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134 4 Optical Components of Sensors Fig. 4.9. Second surface mirror. absorptive (varies at different wavelengths), and transmitted, which is whatever is left after reflection and absorption. Because all windows are characterized by specific spectral transmissions, often they are called filters. 4.4 Mirrors A mirror is the oldest optical instrument ever used or designed. Whenever light passes from one medium to another, there is some reflection. To enhance a reflectivity, a single or multilayer reflecting coating is applied either on the front (first surface) or the rear (second surface) of a plane-parallel plate or other substrate of any desirable shape. The first surface mirrors are the most accurate. In the second surface mirror, light must enter a plate having, generally, a different index of refraction than the outside medium. Several effects in the second surface mirror must be taken into consideration. First, due to the refractive index n of a plate, a reflective surface appears closer (Fig. 4.9). The virtual thickness d of the carrier for smaller angles 1 may be found from a simple formula: d ≈ L n . (4.22) The front surface of the second surface mirror may also reflect a substantial amount of light, creating the so-called ghost reflection. For instance, a glass plate reflects about 4% of visible light. Further, a carrier material may have a substantial absorption in the wavelength of interest. For instance, if a mirror operates in a farinfrared spectral range, it should use either first surface metallization or a second
4.4 Mirrors 135 Fig. 4.10. Spectral reflectances of some mirror coatings. surface where the substrate is fabricated of ZnSe or other long-wavelength transparent materials. Materials such as Si or Ge have too strong a surface reflectivity to be useful for the fabrication of the second surface mirrors. Reflecting coatings applied to a surface for operation in the visible and nearinfrared ranges can be silver, aluminum, chromium, and rhodium. Gold is preferable for the far-infrared spectral range devices. By selecting an appropriate coating, the reflectance may be achieved of any desired value from 0 to 1 (Fig. 4.10). The best mirrors for broadband use have pure metallic layers, vacuum-deposited or electrolytically deposited on glass, fused silica, or metal substrates. Before the reflective layer deposition, to achieve a leveling effect a mirror may be given an undercoat of copper, zirconium–copper, or molybdenum. Another useful reflector which may serve as a second surface mirror without the need for reflective coatings is a prism, where the effect of total internal reflection (TIR) is used. The angle of a total internal reflection is a function of the refractive index: ( 1 0 = arcsin . (4.23) n) The total internal reflectors are the most efficient in the visible and near-infrared spectral ranges, as the reflectivity coefficient is close to unity. The TIR principle is fundamental for the operation of the optical fibers. A reflective surface may be formed practically in any shape to divert the direction of light travel. In the optical systems, curved mirrors produce effects equivalent to that of lenses. The advantages they offer include (1) higher transmission, especially in the longer-wavelength spectral range, where lenses become less efficient due to
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HANDBOOK OF MODERN SENSORS PHYSICS,
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HANDBOOK OF MODERN SENSORS PHYSICS,
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To the memory of my father
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Preface Seven years have passed sin
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Contents Preface ..................
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Contents XI 4.5 Lenses ............
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Contents XIII 7.7.1 Micropower Impu
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Contents XV 15 Radiation Detectors
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Contents XVII Table A.9 Physical Pr
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1 Data Acquisition “It’s as lar
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1.1 Sensors, Signals, and Systems 3
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1.1 Sensors, Signals, and Systems 5
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1.2 Sensor Classification 7 oscillo
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1.3 Units of Measurements 9 Table 1
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Table 1.7. SI Basic Units Reference
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2 Sensor Characteristics “O, what
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2.2 Span (Full-Scale Input) 15 Fig.
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2.4 Accuracy 17 2.4 Accuracy Avery
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2.6 Calibration Error 19 To compute
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2.8 Nonlinearity 21 Fig. 2.4. Trans
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2.12 Resolution 23 (A) (B) Fig. 2.7
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2.16 Dynamic Characteristics 25 2.1
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2.16 Dynamic Characteristics 27 Sub
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2.17 Environmental Factors 29 2.17
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2.18 Reliability 31 guide. For inst
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2.20 Uncertainty 33 • Thermal sho
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Table 2.2. Uncertainty Budget for T
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3 Physical Principles of Sensing
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3.1 Electric Charges, Fields, and P
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3.2 Capacitance 45 The capacitor ma
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3.2 Capacitance 47 (A) (B) Fig. 3.6
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3.2 Capacitance 49 h 0 (A) (B) Fig.
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3.3 Magnetism 51 N S S N (A) (B) Fi
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3.3 Magnetism 53 electric charge ca
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3.3 Magnetism 55 3.3.3 Toroid Anoth
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3.4 Induction 57 • Changing the o
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3.5 Resistance 59 Fig. 3.16. Voltag
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3.5 Resistance 61 For pure resistan
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3.5 Resistance 63 resistor) and the
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3.5 Resistance 65 Fig. 3.19. Strain
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3.6 Piezoelectric Effect 67 (A) (B)
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3.6 Piezoelectric Effect 69 Another
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3.6 Piezoelectric Effect 71 Another
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3.6 Piezoelectric Effect 73 absorpt
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3.6 Piezoelectric Effect 75 that en
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3.7 Pyroelectric Effect 77 circuit
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3.7 Pyroelectric Effect 79 through
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3.7 Pyroelectric Effect 81 Fig. 3.2
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Page 112 and 113: 3.10 Sound Waves 93 If we consider
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Page 118 and 119: 3.12 Heat Transfer 99 to about 35
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Page 138 and 139: References 119 specified and three
Page 140 and 141: References 121 34. Thomson, W. On t
Page 142 and 143: 124 4 Optical Components of Sensors
Page 168 and 169: 150 Optical Components of Sensors 1
Page 170 and 171: 5 Interface Electronic Circuits 5.1
Page 172 and 173: 5.1 Input Characteristics of Interf
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Page 176 and 177: 5.2 Amplifiers 157 (A) (B) Fig. 5.5
Page 178 and 179: 5.2 Amplifiers 159 Fig. 5.7. Voltag
Page 180 and 181: 5.2 Amplifiers 161 (A) (B) Fig. 5.9
Page 182 and 183: 5.2 Amplifiers 163 Fig. 5.11. An eq
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Page 186 and 187: 5.3 Excitation Circuits 167 (A) (B)
Page 188 and 189: 5.3 Excitation Circuits 169 Fig. 5.
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Page 192 and 193: 5.3 Excitation Circuits 173 (A) (B)
Page 194 and 195: 5.4 Analog-to-Digital Converters 17
Page 196 and 197: Table 5.2. Binary Bit Weights and R
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5.4 Analog-to-Digital Converters 18
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5.4 Analog-to-Digital Converters 18
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5.5 Direct Digitization and Process
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5.5 Direct Digitization and Process
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5.6 Ratiometric Circuits 191 (A) (B
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5.7 Bridge Circuits 193 determine t
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5.7 Bridge Circuits 195 Fig. 5.38.
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5.7 Bridge Circuits 197 Fig. 5.39.
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It can be solved for the temperatur
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5.8 Data Transmission 201 (A) (B) (
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5.8 Data Transmission 203 wire meth
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5.9 Noise in Sensors and Circuits 2
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5.10 Batteries for Low Power Sensor
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References 225 nickel-metal hydrate
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6 Occupancy and Motion Detectors Se
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6.2 Microwave Motion Detectors 229
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6.2 Microwave Motion Detectors 231
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6.3 Capacitive Occupancy Detectors
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6.3 Capacitive Occupancy Detectors
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6.4 Triboelectric Detectors 237 6.4
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6.5 Optoelectronic Motion Detectors
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and the facet pitch is 6.5 Optoelec
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References 251 Fig. 6.17. Calculate
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7 Position, Displacement, and Level
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7.1 Potentiometric Sensors 255 (A)
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7.2 Gravitational Sensors 257 (A) (
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7.3 Capacitive Sensors 259 (A) (B)
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7.3 Capacitive Sensors 261 Fig. 7.7
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7.4 Inductive and Magnetic Sensors
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7.5 Optical Sensors 275 Therefore,
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7.5 Optical Sensors 277 (A) (B) (C)
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7.5 Optical Sensors 279 (A) (B) Fig
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7.5 Optical Sensors 281 Fig. 7.32.
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7.5 Optical Sensors 283 (A) (B) (C)
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7.5 Optical Sensors 285 is proporti
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7.6 Ultrasonic Sensors 287 (A) (B)
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7.7 Radar Sensors 289 (A) (B) Fig.
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7.7 Radar Sensors 291 (A) (B) Fig.
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7.8 Thickness and Level Sensors 293
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References 299 8. Dakin, J. P., Wad
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8 Velocity and Acceleration Acceler
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8.1 Accelerometer Characteristics 3
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8.2 Capacitive Accelerometers 305 a
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8.3 Piezoresistive Accelerometers 3
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8.5 Thermal Accelerometers 309 Fig.
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8.5 Thermal Accelerometers 311 forc
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8.6 Gyroscopes 313 8.6 Gyroscopes N
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8.6 Gyroscopes 315 (A) (B) Fig. 8.1
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8.6 Gyroscopes 317 Products Company
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8.7 Piezoelectric Cables 319 (A) (B
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References 321 (A) (B) Fig. 8.16.Ap
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9 Force, Strain, and Tactile Sensor
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9.1 Strain Gauges 325 (A) (B) Fig.
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9.2 Tactile Sensors 327 9.2 Tactile
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9.2 Tactile Sensors 329 (A) (B) Fig
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9.2 Tactile Sensors 331 Fig. 9.7. P
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9.2 Tactile Sensors 333 Fig. 9.9. T
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9.3 Piezoelectric Force Sensors 335
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References 337 14. Karrer, E. and L
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10 Pressure Sensors “To learn som
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10.3 Mercury Pressure Sensor 341 1
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10.4 Bellows, Membranes, and Thin P
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10.5 Piezoresistive Sensors 345 Fig
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10.5 Piezoresistive Sensors 347 bri
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10.6 Capacitive Sensors 349 (A) (B)
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10.7 VRP Sensors 351 (A) (B) Fig. 1
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10.8 Optoelectronic Sensors 353 Fig
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10.9 Vacuum Sensors 355 (A) (B) Fig
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References 357 (A) (B) (C) Fig. 10.
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11 Flow Sensors It’s a simple tas
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11.2 Pressure Gradient Technique 36
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11.3 Thermal Transport Sensors 363
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11.3 Thermal Transport Sensors 365
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11.4 Ultrasonic Sensors 367 A senso
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11.4 Ultrasonic Sensors 369 Fig. 11
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induced in the liquid. The magnitud
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11.6 Microflow Sensors 373 (A) (B)
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11.7 Breeze Sensor 375 (A) (B) Fig.
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11.9 Drag Force Flow Sensors 377 Wi
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References 379 11. Philip-Chandy, R
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12 Acoustic Sensors “Your ears wi
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12.3 Fiber-Optic Microphone 383 (A)
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12.4 Piezoelectric Microphones 385
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12.5 Electret Microphones 387 Fig.
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12.6 Solid-State Acoustic Detectors
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References 391 References 1. Hohm,
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13 Humidity and Moisture Sensors 13
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13.1 Concept of Humidity 395 Table
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13.2 Capacitive Sensors 397 Fig. 13
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13.3 Electrical Conductivity Sensor
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13.4 Thermal Conductivity Sensor 40
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13.6 Oscillating Hygrometer 403 chi
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References 405 9. Jachowicz, R. S.
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14 Light Detectors “There is noth
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14.1 Introduction 409 Table 14.1. B
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14.2 Photodiodes 411 Maximum revers
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14.2 Photodiodes 413 when i = 0), w
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14.2 Photodiodes 415 (A) (B) (C) Fi
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14.2 Photodiodes 417 Fig. 14.9. Res
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14.3 Phototransistor 419 Fig. 14.12
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14.4 Photoresistors 421 (A) (B) Fig
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14.5 Cooled Detectors 423 (A) (B) F
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14.6 Thermal Detectors 425 Table 14
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14.6 Thermal Detectors 427 Fig. 14.
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Table 14.3. Typical Specifications
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14.6 Thermal Detectors 431 A dual e
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14.6 Thermal Detectors 433 Fig. 14.
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14.6 Thermal Detectors 435 (A) (B)
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14.6 Thermal Detectors 437 Section
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14.7 Gas Flame Detectors 439 P = V
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References 441 housing assures wide
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15 Radiation Detectors Figure 3.41
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15.1 Scintillating Detectors 445 Fi
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15.2 Ionization Detectors 447 emitt
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15.2 Ionization Detectors 449 Fig.
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15.2 Ionization Detectors 451 parti
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15.2 Ionization Detectors 453 There
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References 455 the pure intrinsic t
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16 Temperature Sensors When a scien
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16 Temperature Sensors 459 from whi
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16.1 Thermoresistive Sensors 461 2.
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16.1 Thermoresistive Sensors 463 Ta
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16.1 Thermoresistive Sensors 465 Fi
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16.1 Thermoresistive Sensors 467 pr
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16.1 Thermoresistive Sensors 475 (m
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16.2 Thermoelectric Contact Sensors
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16.3 Semiconductor P-N Junction Sen
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16.4 Optical Temperature Sensors 49
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16.4 Optical Temperature Sensors 49
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16.5 Acoustic Temperature Sensor 49
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References 497 plate—the so-calle
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17 Chemical Sensors 1 Chemical sens
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17.3 Classification of Chemical-Sen
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17.4 Direct Sensors 503 17.4 Direct
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17.4 Direct Sensors 505 voltage e.
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17.4 Direct Sensors 507 This reacti
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17.4 Direct Sensors 509 (A) (B) Fig
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17.4 Direct Sensors 511 µm thick a
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17.5 Complex Sensors 513 Fig. 17.11
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17.5 Complex Sensors 515 Fig. 17.12
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17.5 Complex Sensors 517 frequency
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Table 17.1. SAW Chemical Sensors 17
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17.6 Chemical Sensors Versus Instru
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References 531 13. LaCourse, W.R. P
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18 Sensor Materials and Technologie
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18.1 Materials 535 etching is a key
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18.1 Materials 537 Fig. 18.3. The a
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18.1 Materials 539 The following is
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18.1 Materials 541 should be consid
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18.2 Surface Processing 543 sensor
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18.2 Surface Processing 545 On a co
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18.3 Nano-Technology 547 6000-Å la
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18.3 Nano-Technology 549 exposed to
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18.3 Nano-Technology 551 Fig. 18.10
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18.3 Nano-Technology 553 (A) (B) Fi
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References 555 Fig. 18.17. Bonding
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Appendix Table A.1. Chemical Symbol
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Table A.4. SI Conversion Multiples
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Table A.4 Continued Light cd/in. 2
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Table A.4 Continued Cup 2.36588 ×
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Appendix 565 Table A.7. Some Materi
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Appendix 567 Table A.11. Thermoelec
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Table A.14. Mechanical Properties o
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Appendix 571 Table A.18. Typical Em
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Table A.20. Characteristics of C-Zn
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Table A.23 Continued Manufacturer P
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Table A.25. Properties of Glasses S
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Index α-particles, 443 A/D, 175, 1
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Index 581 Coulomb’s law, 40 cross
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Index 583 H 2 O, 108 Hall, 82 Hall
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Index 585 occupancy sensors, 227 od
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Index 587 SAW, 75, 388, 404, 496, 5
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Index 589 velocity sensor, 302 vert
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