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272 CRYSTALLINE SILICON SOLAR CELLS AND MODULES<br />

Starting material<br />

p-type silicon<br />

Damaged surfaces<br />

Saw damage etch<br />

Texture etch<br />

Phosphorous diffusion<br />

n diffusion<br />

Edge isolation<br />

AR coating<br />

ARC deposition<br />

Conductive paste<br />

Front-contact print<br />

Back-contact print<br />

Co-firing<br />

Testing and sorting<br />

Figure 7.6<br />

A typical processing sequence with schematic illustrations of the resulting structures<br />

a very bad quality and the defects can lead to wafer fracture during processing [68].<br />

For this reason, about ten microns are etched off from each face in alkaline or<br />

acid solutions. The wafers, in Teflon cassettes, are immersed in tanks containing the<br />

solution under temperature and composition control. Alkaline etches are preferred to<br />

acid solutions due to considerations of waste disposal.

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