30.01.2013 Views

Thixoforming : Semi-solid Metal Processing

Thixoforming : Semi-solid Metal Processing

Thixoforming : Semi-solid Metal Processing

SHOW MORE
SHOW LESS

Create successful ePaper yourself

Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.

258j 8 Tool Technologies for Forming of <strong>Semi</strong>-<strong>solid</strong> <strong>Metal</strong>s<br />

Table 8.3 Process parameters for coating deposition.<br />

Process parameters<br />

Etching<br />

phase<br />

Interlayer<br />

(Ti 1 xAl x)N<br />

Top coat<br />

c-(Al 2O 3)<br />

Heating power (kW) 16 16 16<br />

Process step time (s) 3600 8500 8000<br />

Total pressure (mPa) Flow controlled 500 Flow controlled<br />

M.f. voltage (250 kHz) (V) 650 — —<br />

Bias voltage (V) — 80 (DC) 25 (pulsed m.f.)<br />

Nitrogen flow (mln) — 60 —<br />

Oxygen flow (mln) — — varied<br />

Argon flow (mln) 150 Pressure controlled 250<br />

Target power density (Wcm 2 ) — 13.7 7.95<br />

Anode voltage (V) — 70 —<br />

using two aluminium targets (target size 88 500 mm) using the dual cathode<br />

arrangement (power 3500 W, pulse frequency 18.5 kHz). The process is flow controlled:<br />

the argon is kept at 250 sccm while the oxygen flow is varied. The oxygen<br />

partial pressure was controlled by adjusting a certain voltage at the cathodes. The<br />

process parameters are listed in Table 8.3.<br />

8.4.1.6 Results of the Deposition of g-Al2O3 on an Industrial Coating Unit<br />

The properties of the deposited coatings are strongly dependent on the working point<br />

in the hysteresis (Figure 8.16). To obtain the right coating properties for the dies,<br />

different working points are examined. Two of these working points presented as an<br />

example are compared using different thin-film analysis equipment such as phase<br />

analysis (XRD), mechanical properties (nanoindentation) and SEM. One point is<br />

chosen near the metallic sputtering mode at a cathode voltage of 560 V, and the<br />

second one in the lower area at 460 V near the fully poisoned region. With an increase<br />

in oxygen partial pressure, the deposition rate dropped from 40 nm min 1 at 560 V to<br />

18 nm min 1 at 460 V.<br />

Further investigations by using the XRD patterns in these working points show a<br />

strong increase of the g-phase from 460 to 560 V. At 560 V, all important g-peaks can<br />

be identified. For the g-Al2O3 the JCPDS card 10-425, for the substrate the JCPDS<br />

card 25-1047 and for the cubic TiAlN interlayer the JCPDS card 38-1420 for TiN and<br />

the JCPDS card 25-1495 for AlN are used [31]. These results were compared with<br />

those for the g-Al2O3 coating of the laboratory coater (Figure 8.17).<br />

This strong difference in the crystallinity can also be seen in the SEM images<br />

(Figure 8.16). Comparing the different working points 460 and 560 V on the<br />

industrial coating unit and the operation point of 310 V on the laboratory coater,<br />

only 560 and 310 V show all 100% intensity peaks of g-Al2O3, the h400i and h440i.<br />

With an increase in crystallinity of the deposited coating, the mechanical properties<br />

also changed massively. The hardness and Young s modulus are obtained by using<br />

nanoindentation. The hardness increased from 11.2 1.1 GPa at a deposition voltage

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!