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7.6 Ultrasonic Sensors 287 (A) (B) Fig. 7.38. Equivalent circuits for the (A) one- and (B) two-dimensional position-sensitive detectors. (Courtesy of Hamamatsu Photonics K.K., Japan.) optical range (as in a PSD) electromagnetic in the microwave range, acoustic, and so forth. Transmission and reception of the ultrasonic energy is a basis for very popular ultrasonic-range meters, and velocity detectors. Ultrasonic waves are mechanical acoustic waves covering the frequency range well beyond the capabilities of human ears (i.e., over 20 kHz). However, these frequencies may be quite perceptive by smaller animals, like dogs, cats, rodents, and insects. Indeed, the ultrasonic detectors are the biological ranging devices for bats and dolphins. When the waves are incident on an object, part of their energy is reflected. In many practical cases, the ultrasonic energy is reflected in a diffuse manner; that is, regardless of the direction from which the energy comes, it is reflected almost uniformly within a wide solid angle, which may approach 180 ◦ . If an object moves, the frequency of the reflected waves will differ from the transmitted waves. This is called the Doppler effect. 6 6 See Section 6.2 of Chapter 6 for the description of the Doppler effect for the microwaves. The effect is fully applicable to the propagation of any energy having a wave nature, including ultrasonic.
288 7 Position, Displacement, and Level (A) (B) Fig. 7.39. Ultrasonic distance measurement: (A) basic arrangement; (B) impedance characteristic of a piezoelectric transducer. The distance L 0 to the object can be calculated through the speed v of the ultrasonic waves in the media, and the angle, (Fig. 7.39A): L 0 = vt cos , (7.15) 2 where t is the time for the ultrasonic waves to travel to the object and back to the receiver. If a transmitter and a receiver are positioned close to each other as compared with the distance to the object, then cos ≈ 1. Ultrasonic waves have an obvious advantage over the microwaves: they propagate with the speed of sound, which is much slower than the speed of light at which microwaves propagate. Thus, the time t is much longer and its measurement can be accomplished easier and less expensively. To generate any mechanical waves, including ultrasonic, the movement of a surface is required. This movement creates compression and expansion of a medium, which can be gas (air), liquids, or solids. 7 The most common type of excitation device which can generate surface movement in the ultrasonic range is a piezoelectric transducer operating in the so-called motor mode. The name implies that the piezoelectric device directly converts electrical energy into mechanical energy. Figure 7.40A shows that the input voltage applied to the ceramic element causes it to flex and transmit ultrasonic waves. Because piezoelectricity is a reversible phenomenon, the ceramic generates voltage when incoming ultrasonic waves flex it. In other words, the element may work as both the transmitter and the receiver (a microphone). A typical operating frequency of the transmitting piezoelectric element is near 32 kHz. For better efficiency, the frequency of the driving oscillator should be adjusted to the resonant frequency f r of the piezoelectric ceramic (Fig. 7.39B), where the sensitivity and efficiency of the element is best. When the measurement circuit operates in a pulsed mode, the same piezoelectric element is used for both transmission and receiving. When the system requires the continuous transmission of ultrasonic waves, separate piezoelectric elements are employed for the transmitter 7 See Section 3.10 of Chapter 3 for description of sound waves.
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HANDBOOK OF MODERN SENSORS PHYSICS,
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HANDBOOK OF MODERN SENSORS PHYSICS,
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To the memory of my father
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Preface Seven years have passed sin
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Contents Preface ..................
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Contents XI 4.5 Lenses ............
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Contents XIII 7.7.1 Micropower Impu
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Contents XV 15 Radiation Detectors
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Contents XVII Table A.9 Physical Pr
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1 Data Acquisition “It’s as lar
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1.1 Sensors, Signals, and Systems 3
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1.1 Sensors, Signals, and Systems 5
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1.2 Sensor Classification 7 oscillo
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1.3 Units of Measurements 9 Table 1
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Table 1.7. SI Basic Units Reference
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2 Sensor Characteristics “O, what
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2.2 Span (Full-Scale Input) 15 Fig.
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2.4 Accuracy 17 2.4 Accuracy Avery
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2.6 Calibration Error 19 To compute
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2.8 Nonlinearity 21 Fig. 2.4. Trans
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2.12 Resolution 23 (A) (B) Fig. 2.7
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2.16 Dynamic Characteristics 25 2.1
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2.16 Dynamic Characteristics 27 Sub
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2.17 Environmental Factors 29 2.17
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2.18 Reliability 31 guide. For inst
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2.20 Uncertainty 33 • Thermal sho
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Table 2.2. Uncertainty Budget for T
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3 Physical Principles of Sensing
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3.1 Electric Charges, Fields, and P
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3.2 Capacitance 45 The capacitor ma
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3.2 Capacitance 47 (A) (B) Fig. 3.6
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3.2 Capacitance 49 h 0 (A) (B) Fig.
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3.3 Magnetism 51 N S S N (A) (B) Fi
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3.3 Magnetism 53 electric charge ca
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3.3 Magnetism 55 3.3.3 Toroid Anoth
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3.4 Induction 57 • Changing the o
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3.5 Resistance 59 Fig. 3.16. Voltag
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3.5 Resistance 61 For pure resistan
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3.5 Resistance 63 resistor) and the
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3.5 Resistance 65 Fig. 3.19. Strain
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3.6 Piezoelectric Effect 67 (A) (B)
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3.6 Piezoelectric Effect 69 Another
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3.6 Piezoelectric Effect 71 Another
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3.6 Piezoelectric Effect 73 absorpt
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3.6 Piezoelectric Effect 75 that en
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3.7 Pyroelectric Effect 77 circuit
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3.7 Pyroelectric Effect 79 through
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3.7 Pyroelectric Effect 81 Fig. 3.2
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3.8 Hall Effect 83 Fig. 3.30. Hall
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Table 3.2. Typical Characteristics
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3.9 Seebeck and Peltier Effects 87
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3.10 Sound Waves 93 If we consider
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3.11 Temperature and Thermal Proper
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3.11 Temperature and Thermal Proper
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3.12 Heat Transfer 99 to about 35
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3.12 Heat Transfer 101 (A) (B) Fig.
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3.12 Heat Transfer 103 Fig. 3.41. S
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3.12 Heat Transfer 105 Fig. 3.42. S
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3.12 Heat Transfer 107 Fig. 3.44. W
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3.12 Heat Transfer 109 (A) (B) Fig.
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3.13 Light 111 [38] whose emissivit
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3.14 Dynamic Models of Sensor Eleme
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References 119 specified and three
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References 121 34. Thomson, W. On t
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124 4 Optical Components of Sensors
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150 Optical Components of Sensors 1
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5 Interface Electronic Circuits 5.1
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5.1 Input Characteristics of Interf
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5.1 Input Characteristics of Interf
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5.2 Amplifiers 157 (A) (B) Fig. 5.5
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5.2 Amplifiers 159 Fig. 5.7. Voltag
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5.2 Amplifiers 161 (A) (B) Fig. 5.9
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5.2 Amplifiers 163 Fig. 5.11. An eq
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5.3 Excitation Circuits 165 5.3.1 C
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5.3 Excitation Circuits 167 (A) (B)
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5.3 Excitation Circuits 169 Fig. 5.
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5.3 Excitation Circuits 171 atures.
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5.3 Excitation Circuits 173 (A) (B)
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5.4 Analog-to-Digital Converters 17
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Table 5.2. Binary Bit Weights and R
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5.5 Direct Digitization and Process
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5.5 Direct Digitization and Process
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5.6 Ratiometric Circuits 191 (A) (B
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5.7 Bridge Circuits 193 determine t
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5.7 Bridge Circuits 195 Fig. 5.38.
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5.7 Bridge Circuits 197 Fig. 5.39.
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It can be solved for the temperatur
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5.8 Data Transmission 201 (A) (B) (
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5.8 Data Transmission 203 wire meth
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5.9 Noise in Sensors and Circuits 2
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5.10 Batteries for Low Power Sensor
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References 225 nickel-metal hydrate
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6 Occupancy and Motion Detectors Se
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6.2 Microwave Motion Detectors 229
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6.2 Microwave Motion Detectors 231
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6.3 Capacitive Occupancy Detectors
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6.3 Capacitive Occupancy Detectors
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Page 272 and 273: 7 Position, Displacement, and Level
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References 337 14. Karrer, E. and L
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10 Pressure Sensors “To learn som
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10.3 Mercury Pressure Sensor 341 1
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10.4 Bellows, Membranes, and Thin P
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10.5 Piezoresistive Sensors 345 Fig
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10.5 Piezoresistive Sensors 347 bri
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10.6 Capacitive Sensors 349 (A) (B)
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10.7 VRP Sensors 351 (A) (B) Fig. 1
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10.8 Optoelectronic Sensors 353 Fig
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10.9 Vacuum Sensors 355 (A) (B) Fig
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References 357 (A) (B) (C) Fig. 10.
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11 Flow Sensors It’s a simple tas
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11.2 Pressure Gradient Technique 36
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11.3 Thermal Transport Sensors 363
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11.3 Thermal Transport Sensors 365
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11.4 Ultrasonic Sensors 367 A senso
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11.4 Ultrasonic Sensors 369 Fig. 11
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induced in the liquid. The magnitud
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11.6 Microflow Sensors 373 (A) (B)
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11.7 Breeze Sensor 375 (A) (B) Fig.
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11.9 Drag Force Flow Sensors 377 Wi
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References 379 11. Philip-Chandy, R
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12 Acoustic Sensors “Your ears wi
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12.3 Fiber-Optic Microphone 383 (A)
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12.4 Piezoelectric Microphones 385
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12.5 Electret Microphones 387 Fig.
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12.6 Solid-State Acoustic Detectors
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References 391 References 1. Hohm,
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13 Humidity and Moisture Sensors 13
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13.1 Concept of Humidity 395 Table
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13.2 Capacitive Sensors 397 Fig. 13
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13.3 Electrical Conductivity Sensor
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13.4 Thermal Conductivity Sensor 40
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13.6 Oscillating Hygrometer 403 chi
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References 405 9. Jachowicz, R. S.
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14 Light Detectors “There is noth
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14.1 Introduction 409 Table 14.1. B
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14.2 Photodiodes 411 Maximum revers
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14.2 Photodiodes 413 when i = 0), w
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14.2 Photodiodes 415 (A) (B) (C) Fi
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14.2 Photodiodes 417 Fig. 14.9. Res
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14.3 Phototransistor 419 Fig. 14.12
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14.4 Photoresistors 421 (A) (B) Fig
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14.5 Cooled Detectors 423 (A) (B) F
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14.6 Thermal Detectors 425 Table 14
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14.6 Thermal Detectors 427 Fig. 14.
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Table 14.3. Typical Specifications
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14.6 Thermal Detectors 431 A dual e
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14.6 Thermal Detectors 433 Fig. 14.
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14.6 Thermal Detectors 435 (A) (B)
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14.6 Thermal Detectors 437 Section
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14.7 Gas Flame Detectors 439 P = V
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References 441 housing assures wide
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15 Radiation Detectors Figure 3.41
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15.1 Scintillating Detectors 445 Fi
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15.2 Ionization Detectors 447 emitt
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15.2 Ionization Detectors 449 Fig.
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15.2 Ionization Detectors 451 parti
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15.2 Ionization Detectors 453 There
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References 455 the pure intrinsic t
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16 Temperature Sensors When a scien
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16 Temperature Sensors 459 from whi
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16.1 Thermoresistive Sensors 461 2.
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16.1 Thermoresistive Sensors 463 Ta
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16.1 Thermoresistive Sensors 465 Fi
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16.1 Thermoresistive Sensors 467 pr
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16.1 Thermoresistive Sensors 475 (m
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16.2 Thermoelectric Contact Sensors
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16.3 Semiconductor P-N Junction Sen
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16.4 Optical Temperature Sensors 49
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16.4 Optical Temperature Sensors 49
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16.5 Acoustic Temperature Sensor 49
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References 497 plate—the so-calle
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17 Chemical Sensors 1 Chemical sens
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17.3 Classification of Chemical-Sen
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17.4 Direct Sensors 503 17.4 Direct
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17.4 Direct Sensors 505 voltage e.
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17.4 Direct Sensors 507 This reacti
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17.4 Direct Sensors 509 (A) (B) Fig
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17.4 Direct Sensors 511 µm thick a
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17.5 Complex Sensors 513 Fig. 17.11
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17.5 Complex Sensors 515 Fig. 17.12
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17.5 Complex Sensors 517 frequency
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Table 17.1. SAW Chemical Sensors 17
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17.6 Chemical Sensors Versus Instru
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References 531 13. LaCourse, W.R. P
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18 Sensor Materials and Technologie
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18.1 Materials 535 etching is a key
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18.1 Materials 537 Fig. 18.3. The a
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18.1 Materials 539 The following is
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18.1 Materials 541 should be consid
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18.2 Surface Processing 543 sensor
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18.2 Surface Processing 545 On a co
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18.3 Nano-Technology 547 6000-Å la
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18.3 Nano-Technology 549 exposed to
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18.3 Nano-Technology 551 Fig. 18.10
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18.3 Nano-Technology 553 (A) (B) Fi
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References 555 Fig. 18.17. Bonding
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Appendix Table A.1. Chemical Symbol
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Table A.4. SI Conversion Multiples
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Table A.4 Continued Light cd/in. 2
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Table A.4 Continued Cup 2.36588 ×
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Appendix 565 Table A.7. Some Materi
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Appendix 567 Table A.11. Thermoelec
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Table A.14. Mechanical Properties o
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Appendix 571 Table A.18. Typical Em
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Table A.20. Characteristics of C-Zn
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Table A.23 Continued Manufacturer P
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Table A.25. Properties of Glasses S
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Index α-particles, 443 A/D, 175, 1
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Index 581 Coulomb’s law, 40 cross
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Index 583 H 2 O, 108 Hall, 82 Hall
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Index 585 occupancy sensors, 227 od
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Index 587 SAW, 75, 388, 404, 496, 5
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Index 589 velocity sensor, 302 vert
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