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18.1 Materials 539 The following is a nonexhaustive list of thermoplastics: ABS (acrylonitrile–butadiene–styrene) is very tough, yet hard and rigid. It has fair chemical resistance, low water absorption, and good dimensional stability. Some grades may be electroplated. Acrylic has high optical clarity and excellent resistance to outdoor weathering. This is a hard, glossy material with good electrical properties. It is available in a variety of colors. Fluoroplastics comprise a large family of materials (PTFE, FEP, PFA, CTFE, ECTFE, ETFE, and PFDF) with excellent electrical properties and chemical resistance, low friction, and outstanding stability at high temperatures. However, their strength is moderate and the cost is high. Nylon (polyimide) has outstanding toughness and wear resistance with a low coefficient of friction. It has good electrical and chemical properties. However, it is hygroscopic and dimensional stability is worst than in most other plastics. Polycarbonate has the highest impact resistance. It is transparent with excellent outdoor stability and resistance to creep under load. It may have some problems with chemicals. Polyester has excellent dimensional stability but is not suitable for outdoor use or for service in hot water. Polyethylene is lightweight and inexpensive with excellent chemical stability and good electrical properties. It has moderate transparency in the broad spectral range from visible to far infrared; it has poor dimensional and thermal stability. Polypropylene has outstanding resistance to flex and stress cracking with excellent chemical and electrical properties with good thermal stability. It is lightweight and inexpensive. Optical transparency is good down to the far-infrared spectral range. However, absorption and scattering of photons in the mid-infrared range is higher than in polyethylene. Polyurethane is tough, extremely abrasion, and impact resistant. It can be made into films and foams. It has good chemical and electrical properties; however, UV exposure degrades its quality. Another type of plastic is called thermoset, in which polymerization (curing) is done in two stages: one by the material manufacturer and the other by the molder. An example is phenolic, which during the molding process is liquefied under pressure, producing a cross-linking reaction between molecular chains. After it has been molded, a thermoset plastic has virtually all of its molecules interconnected with strong physical bonds, which are not heat reversible. In effect, curing, a thermoset is like cooking an egg. Once it is cooked, it will remain hard. In general, thermoset plastics resist higher temperatures and provide greater dimensional stability. This is the reason why such thermoset plastics such as polyester (reinforced) is used to make boat hulls and circuit-breaker components, epoxy is used to make printed circuit boards, and melamine is used to make dinnerware. On the other hand, thermoplastics offer higher impact strength, easier processing, and better adaptability to complex designs than do thermosets.
540 18 Sensor Materials and Technologies The thermoplastics that are most useful in sensor-related applications are the following. Alkyd has excellent electrical properties and very low moisture absorption. Allyl (diallyl phtalate) has outstanding dimensional stability and high heat and chemical resistance. Epoxy has exceptional mechanical strength, electrical properties, and adhesion to most of materials. Phenolic is a low-cost material. The color is limited to black and brown. Polyester (thermoplastic version) has a great variety of colors and may be transparent or opaque. Shrinkage is high. If two different monomers (A and B) are combined in a polymerization reaction, such a polymer is called copolymer. The final properties of a copolymer depend on the ratio of components A and B. Polymer mechanical properties can be modified by providing additives, such as fibers to increase strength and stiffness, plastisizers for flexibility, lubricants for easier molding, or UV stabilizers for better performance in sunlight. Another good way to control properties of plastics is to make polymer alloys or blends. Primarily this is done to retain properties of each component. Conductive plastics. Being a wonderful electrical isolators, plastic materials often require lamination with metal foil, painting with conductive paint, or metallization to give them electrical conductive properties, required for shielding.Another way of providing electrical conductivity is mixing plastics with conductive additives (e.g., graphite or metal fibers) or building composite plastic parts incorporating metal mesh. Piezoelectric plastics. These are made from PVF 2 , PVDF, and copolymers which are crystalline materials. Initially, they do not possess piezoelectric properties and must be poled either in high voltage or by corona discharge (Section 3.6 of Chapter 3). Metal electrodes are deposited on both sides of the film either by silkscreening or vacuum metallization. These films, in some applications are used instead of ceramics, because of their flexibility and stability against mechanical stress. Another advantage of the piezoelectric plastics is their ability to be formed into any desirable shape. 18.1.3 Metals From the sensor designer standpoint, there are two classes of metal: nonferrous and ferrous. Ferrous metals, like steel, are often used in combination with magnetic sensors to measure motion, distance, magnetic field strength, and so forth. Also, they are quite useful as magnetic shields. Nonferrous metals, on the other hand, are permeable to magnetic fields and used whenever these fields are of no concern. Nonferrous metals offer a wide variety of mechanical and electrical properties. When selecting a metal, one must consider not only its physical properties but also ease of mechanical processing. For example, copper has excellent thermal and electrical properties, yet it is difficult to machine; therefore, in many instances, aluminum
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HANDBOOK OF MODERN SENSORS PHYSICS,
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HANDBOOK OF MODERN SENSORS PHYSICS,
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To the memory of my father
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Preface Seven years have passed sin
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Contents Preface ..................
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Contents XI 4.5 Lenses ............
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Contents XIII 7.7.1 Micropower Impu
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Contents XV 15 Radiation Detectors
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Contents XVII Table A.9 Physical Pr
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1 Data Acquisition “It’s as lar
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1.1 Sensors, Signals, and Systems 3
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1.1 Sensors, Signals, and Systems 5
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1.2 Sensor Classification 7 oscillo
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1.3 Units of Measurements 9 Table 1
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Table 1.7. SI Basic Units Reference
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2 Sensor Characteristics “O, what
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2.2 Span (Full-Scale Input) 15 Fig.
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2.4 Accuracy 17 2.4 Accuracy Avery
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2.6 Calibration Error 19 To compute
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2.8 Nonlinearity 21 Fig. 2.4. Trans
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2.12 Resolution 23 (A) (B) Fig. 2.7
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2.16 Dynamic Characteristics 25 2.1
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2.16 Dynamic Characteristics 27 Sub
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2.17 Environmental Factors 29 2.17
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2.18 Reliability 31 guide. For inst
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2.20 Uncertainty 33 • Thermal sho
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Table 2.2. Uncertainty Budget for T
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3 Physical Principles of Sensing
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3.1 Electric Charges, Fields, and P
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3.2 Capacitance 45 The capacitor ma
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3.2 Capacitance 47 (A) (B) Fig. 3.6
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3.2 Capacitance 49 h 0 (A) (B) Fig.
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3.3 Magnetism 51 N S S N (A) (B) Fi
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3.3 Magnetism 53 electric charge ca
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3.3 Magnetism 55 3.3.3 Toroid Anoth
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3.4 Induction 57 • Changing the o
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3.5 Resistance 59 Fig. 3.16. Voltag
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3.5 Resistance 61 For pure resistan
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3.5 Resistance 63 resistor) and the
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3.5 Resistance 65 Fig. 3.19. Strain
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3.6 Piezoelectric Effect 67 (A) (B)
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3.6 Piezoelectric Effect 69 Another
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3.6 Piezoelectric Effect 71 Another
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3.6 Piezoelectric Effect 73 absorpt
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3.6 Piezoelectric Effect 75 that en
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3.7 Pyroelectric Effect 77 circuit
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3.7 Pyroelectric Effect 79 through
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3.7 Pyroelectric Effect 81 Fig. 3.2
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3.8 Hall Effect 83 Fig. 3.30. Hall
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Table 3.2. Typical Characteristics
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3.9 Seebeck and Peltier Effects 87
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3.10 Sound Waves 93 If we consider
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3.11 Temperature and Thermal Proper
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3.11 Temperature and Thermal Proper
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3.12 Heat Transfer 99 to about 35
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3.12 Heat Transfer 101 (A) (B) Fig.
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3.12 Heat Transfer 103 Fig. 3.41. S
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3.12 Heat Transfer 105 Fig. 3.42. S
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3.12 Heat Transfer 107 Fig. 3.44. W
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3.12 Heat Transfer 109 (A) (B) Fig.
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3.13 Light 111 [38] whose emissivit
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3.14 Dynamic Models of Sensor Eleme
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References 119 specified and three
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References 121 34. Thomson, W. On t
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124 4 Optical Components of Sensors
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150 Optical Components of Sensors 1
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5 Interface Electronic Circuits 5.1
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5.1 Input Characteristics of Interf
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5.1 Input Characteristics of Interf
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5.2 Amplifiers 157 (A) (B) Fig. 5.5
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5.2 Amplifiers 159 Fig. 5.7. Voltag
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5.2 Amplifiers 161 (A) (B) Fig. 5.9
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5.2 Amplifiers 163 Fig. 5.11. An eq
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5.3 Excitation Circuits 165 5.3.1 C
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5.3 Excitation Circuits 167 (A) (B)
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5.3 Excitation Circuits 169 Fig. 5.
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5.3 Excitation Circuits 171 atures.
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5.3 Excitation Circuits 173 (A) (B)
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5.4 Analog-to-Digital Converters 17
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Table 5.2. Binary Bit Weights and R
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5.5 Direct Digitization and Process
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5.5 Direct Digitization and Process
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5.6 Ratiometric Circuits 191 (A) (B
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5.7 Bridge Circuits 193 determine t
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5.7 Bridge Circuits 195 Fig. 5.38.
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5.7 Bridge Circuits 197 Fig. 5.39.
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It can be solved for the temperatur
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5.8 Data Transmission 201 (A) (B) (
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5.8 Data Transmission 203 wire meth
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5.9 Noise in Sensors and Circuits 2
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5.10 Batteries for Low Power Sensor
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References 225 nickel-metal hydrate
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6 Occupancy and Motion Detectors Se
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6.2 Microwave Motion Detectors 229
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6.2 Microwave Motion Detectors 231
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6.3 Capacitive Occupancy Detectors
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6.3 Capacitive Occupancy Detectors
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6.4 Triboelectric Detectors 237 6.4
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6.5 Optoelectronic Motion Detectors
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and the facet pitch is 6.5 Optoelec
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References 251 Fig. 6.17. Calculate
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7 Position, Displacement, and Level
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7.1 Potentiometric Sensors 255 (A)
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7.2 Gravitational Sensors 257 (A) (
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7.3 Capacitive Sensors 259 (A) (B)
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7.3 Capacitive Sensors 261 Fig. 7.7
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7.4 Inductive and Magnetic Sensors
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7.5 Optical Sensors 275 Therefore,
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7.5 Optical Sensors 277 (A) (B) (C)
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7.5 Optical Sensors 279 (A) (B) Fig
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7.5 Optical Sensors 281 Fig. 7.32.
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7.5 Optical Sensors 283 (A) (B) (C)
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7.5 Optical Sensors 285 is proporti
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7.6 Ultrasonic Sensors 287 (A) (B)
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7.7 Radar Sensors 289 (A) (B) Fig.
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7.7 Radar Sensors 291 (A) (B) Fig.
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7.8 Thickness and Level Sensors 293
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References 299 8. Dakin, J. P., Wad
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8 Velocity and Acceleration Acceler
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8.1 Accelerometer Characteristics 3
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8.2 Capacitive Accelerometers 305 a
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8.3 Piezoresistive Accelerometers 3
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8.5 Thermal Accelerometers 309 Fig.
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8.5 Thermal Accelerometers 311 forc
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8.6 Gyroscopes 313 8.6 Gyroscopes N
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8.6 Gyroscopes 315 (A) (B) Fig. 8.1
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8.6 Gyroscopes 317 Products Company
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8.7 Piezoelectric Cables 319 (A) (B
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References 321 (A) (B) Fig. 8.16.Ap
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9 Force, Strain, and Tactile Sensor
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9.1 Strain Gauges 325 (A) (B) Fig.
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9.2 Tactile Sensors 327 9.2 Tactile
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9.2 Tactile Sensors 329 (A) (B) Fig
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9.2 Tactile Sensors 331 Fig. 9.7. P
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9.2 Tactile Sensors 333 Fig. 9.9. T
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9.3 Piezoelectric Force Sensors 335
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References 337 14. Karrer, E. and L
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10 Pressure Sensors “To learn som
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10.3 Mercury Pressure Sensor 341 1
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10.4 Bellows, Membranes, and Thin P
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10.5 Piezoresistive Sensors 345 Fig
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10.5 Piezoresistive Sensors 347 bri
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10.6 Capacitive Sensors 349 (A) (B)
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10.7 VRP Sensors 351 (A) (B) Fig. 1
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10.8 Optoelectronic Sensors 353 Fig
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10.9 Vacuum Sensors 355 (A) (B) Fig
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References 357 (A) (B) (C) Fig. 10.
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11 Flow Sensors It’s a simple tas
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11.2 Pressure Gradient Technique 36
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11.3 Thermal Transport Sensors 363
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11.3 Thermal Transport Sensors 365
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11.4 Ultrasonic Sensors 367 A senso
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11.4 Ultrasonic Sensors 369 Fig. 11
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induced in the liquid. The magnitud
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11.6 Microflow Sensors 373 (A) (B)
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11.7 Breeze Sensor 375 (A) (B) Fig.
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11.9 Drag Force Flow Sensors 377 Wi
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References 379 11. Philip-Chandy, R
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12 Acoustic Sensors “Your ears wi
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12.3 Fiber-Optic Microphone 383 (A)
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12.4 Piezoelectric Microphones 385
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12.5 Electret Microphones 387 Fig.
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12.6 Solid-State Acoustic Detectors
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References 391 References 1. Hohm,
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13 Humidity and Moisture Sensors 13
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13.1 Concept of Humidity 395 Table
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13.2 Capacitive Sensors 397 Fig. 13
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13.3 Electrical Conductivity Sensor
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13.4 Thermal Conductivity Sensor 40
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13.6 Oscillating Hygrometer 403 chi
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References 405 9. Jachowicz, R. S.
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14 Light Detectors “There is noth
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14.1 Introduction 409 Table 14.1. B
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14.2 Photodiodes 411 Maximum revers
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14.2 Photodiodes 413 when i = 0), w
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14.2 Photodiodes 415 (A) (B) (C) Fi
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14.2 Photodiodes 417 Fig. 14.9. Res
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14.3 Phototransistor 419 Fig. 14.12
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14.4 Photoresistors 421 (A) (B) Fig
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14.5 Cooled Detectors 423 (A) (B) F
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14.6 Thermal Detectors 425 Table 14
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14.6 Thermal Detectors 427 Fig. 14.
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Table 14.3. Typical Specifications
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14.6 Thermal Detectors 431 A dual e
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14.6 Thermal Detectors 433 Fig. 14.
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14.6 Thermal Detectors 435 (A) (B)
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14.6 Thermal Detectors 437 Section
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14.7 Gas Flame Detectors 439 P = V
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References 441 housing assures wide
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15 Radiation Detectors Figure 3.41
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15.1 Scintillating Detectors 445 Fi
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15.2 Ionization Detectors 447 emitt
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15.2 Ionization Detectors 449 Fig.
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15.2 Ionization Detectors 451 parti
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15.2 Ionization Detectors 453 There
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References 455 the pure intrinsic t
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16 Temperature Sensors When a scien
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16 Temperature Sensors 459 from whi
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16.1 Thermoresistive Sensors 461 2.
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16.1 Thermoresistive Sensors 463 Ta
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16.1 Thermoresistive Sensors 465 Fi
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16.1 Thermoresistive Sensors 467 pr
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16.1 Thermoresistive Sensors 475 (m
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16.2 Thermoelectric Contact Sensors
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Page 516 and 517: References 497 plate—the so-calle
Page 518 and 519: 17 Chemical Sensors 1 Chemical sens
Page 520 and 521: 17.3 Classification of Chemical-Sen
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Page 536 and 537: 17.5 Complex Sensors 517 frequency
Page 538 and 539: Table 17.1. SAW Chemical Sensors 17
Page 540 and 541: 17.6 Chemical Sensors Versus Instru
Page 550 and 551: References 531 13. LaCourse, W.R. P
Page 552 and 553: 18 Sensor Materials and Technologie
Page 554 and 555: 18.1 Materials 535 etching is a key
Page 556 and 557: 18.1 Materials 537 Fig. 18.3. The a
Page 560 and 561: 18.1 Materials 541 should be consid
Page 562 and 563: 18.2 Surface Processing 543 sensor
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Page 566 and 567: 18.3 Nano-Technology 547 6000-Å la
Page 568 and 569: 18.3 Nano-Technology 549 exposed to
Page 570 and 571: 18.3 Nano-Technology 551 Fig. 18.10
Page 572 and 573: 18.3 Nano-Technology 553 (A) (B) Fi
Page 574 and 575: References 555 Fig. 18.17. Bonding
Page 576 and 577: Appendix Table A.1. Chemical Symbol
Page 578 and 579: Table A.4. SI Conversion Multiples
Page 580 and 581: Table A.4 Continued Light cd/in. 2
Page 582 and 583: Table A.4 Continued Cup 2.36588 ×
Page 584 and 585: Appendix 565 Table A.7. Some Materi
Page 586 and 587: Appendix 567 Table A.11. Thermoelec
Page 588 and 589: Table A.14. Mechanical Properties o
Page 590 and 591: Appendix 571 Table A.18. Typical Em
Page 592 and 593: Table A.20. Characteristics of C-Zn
Page 594 and 595: Table A.23 Continued Manufacturer P
Page 596 and 597: Table A.25. Properties of Glasses S
Page 598 and 599: Index α-particles, 443 A/D, 175, 1
Page 600 and 601: Index 581 Coulomb’s law, 40 cross
Page 602 and 603: Index 583 H 2 O, 108 Hall, 82 Hall
Page 604 and 605: Index 585 occupancy sensors, 227 od
Page 606 and 607: Index 587 SAW, 75, 388, 404, 496, 5
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Index 589 velocity sensor, 302 vert
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