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24-26 September 2008, Rome, Italy©
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Staggered Cartesian meshes tolerate
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VIII. THE CASE FOR MCAD-EMBEDDED EC
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solution to the eikonal equation(
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q (RthΣ, t)q (R th , t )10.80.60.4
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24-26 September 2008, Rome, Italy[7
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Thermal resistance (K/W)0.250.200.1
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24-26 September 2008, Rome, ItalyB.
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temperatrue rise [K]76543210Sim0,00
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conclusion, every tile is contacted
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and B10), three space blocks (W4, W
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After having determined the k eff v
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PTjunc24-26 September 2008, Rome, I
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tures - has been shown previously [
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IV.CONCLUSIONSMentor Graphics Exped
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III. HEDORIS SIMULATIONSThermal sim
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datasheets, these values are usuall
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material to handle difficulties suc
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heatspreaders deposited during the
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Fig. 13 Transient of the output dio
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chamber to calibrate the thermal te
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Temperature rise (°C)1,81,61,41,21
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i résistances carbone (A)i résist
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calculates the dissipation distribu
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in the next. It can also be used to
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allows creating special methods of
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OLED device (see Fig. 2.) provided
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