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F. DemonstratorsWith better cooling as developed in the NANOPACKproject, electronic components can be packed more denselyand be operated at higher power levels. This stronglyincreases the energy efficiency of the systems by reducingthe need for chiller systems and limiting the waste ofmaterials associated with lower density systems. Theobjective of this work is to exploit the newly enabledtechnologies by demonstrating several devices owningunprecedented thermal and electrical capabilities, in thefields of microprocessors, automotive and aerospace highpower electronics and high power radio-frequency switches.IV. LIST OF PARTNERSThe NANOPACK consortium consists of 4 majorindustrial partners, 4 innovative SMEs, and 6 academicgroups in total representing 8 European countries:Thales Research & Technology, FranceBudapest University of Technology and Economics, HungaryRobert Bosch GmbH, GermanyInstitut d’Electronique de Microtechnologies et deNanotechnologie, FranceChalmers University of Technology, SwedenElectrovac AG, AustriaFoab Elektronik AG, SwedenFraunhofer Insititut IZM, GermanyIBM Zurich Research Laboratory, SwitzerlandCatalan Institute of Nanotechnology, SpainMicReD Ltd. HungaryBerliner Nanotest und Design GmbH, GermanyThales Avionics, FranceVTT Micro and Nanoelectronics, FinlandACKNOWLEDGMENTThis work is supported in part by the EuropeanCommission (EC) 7 th Framework Programme (FP7), underthe (IP) project n°216176 (NANOPACK).24-26 September 2008, Rome, Italy©EDA Publishing/THERMINIC 2008 155ISBN: 978-2-35500-008-9
24-26 September 2008, Rome, ItalyRecent Progress of Thermal Interface MaterialResearch – An OverviewJohan Liu 1 , Bruno Michel 2 , Marta Rencz 3 , Christian Tantolin 4 , Claude Sarno 4 , Ralf Miessner 5 , Klaus-Volker Schuett 5 , XinheTang 6 , Sebastien Demoustier 7 , Afshin Ziaei 71 Chalmers University of Technology, Sweden2 IBM Zurich Research Laboratory, Swertizerland3 Budapest University of Technology and Economics, Hungary4 Thales Avionics, France5 Robert Bosch GmbH, Germany6 Electrovac, Austria7 Thales Research, FranceCorresponding author: Joahn Liu (johan.liu@chalmers.se)Abstract- This paper provides a comprehensive review of therecent progress of research work performed to develop newthermal interface materials. The review starts by classifyingexisting thermal interface materials and analyzing theiradvantages and disadvantages. The state of the art research isthen reviewed with an emphasis on those materials based onvarious carbon allotropes, such as graphite, carbon nanotubes(CNTs) and fibers. Other kinds of fillers with high thermalconductivity, such as silicon carbide, boron nitride, aluminumnitride, aluminum oxide, silver and other metals, have also beenextensively studied. These materials are also reviewed in thispaper. Besides the achievements in materials development,other methods have also been developed to further reduce theoverall interface resistance, such as modifying the surfaces ofthe integrated chips or heat sinks. This aspect is also discussedin this paper. The paper is summarized with a perspective onthe future technical trends.I. INTRODUCTIONThe integration and power density of microelectronicsproducts has been continuous increasing for decades.Efficient systematic thermal management solutions are animmediate requirement to dissipate the large amount of heatgenerated by the integrated chips and other components.Thermal interface materials play a key role for the heatdissipation at all levels within a microsystem. The functionof TIMs is to fill the microscale gaps between twocontacting materials to enhance the heat conduction throughthe interfaces. It has been widely recognized that thermalinterface materials are one of the main bottleneckspreventing the efficient heat transfer from the integratedchips to the heat sinks and ambient environment. Intensiveefforts have therefore been put into the research of novelthermal interface materials in both academia and industryduring recent years. Some well-delivered reviews on TIMtechnologies with different focuses are provide by Dani [1],Dean [2], Gowda [3], Prasher [4], Samson [5], and Sarvar[6].This paper comprehensively reviews the recent progress ofresearch work performed to develop new thermal interfacematerials. The review starts by classifying existing thermalinterface materials and analyzing their advantages anddisadvantages. The state-of-the-art research is then reviewedwith an emphasis on those materials based on various carbonallotropes, such as graphite, carbon nanotubes and carbonfibers. The carbon based materials are widely considered asone of the most promising approaches in this field due to thehigh thermal conductivity of carbon allotropes. The barriersto achieve high performance and wide application of thesematerials are also discussed. A variety of methods totheoretically study the materials and to evaluate theirperformance are also generally examined. The paper issummarized with a perspective on the future technicaltrends.II. EXISTING THERMAL INTERFACE MATERIALSIt has been a long history of using and developing thermalinterface materials in the IT industry. A variety oftechnological approaches have been developed and appliedto meet different needs in all kinds of applications. Thermalinterface materials can generally be classified into eightdifferent categories: thermal grease, thermal gel, phasechange materials, phase change metallic alloys, thermallyconductive adhesives, solders, thermal tapes and pads [2, 5].III. STATE-OF-THE-ART RESEARCH: MATERIALDEVELOPMENTSeveral trends can now be clearly observed in the field ofthermal interface material research. One trend is that a bigfraction of the research work focuses on the novel types ofhigh thermally conductive fillers, including carbon allotropesand ceramics. Another important trend is to extend the studyon TIMs down to a much smaller scale than before. This notonly deepens the understanding in this field but also providesa possibility to create and modify micro- and nano-scalestructures to vary the material properties and improve theperformance.©EDA Publishing/THERMINIC 2008 156ISBN: 978-2-35500-008-9
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