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BULK MULTICRYSTALLINE SILICON 217<br />

1.2<br />

1.1<br />

Boron segregation<br />

Specific resistivity<br />

[Ω cm]<br />

1<br />

0.9<br />

0.8<br />

0.7<br />

0.6<br />

0.5<br />

0.4<br />

Measurement<br />

Theory (dopant segregation)<br />

0 0.2 0.4 0.6 0.8 1<br />

Block height (normalized)<br />

Figure 6.8 Decrease in the specific resistivity of p-type multicrystalline silicon due to segregation<br />

of the doping element boron<br />

6.3.3 Crystal Defects<br />

The main crystal defects in multicrystalline silicon are grain boundaries and dislocations.<br />

Concerning the attainable efficiencies of solar cells, not only the concentration of these<br />

defects but also their electrical activity is considered as crucial.<br />

With respect to the grain boundaries and the grain size, basically smaller grains<br />

are observed at the beginning of the crystallisation process in the ingot bottom part. With<br />

increasing block height, individual grains prevail at the expense of surrounding grains and<br />

thus give rise to an increase in the mean grain size. This increase of grain size, however,<br />

depends on the crystallisation speed (see Figure 6.9). A higher crystallisation speed also<br />

means higher temperature gradients and thus an increased probability for the formation<br />

of crystal seeds in the melt that in turn lead to a limitation of the grain size. This is also<br />

the reason for faster crystallised block-cast material usually exhibiting smaller grains than<br />

conventional Bridgman-type multicrystalline silicon.<br />

On the other hand, the grain sizes achieved with modern block-cast material are<br />

still large enough to not degrade solar cell efficiencies provided that the electrical activity<br />

of the grain boundaries is low enough. Grain boundaries and dislocations, if electrically<br />

charged, effectively attract minority charge carriers and consequently represent<br />

highly active recombination centres for photo-generated charge carriers. The electrical<br />

activity of grain boundaries and dislocations is determined by their impurity decoration<br />

(specifically by transition metals) and strongly increases with higher impurity<br />

concentrations.<br />

Moreover, it was discovered that the shape of the crystallisation front during solidification<br />

also has considerable influence on the grain boundary activity [19]. Preserving<br />

a strictly planar solidification front clearly leads to a reduced grain boundary activity.

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