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handbook of modern sensors

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11.6 Micr<strong>of</strong>low Sensors 373<br />

(A)<br />

(B)<br />

Fig. 11.13. Gas micr<strong>of</strong>low sensor with self-heating titanium resistors: (A) sensor design; (B) interface<br />

circuit: R u and R d are resistances <strong>of</strong> the upstream and downstream heaters, respectively.<br />

(Adapted from Ref. [7].)<br />

sensor’s surface:<br />

∂ 2 T<br />

∂x 2 + ∂2 T<br />

∂y 2 = vnc p ∂T<br />

k g ∂x<br />

for y>0, (11.25)<br />

where n is the gas density, c p is the molecular gas capacity, and k g is the thermal<br />

conductivity <strong>of</strong> gas. It can be shown that the solution <strong>of</strong> this equation for the boundary<br />

condition <strong>of</strong> a vanishing thermal gradient far <strong>of</strong>f the surface is [7]<br />

(<br />

)<br />

1<br />

V = B √<br />

µ 2 + 1 − 1 , (11.26)<br />

where V is the input voltage, B is a constant, and µ = Lvnc p /2πk g , and L is the gas<br />

sensor contact length. This solution coincides very well with the experimental data.<br />

Another design <strong>of</strong> a thermal transport microsensor is shown in Fig. 11.13A [8]<br />

where titanium films having a thickness <strong>of</strong> 0.1 µm serve as both the temperature<br />

<strong>sensors</strong> and the heaters. The films are sandwiched between two layers <strong>of</strong> SiO 2 . Titanium<br />

was used because <strong>of</strong> its high TCR (temperature coefficient <strong>of</strong> resistance) and<br />

excellent adhesion to SiO 2 . Two microheaters are suspended with four silicon girders<br />

at a distance <strong>of</strong> 20 µm from one another. The Ti film resistance is about 2 k.<br />

Figure 11.13B shows a simplified circuit diagram for the sensor, which exhibits an<br />

almost linear relationship between the flow and output voltage V .<br />

A micr<strong>of</strong>low sensor can be constructed by utilizing a capacitive pressure sensor<br />

[9] as shown in Fig. 11.14. An operating principle <strong>of</strong> the sensor is based on a<br />

pressure gradient technique as described in Section 11.2. The sensor was fabricated<br />

using silicon micromachining and defused boron etch-stops to define the structure.<br />

The gas enters the sensor’s housing at pressure P 1 through the inlet, and the same<br />

pressure is established around the silicon plate, including the outer side <strong>of</strong> the etched<br />

membrane. The gas flows into the microsensor’s cavity through a narrow channel<br />

having a relatively high-pressure resistance. As a result, pressure P 2 inside the cavity

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