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PCT/1998/43 - World Intellectual Property Organization

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<strong>43</strong>/<strong>1998</strong><br />

15092 <strong>PCT</strong> Gazette - Section I - Gazette du <strong>PCT</strong> 29 Oct/oct <strong>1998</strong><br />

•<br />

PUCE A CONTACTS A BILLES ET CAS-<br />

SETTE AU FORMAT DES PUCES<br />

(71) FLIP CHIP TECHNOLOGIES, L.L.C. [US/US];<br />

3701 E. University Drive, Phoenix, AR 85034<br />

(US).<br />

(72) ELENIUS, Peter; 9885 E. Cochise, Scottsdale, AZ<br />

85258 (US). MALMROSE, Roger; 1773 Orchard<br />

Way, Pleasanton, CA 94566 (US).<br />

(74) GLAZER, Marvin, A. et al. / etc.; Cahill, Sutton<br />

& Thomas, P.L.C., Suite 155, 2141 E. Highland<br />

Avenue, Phoenix, AZ 85016 (US).<br />

(81) CA CN JP KR SG; EP (AT BE CH CY DE DK ES<br />

FI FR GB GR IE IT LU MC NL PT SE).<br />

(11) WO 98/48450 (13) A1<br />

(21) <strong>PCT</strong>/EP98/02083<br />

(22) 9 Apr/avr <strong>1998</strong> (09.04.<strong>1998</strong>)<br />

(25) de (26) de<br />

(31) 197 16 123.5 (32) 17 Apr/avr 1997<br />

(17.04.1997)<br />

(33) DE<br />

(<strong>43</strong>) 29 Oct/oct <strong>1998</strong> (29.10.<strong>1998</strong>)<br />

(51) 6 H01L 21/00<br />

(54) • DEVICE FOR CONVEYING SUBSTRATES<br />

THROUGH A SUBSTRATE PROCESSING<br />

PLANT<br />

• DISPOSITIF DE TRANSPORT DE SUB-<br />

STRATS A TRAVERS UNE INSTALLATION<br />

DE TRAITEMENT DE SUBSTRATS<br />

(71) STEAG HAMATECH GMBH MACHINES<br />

[DE/DE]; Ferdinand–von–Steinbeis–Ring 10,<br />

D–75447 Sternenfels (DE).<br />

(for all designated States except / pour tous les États<br />

désignés sauf US)<br />

(72, 75) WEBER, Klaus [DE/DE]; Friedenstrasse<br />

58, D–75015 Bretten (DE). MAHNER, Bernd<br />

[DE/DE]; Hindenburgstrasse 15, D–75417<br />

Mühlacker (DE).<br />

(81) CA CN IL JP KR SG US; EP (AT BE CH CY DE<br />

DK ES FI FR GB GR IE IT LU MC NL PT SE).<br />

Published / Publiée : (c)<br />

(11) WO 98/48451 (13) A1<br />

(21) <strong>PCT</strong>/JP98/01776<br />

(22) 17 Apr/avr <strong>1998</strong> (17.04.<strong>1998</strong>)<br />

(25) ja (26) ja<br />

(31) 9/101954 (32) 18 Apr/avr 1997<br />

(18.04.1997)<br />

(31) 9/104978 (32) 22 Apr/avr 1997<br />

(22.04.1997)<br />

(31) 9/233109 (32) 28 Aug/août 1997<br />

(28.08.1997)<br />

(33) JP<br />

(33) JP<br />

(33) JP<br />

(<strong>43</strong>) 29 Oct/oct <strong>1998</strong> (29.10.<strong>1998</strong>)<br />

(51) 6 H01L 21/027, G03F 7/20<br />

(54) • ALIGNER, EXPOSURE METHOD USING<br />

THE ALIGNER, AND METHOD OF MANU-<br />

FACTURE OF CIRCUIT DEVICE<br />

• ALIGNEUR, PROCEDE D’EXPOSITION<br />

METTANT EN OEUVRE LEDIT ALIGNEUR<br />

ET PROCEDE DE FABRICATION D’UN<br />

DISPOSITIF DE CIRCUIT<br />

(71) NIKON CORPORATION [JP/JP]; 2–3, Marunouchi<br />

3–chome, Chiyoda–ku, Tokyo 100–8331 (JP).<br />

(for all designated States except / pour tous les États<br />

désignés sauf US)<br />

(72, 75) NISHI, Kenji [JP/JP]; Nikon Corporation,<br />

2–3, Marunouchi 3–chome, Chiyoda–ku, Tokyo<br />

100–8331 (JP). KIUCHI, Toru [JP/JP];<br />

Nikon Corporation, 2–3, Marunouchi 3–chome,<br />

Chiyoda–ku, Tokyo 100–8331 (JP).<br />

(74) SHAMOTO, Ichio et al. / etc.; Yuasa and Hara,<br />

Section 206, New Ohtemachi Building, 2–1, Ohtemachi<br />

2–chome, Chiyoda–ku, Tokyo 100–0004<br />

(JP).<br />

(81) AL AM AT AU AZ BA BB BG BR BY CA CH<br />

CN CU CZ DE DK EE ES FI GB GE GH GM<br />

GW HU ID IL IS JP KE KG KR KZ LC LK LR<br />

LS LT LU LV MD MG MK MN MW MX NO NZ<br />

PL PT RO RU SD SE SG SI SK SL TJ TM TR<br />

TT UA UG US UZ VN YU ZW; AP (GH GM KE<br />

LS MW SD SZ UG ZW); EA (AM AZ BY KG<br />

KZ MD RU TJ TM); EP (AT BE CH CY DE DK<br />

ES FI FR GB GR IE IT LU MC NL PT SE); OA<br />

(BF BJ CF CG CI CM GA GN ML MR NE SN<br />

TD TG).<br />

(11) WO 98/48452 (13) A1<br />

(21) <strong>PCT</strong>/JP98/01777<br />

(22) 17 Apr/avr <strong>1998</strong> (17.04.<strong>1998</strong>)<br />

(25) ja (26) ja<br />

(31) 9/116255 (32) 18 Apr/avr 1997<br />

(18.04.1997)<br />

(31) 9/109748 (32) 25 Apr/avr 1997<br />

(25.04.1997)<br />

(31) 9/124527 (32) 14 May/mai 1997<br />

(14.05.1997)<br />

(<strong>43</strong>) 29 Oct/oct <strong>1998</strong> (29.10.<strong>1998</strong>)<br />

(33) JP<br />

(33) JP<br />

(33) JP<br />

(51) 6 H01L 21/027, G03F 7/20<br />

(54) • METHOD AND DEVICE FOR EXPOSURE<br />

CONTROL, METHOD AND DEVICE FOR<br />

EXPOSURE, AND METHOD OF MANUFAC-<br />

TURE OF DEVICE<br />

• PROCEDE ET DISPOSITIF DE COMMANDE<br />

DE L’EXPOSITION, PROCEDE ET DISPOSI-<br />

TIF D’EXPOSITION, ET PROCEDE DE FA-<br />

BRICATION DUDIT DISPOSITIF<br />

(71) NIKON CORPORATION [JP/JP]; 2–3, Marunouchi<br />

3–chome, Chiyoda–ku, Tokyo 100–8331 (JP).<br />

(for all designated States except / pour tous les États<br />

désignés sauf US)<br />

(72, 75) TANAKA, Yasuaki [JP/JP]; Nikon Corporation,<br />

2–3, Marunouchi 3–chome, Chiyoda–ku, Tokyo<br />

100–8331 (JP). NOBORU, Michio [JP/JP];<br />

Nikon Corporation, 2–3, Marunouchi 3–chome,<br />

Chiyoda–ku, Tokyo 100–8331 (JP).<br />

(74) SHAMOTO, Ichio et al. / etc.; Yuasa and Hara,<br />

Section 206, New Ohtemachi Building, 2–1, Ohtemachi<br />

2–chome, Chiyoda–ku, Tokyo 100–0004<br />

(JP).<br />

(81) AL AM AT AU AZ BA BB BG BR BY CA CH<br />

CN CU CZ DE DK EE ES FI GB GE GH GM<br />

GW HU ID IL IS JP KE KG KR KZ LC LK LR<br />

LS LT LU LV MD MG MK MN MW MX NO NZ<br />

PL PT RO RU SD SE SG SI SK SL TJ TM TR<br />

TT UA UG US UZ VN YU ZW; AP (GH GM KE<br />

LS MW SD SZ UG ZW); EA (AM AZ BY KG<br />

KZ MD RU TJ TM); EP (AT BE CH CY DE DK<br />

ES FI FR GB GR IE IT LU MC NL PT SE); OA<br />

(BF BJ CF CG CI CM GA GN ML MR NE SN<br />

TD TG).<br />

(11) WO 98/48453 (13) A1<br />

(21) <strong>PCT</strong>/US98/08107<br />

(22) 22 Apr/avr <strong>1998</strong> (22.04.<strong>1998</strong>)<br />

(25) en (26) en<br />

(31) 60/0<strong>43</strong>,975 (32) 23 Apr/avr 1997<br />

(23.04.1997)<br />

(33) US<br />

(<strong>43</strong>) 29 Oct/oct <strong>1998</strong> (29.10.<strong>1998</strong>)<br />

(51) 6 H01L 21/3105, C09G 1/02, C09K 3/14<br />

(54) • PLANARIZATION COMPOSITIONS FOR<br />

CMP OF INTERLAYER DIELECTRICS<br />

• COMPOSITIONS DE PLANARISATION CHI-<br />

MIOMECANIQUE DE DIELECTRIQUES IN-<br />

TERCOUCHES<br />

(71) ADVANCED CHEMICAL SYSTEMS INTER-<br />

NATIONAL, INC. [US/US]; 510 Alder Drive,<br />

Milpitas, CA 95035 (US).<br />

(72) BREWER, Richard; 1450 Almaden Valley Drive,<br />

San Jose, CA 95120 (US). GREBINSKI, Thomas,<br />

J.; 1920 Tallwood Lane, Boise, ID 83706<br />

(US). CURRIE, James, E.; Route 1, Hammond<br />

Hill Road, Box 47C, Dover Plains, NY 12522<br />

(US). JONES, Michael; 484–3 Madera Avenue,<br />

Sunnyvale, CA 94086 (US). MULLEE, William;<br />

10592 S.W. 63rd Drive, Portland, OR 97219 (US).<br />

NGUYEN, Ann; 3846 Glengrove Way, San Jose,<br />

CA 97219 (US).<br />

(74) FLIESLER, Martin, C. et al. / etc.; Fliesler,<br />

Dubb, Meyer and Lovejoy LLP, Suite 400,<br />

Four Embarcadero Center, San Francisco, CA<br />

94111–4156 (US).<br />

(81) AL AM AT AU AZ BA BB BG BR BY CA CH<br />

CN CU CZ DE DK EE ES FI GB GE GH GM<br />

GW HU ID IL IS JP KE KG KP KR KZ LC LK<br />

LR LS LT LU LV MD MG MK MN MW MX NO<br />

NZ PL PT RO RU SD SE SG SI SK SL TJ TM<br />

TR TT UA UG UZ VN YU ZW; AP (GH GM KE<br />

LS MW SD SZ UG ZW); EA (AM AZ BY KG<br />

KZ MD RU TJ TM); EP (AT BE CH CY DE DK<br />

ES FI FR GB GR IE IT LU MC NL PT SE); OA<br />

(BF BJ CF CG CI CM GA GN ML MR NE SN<br />

TD TG).<br />

(11) WO 98/48454 (13) A1<br />

(21) <strong>PCT</strong>/US98/04044<br />

(22) 3 Mar/mar <strong>1998</strong> (03.03.<strong>1998</strong>)<br />

(25) en (26) en<br />

(31) 08/847,374 (32) 22 Apr/avr 1997 (33) US<br />

(22.04.1997)<br />

(<strong>43</strong>) 29 Oct/oct <strong>1998</strong> (29.10.<strong>1998</strong>)<br />

(51) 6 H01L 21/48, 23/538, H05K 3/10, 3/46<br />

(54) • METHOD OF FORMING REDUNDANT<br />

SIGNAL TRACES AND CORRESPONDING<br />

ELECTRONIC COMPONENTS<br />

• PROCEDE DE FORMATION DE TRACES<br />

DU SIGNAL REDONDANTES ET DE<br />

COMPOSANTS ELECTRONIQUES COR-<br />

RESPONDANTS<br />

(71) W.L. GORE & ASSOCIATES, INC. [US/US];<br />

551 Paper Mill Road, P.O. Box 9206, Newark, DE<br />

19714 (US).<br />

(72) FISCHER, Paul, J.; 419 Southwood Court, Eau<br />

Claire, WI 54701 (US). GORRELL, Robin, E.;<br />

7163 Kern Drive, Eau Claire, WI 54701 (US).<br />

(74) CAMPBELL, John, S. et al. / etc.; W.L. Gore &<br />

Associates, Inc., 551 Paper Mill Road, P.O. Box<br />

9206, Newark, DE 19714–9206 (US).<br />

(81) AL AM AT AU AZ BA BB BG BR BY CA CH<br />

CN CU CZ DE DK EE ES FI GB GE GH HU IL<br />

IS JP KE KG KP KR KZ LC LK LR LS LT LU<br />

LV MD MG MK MN MW MX NO NZ PL PT RO<br />

RU SD SE SG SI SK SL TJ TM TR TT UA UG<br />

UZ VN YU ZW; EP (AT BE CH DE DK ES FI<br />

FR GB GR IE IT LU MC NL PT SE).<br />

(11) WO 98/48455 (13) A1<br />

(21) <strong>PCT</strong>/JP98/01805

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