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24-26 September 2008, Rome, Italytriangulation is presented on the Fig.11b.Temperature Germany), A.Matewson and T.Hilt (Cea-LETI, Grenoble,distribution found by Hedoris simulation is presented on the France) for the fruitful discussion and the excellentFig.12.collaboration within the e-Cubes project works.abREFERENCES[1] Information available at http://www.ecubes.org.[2] Accelera, “Verilog-AMS Language Reference Manual”.[3] G.Schröpfer, M.McNie, et.al, “Designing manufacturable MEMS inCMOS compatible processes: methodology and case studies”,Proceedings of SPIE Photonics Europe 2004, Strasbourg, April2004, pp: 116-127.[4] P.Schneider, S.Reitz, A.Wilde, G.Elst, P.Schwarz: “Towards aMethodology for Analysis of Interconnect Structures for 3D-Integration of Micro Systems” Proc. DTIP2007, 25-27 April 2007,Stresa.[5] G.Janczyk, T.Bieniek, et.al. “The High Level Thermo-ElectricalModeling of the Complex 3D IC Structures”, Proc. 2007, ECS’07,September 4-5, 2007, Bratislava.[6] B.Wunderle, E.Kaulfersch, P.Ramm, B,Michel, H.Reichl,“Thermo-Mechanical Reliability of 3D-integrated Microstructuresin Stacked Silicon”, Proc. 2006 MRS Fall Meeting, November 27 -December 1, 2006, Boston.[7] Information available at www.coventor.com[8] G.Elst, P.Schneider, P.Ramm „Modeling and Simulation ofParasitic Effects in Stacked Silicon”, Proc. 2006 MRS FallMeeting, November 27 - December 1, 2006, BostoncFig.12. Results of thermal simulation for the structure shown onthe Fig.11 for two 40mW heat-flow sources at wafer 2 andwafer 3.The above presented simulation results and comparisonshow that there is a way of the high level description ofheterogeneous devices along with accurate temperaturesimulation confirmed by commercial multidomain FECoventor simulator.Fig.13. The overall view of temperature distribution for themiddle internal wafer of simulated eCubes device. The top waferis hidden.ACKNOWLEDGMENTSThis work has been supported by European Commission(support-number IST-026461). European project: 3DIntegrated Micro/Nano Modules for Easily AdaptedApplication, acronym e-CUBES [1]. We would like to thankS.Reitz and P.Schneider (Fraunhofer Institute, Dresden,Germany), J.Weber (Fraunhofer Institute, Munich,Germany), E.Kaulfersch, (Fraunhofer Institute, Berlin,©EDA Publishing/THERMINIC 2008 84ISBN: 978-2-35500-008-9