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Thixoforming : Semi-solid Metal Processing

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302j 8 Tool Technologies for Forming of <strong>Semi</strong>-<strong>solid</strong> <strong>Metal</strong>s<br />

semi-<strong>solid</strong> processing of steel, in a first approach. Although ceramic coatings on<br />

metal substrates are one possible strategy to benefit from these properties, this<br />

implies that tools need to be cooled during operation. Consequently, the process<br />

layout is determined by the thermal boundary conditions, limiting the applicability of<br />

bulk ceramics to those exhibiting the highest available thermal shock resistance and<br />

fracture toughness, that is, silicon nitride. The suitability of silicon nitride has been<br />

demonstrated, the operating limits identified and design guidelines derived. Conversely,<br />

this process layout leads to restrictions on work piece quality and geometric<br />

complexity of produced parts due to rapid <strong>solid</strong>ification.<br />

Hence an alternative bulk ceramic tool concept based on the separation of<br />

forming and <strong>solid</strong>ification has been introduced, increasing freedom of shape<br />

and allowing for the application of highly corrosion-resistant but thermal<br />

shock-sensitive ceramics. The viability of this tool concept has been demonstrated<br />

on the example of thixoextrusion. Forming results and work piece quality are highly<br />

encouraging, opening new perspectives for future metal forming processes.<br />

List of Symbols and Abbreviations<br />

a deposition rate [nm s 1 ]<br />

AIP arc ion plating<br />

Al2O3 aluminium oxide<br />

Al2TiO5 aluminium titanate<br />

b empirical constant [g cm 3 ]<br />

CrAlN chromium aluminium nitride<br />

CTE coefficient of thermal expansion<br />

CVD chemical vapour deposition<br />

DC direct current<br />

E elastic modulus of a porous body [GPa]<br />

E0 elastic modulus of a non-porous body [GPa]<br />

EDS energy-dispersive spectroscopy<br />

FC critical load [N]<br />

GPSN gas pressure sintered silicon nitride<br />

HPDC high-pressure die casting<br />

HSS high-speed-steel<br />

JCPDS Joint Committee on Powder Diffraction Standards<br />

m.f. middle frequency<br />

MSIP magnetron sputter ion plating<br />

NIF normalized ion flux<br />

OES optical emission spectroscopy<br />

P pore volume fraction [g cm 3 ]<br />

PC precursor content [%]<br />

PD power density [Wcm 2 ]<br />

PECVD plasma-enhanced chemical vapour deposition<br />

precursor ratio<br />

PR

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