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Thixoforming : Semi-solid Metal Processing

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Table 9.2 Temperature determination with and without correction of the emission coefficient.<br />

Unit<br />

Before determination of e After determination of e<br />

Emission<br />

Min.<br />

( C)<br />

Max.<br />

( C)<br />

Av.<br />

( C) Emission<br />

9.3 Thixocasting of Steel Alloysj333<br />

Min.<br />

( C)<br />

Max.<br />

( C)<br />

Av.<br />

( C)<br />

1.2343 1 84.2 160.8 114.1 0.506 127.5 243.5 173.1<br />

TZM Al2O3 IOT 1 152 185.2 162.6 0.711 187.2 227.9 200.2<br />

TZM Al 2O 3 MCh 1 95.1 147.7 132.7 0.729 115.4 179.1 161<br />

TZM Al2O3 IOT 1 97 113.7 108 0.678 123 144.3 137.1<br />

1.2343 Al 2O 3IOT 1 102.1 189.8 169.3 0.506 155 287 256.2<br />

1.2999 Al2O3 IOT 1 135 171.2 153.8 0.742 162.1 205.3 184.5<br />

1.2999 Al 2O 3 IOT 1 100.3 160 137.9 0.762 118.4 188.9 162.8<br />

1.2999 Al2O3 IOT 1 104.8 134.8 123.7 0.725 127.7 164.1 150.6<br />

1.2343 1 66.5 107.6 75 0.506 100 163.3 113.3<br />

CuCoBe 1 40.8 64.5 48.3 0.389 67.3 113.5 82.4<br />

TZM multilayer MCh 1 62.3 144.9 129.5 0.788 71.5 167.6 149.8<br />

Si3N4 massive 1 94.3 121.7 111.2 0.691 118.2 152.6 139.5<br />

1.2343 1 86.7 195.5 167.9 0.506 131.4 295.6 254.1<br />

Si3N4 soldered 1 165.2 259.1 228.4 0.977 167.6 262.8 231.6<br />

HSS 1 45.5 120 63.9 0.469 68.9 190.6 100.1<br />

1.2343 1 66.3 118.8 94.6 0.506 99.6 180.3 143.5<br />

Figure 9.22 shows a thermograph of a component approximately 5 s after the<br />

conclusion of the filling of the form. The biscuit itself is no longer very hot at 520 C<br />

because it is only a few millimetres thick, which considerably increases the process<br />

reliability. The area of the oxide restrainer belongs, at over 730 C, to the hottest zones.<br />

The part does not show any rips which could be recognized as fine, bright lines. It<br />

becomes visible that the different component thicknesses of 10 mm (in step 1)<br />

and 5 mm cause a difference in temperature on the surface of over 250 C.<br />

The temperature seems to rise within 5 mm of the plate end. This can be explained<br />

by a transport of ceramic mould release agents by the flowing front and the<br />

consequent increase in the emission coefficient.<br />

The thermography of the tool surfaces directly after the removal of the component<br />

shows clear differences for the single tool areas and materials. The centrally<br />

inrushing material leads to strong heating of the runner and particularly the exposed<br />

corners (315 C). The redirection of the vertically flowing SSM makes a strong energy<br />

contribution to the surfaces above and below the gating.<br />

The influence of the different tool materials can be clearly recognized. The silicon<br />

nitride ceramic shows the highest temperature, over 300 C.<br />

Against this, the copper insert on the other side is at only 80 C because of its<br />

extremely high heat conductivity. The tests showed that the strength of the lowmelting<br />

copper-based material is great enough for that process because the heat<br />

conductivity is improved by around a factor of 10 compared with steels of the same<br />

specific heat capacity.

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