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402 HIGH-EFFICIENCY III-V MULTIJUNCTION SOLAR CELLS<br />

1.0<br />

Internal quantum efficiency<br />

0.8<br />

0.6<br />

0.4<br />

0.2<br />

Emitter<br />

Depleted layer<br />

0.0<br />

2.0<br />

Base<br />

2.5<br />

3.0<br />

Photon energy<br />

[eV]<br />

3.5<br />

4.0<br />

Figure 9.16 Measured (crosses) and modeled (lines) quantum efficiency of a GaInP solar cell.<br />

The contributions from the different layers of the solar cell are labeled and demonstrate how the<br />

emitter dominates the blue response, whereas the base dominates the red response<br />

Internal quantum efficiency<br />

1.0<br />

0.8<br />

0.6<br />

0.4<br />

0.2<br />

S front = 10 4 cm/s<br />

L emitter = 0.5 µm<br />

Thick window = 25 nm<br />

S front = 10 7 cm/s<br />

L emitter = 0.5 µm<br />

No AlInP<br />

window<br />

S front =<br />

10 4 cm/s<br />

S front = 10 4 cm/s<br />

L emitter = 0.05 µm<br />

Internal quantum efficiency<br />

1.0<br />

0.8<br />

0.6<br />

0.4<br />

0.2<br />

3-µm<br />

base<br />

0.3-µm-thick base<br />

S back = 10 4 cm/s, L base = 3 µm<br />

S back = 10 7 cm/s, L base = 3 µm<br />

S back = 10 4 cm/s, L base = 1 µm<br />

0.0<br />

2.0<br />

2.5<br />

3.0<br />

Photon energy<br />

[eV]<br />

(a)<br />

3.5<br />

0.0<br />

1.8<br />

2.0<br />

2.2 2.4 2.6<br />

Photon energy<br />

[eV]<br />

(b)<br />

2.8<br />

3.0<br />

Figure 9.17 Modeled QE of GaInP cell. (a) The solid line, relative to the “no AlInP window”<br />

line, shows the effect of absorption of 25 nm of AlInP. The two lower curves show the degradation<br />

from an increased front-surface recombination velocity (S front ) or from a decreased emitter diffusion<br />

length (L emitter ). (b) Compares a thin and a thick GaInP cell<br />

thick base layer is more sensitive to the diffusion length in the base, whereas a cell with<br />

a thin base layer is relatively more sensitive to the quality of the back-surface field (see<br />

Figure 9.17(b)).<br />

There are numerous reasons why the V OC or FF may be degraded. Table 9.5 enumerates<br />

many of these, and Figure 9.18(a) illustrates one example.<br />

Extra junctions are more likely to be problems when working with Ge because III-<br />

V elements dope Ge and Ge dopes the III-V materials. The back of the Ge wafer must be<br />

etched before processing to avoid an extra junction at the back [100]. Accidental junctions<br />

in Ge are often highly shunted, with nearly ohmic I-V characteristics. In this case, these

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