedrzej Banaszczyk, University of Ghent,Belgium; Marek Kaminski, Technical University of Lodz, Poland; Gilbert De Mey, University of Ghent, Belgium;and Andrzej Napieralski, Technical Univarsity of Lodz, PolandMATERIAL CHARACTERISATION AND NON-DESTRUCTIVE FAILURE ANALYSIS BY TRANSIENTPULSE GENERATION AND IR-THERMOGRAPHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47Daniel May, Bernhard Wunderle, Mohamad Abo Ras, Wolfgang Faust, Fraunhofer IZM, Germany; Astrid Gollhardt,AMIC GmbH, Germany; Heike Kukuk-Schmid and Bernd Michel, Fraunhofer IZM, GermanySession 3: Simulation at package levelCOMPACT THERMAL NETWORKS FOR CONJUGATE HEAT TRANSFER BY DIRECTIONAL MOMENTMATCHING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52Lorenzo Codecasa, Dario D’Amore and Paolo Maffezzoni, Politecnico di Milano, Italy©EDA Publishing/THERMINIC 2008 VIIISBN: 978-2-35500-008-9