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handbook of modern sensors

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348 10 Pressure Sensors<br />

(A)<br />

(B)<br />

Fig. 10.7. Absolute (A) and differential (B) pressure sensor packagings. (Copyright Motorola,<br />

Inc. Used with permission.)<br />

10.6B. For the same diaphragm dimensions and the same overall thickness <strong>of</strong> the<br />

chip, the SFB device is about 50% smaller.<br />

Pressure <strong>sensors</strong> are usually available in three basic configurations that permit<br />

measurement <strong>of</strong> absolute, differential, and gauge pressures. Absolute pressure, such<br />

a barometric pressure, is measured with respect to a reference vacuum chamber. The<br />

chamber may be either external or it can be built directly into the sensor (Fig. 10.7A).<br />

A differential pressure, such as the pressure drop in a pressure-differential flowmeter,<br />

is measured by applying pressure to opposite sides <strong>of</strong> the diaphragm simultaneously.<br />

Gauge pressure is measured with respect to some kind <strong>of</strong> reference pressure. An<br />

example is a blood pressure measurement which is done with respect to atmospheric<br />

pressure. Thus, gauge pressure is a special case <strong>of</strong> a differential pressure. Diaphragm<br />

and strain gauge designs are the same for all three configurations; the packaging makes<br />

them different. For example, to make a differential or gauge sensor, a silicon die is<br />

positioned inside the chamber (Fig. 10.7B), which has two openings at both sides<br />

<strong>of</strong> the die. To protect them from a harsh environment, the interior <strong>of</strong> the housing is<br />

filled with a silicone gel which isolates the die surface and wire bonds while allowing<br />

the pressure signal to be coupled to the silicon diaphragm. A differential sensor may<br />

be incorporated into various porting holders (Fig. 10.8). Certain applications, such<br />

as a hot water hammer, corrosive fluids, and load cells, require physical isolation<br />

and hydraulic coupling to the chip-carrier package. It can be done with additional<br />

Fig. 10.8. Examples <strong>of</strong> differential pressure packagings. (Copyright Motorola, Inc. Used with<br />

permission.)

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