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264 CRYSTALLINE SILICON SOLAR CELLS AND MODULES<br />

a low contact resistance to Si. Laboratory cells use photolithography and evaporation to<br />

form 10- to 15-µm metal fingers. Ti/Pd/Ag structures combine low contact resistance to<br />

n-Si and high bulk conductivity. These processes are not well suited to mass production<br />

that relies on thick-film technologies. Ag pastes are screen printed, resulting in over<br />

100-µm wide lines with higher bulk and contact resistance. Laser-grooved buried-grid<br />

(LGBG) industrial cells implement a finer metallization technology [50], which will be<br />

presented in Section 7.7.3.<br />

Coarser metallization techniques imply higher shading and resistance losses, and<br />

restrict the efficiency enhancement that could be achieved by internal cell design.<br />

7.3.3.2 Homogeneous emitters<br />

Under the metal lines, the substrate must be heavily doped to make the contact selective.<br />

Usually the doped region, the emitter, extends all across the front surface, acting as a<br />

“transparent electrode” by offering minority carriers in the substrate a low resistance path<br />

to the metal lines.<br />

When the exposed surface is not passivated (Figure 7.3a), the emitter should be<br />

as thin as possible, because the high SRV makes the light absorbed in this region poorly<br />

collected, and also highly doped to decrease recombination. On the other hand, a sufficient<br />

low-sheet resistance is to be achieved. The solution is to make very thin and highly doped<br />

emitters.<br />

If the surface is passivated (Figure 7.3b), the collection efficiency of the emitter can<br />

be raised by lowering the doping level thus avoiding heavy doping and other detrimental<br />

Metal<br />

n + emitter<br />

Passivating<br />

layer<br />

Metal<br />

n + emitter<br />

p substrate<br />

Contact<br />

window<br />

p substrate<br />

(a)<br />

(b)<br />

Passivating<br />

layer<br />

Metal<br />

n ++ n +<br />

Passivating<br />

layer<br />

Contact<br />

window<br />

Metal<br />

n ++<br />

Contact<br />

window<br />

p substrate<br />

p substrate<br />

(c)<br />

(d)<br />

Figure 7.3 Different emitter structures: (a) homogenous emitter without surface passivation;<br />

(b) homogenous emitter with surface passivation; (c) selective emitter; and (d) localized emitter

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