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handbook of modern sensors

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436 14 Light Detectors<br />

(A)<br />

(B)<br />

Fig. 14.26. Platinum-film bolometer: (A) glass membrane over the etched cavity; (B) array <strong>of</strong><br />

bolometers.<br />

Fig. 14.27. Germanium-film bolometer floating over the silicon<br />

cavity. (Courtesy <strong>of</strong> Pr<strong>of</strong>essor J. Shie.)<br />

sensitivity and where the cost <strong>of</strong> fabrication is a critical factor, a platinum-film bolometer<br />

is an attractive choice. Platinum has a small but predictive temperature coefficient<br />

<strong>of</strong> resistivity.<br />

The platinum film (having thickness <strong>of</strong> about 500 Å) is deposited and photolithographically<br />

patterned over the thin glass membrane. The membrane is supported in the<br />

cavity etched in silicon by tiny extended leads. Thus, the membrane plate is virtually<br />

floating over the V-grooved cavity in the Si substrate. This helps to dramatically minimize<br />

its thermal coupling with the substrate. Figure 14.26B shows a microphotograph<br />

<strong>of</strong> an array <strong>of</strong> the Pt bolometers used for the thermal imaging.<br />

In addition to platinum, many other materials may be used as temperaturesensitive<br />

resistors, (e.g., polysilicon, germanium, TaNO, and others). An important<br />

issue when selecting a particular material is its compatibility with a standard CMOS<br />

process so that a full monolithic device can be fabricated on a single silicon chip,<br />

including the interface electronic circuit. Thus, polysilicon is an attractive choice,<br />

along with the deposition <strong>of</strong> germanium films (Fig. 14.27).<br />

As follows from Eq. (14.27), one <strong>of</strong> the critical issues which always must be resolved<br />

when designing a bolometer (or any other accurate temperature sensor, for that<br />

matter) is to assure good thermal insulation <strong>of</strong> the sensing element from a supporting<br />

structure, connecting wires, and interface electronics. Otherwise, heat loss from the<br />

element may result in large errors and reduced sensitivity. One method for achieving<br />

this is to completely eliminate any metal conductors and to measure the temperature<br />

<strong>of</strong> the bolometer by using a fiber-optic technique, as has been implemented in the<br />

E-field probe fabricated by Luxtron (Mountain View, CA; (U.S. patent 4,816,634).<br />

In the design (Fig. 14.25B), a miniature bolometer is suspended in the end <strong>of</strong> an<br />

optical probe and its temperature is measured by a fluoroptic temperature sensor (see

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