1996 Electronics Industry Environmental Roadmap - Civil and ...

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Emerging Technologies self-aligned processes, silicon-on-insulators (SOI), tantalum oxide (Ta2O5), 3-D cell structures, and chip scale packaging—will be necessary, and the vision of that future is less clear ([31], p. 16): 90 “Beyond these trends, the direction of technology is largely uncharted with no consensus about which areas of innovation will be successful. In areas other than DRAM, it is even more difficult to find a consensus on the likely directions of technology.”
Emerging Technologies This chapter begins with a brief characterization of current processes in key areas of electronic system development: IC fabrication, packaging, interconnect, and assembly, along with a specific discussion of issues related to displays. The chapter then presents an overview of significant issues in advanced electronics production drawn from a synthesis of several of the major segment-specific roadmaps: SIA, IPC, NEMI, and OIDA. 17 The production trends reflected in these roadmaps are considered specifically in light of their environmental implications. Finally, the chapter identifies a set of “Grand Challenges” for environmental excellence—several fundamental challenges that, if effectively met, could significantly improve the state-of-the-art in environmentally conscious electronic systems manufacturing. 6.2 Overview of Current Processes Since current processes are likely to form the evolutionary foundation for technological advances through the immediate future, it is important to characterize the major processes of electronic systems production and consider the environmental issues inherent at each stage. In doing so, several contextual considerations relevant to the discussion in this chapter are important: The focus of this chapter is advanced electronics production, not final product packaging or use. Therefore, certain issues, such as technologies for energy conservation during use, are not discussed. It is fair to say that, in most cases, environmental considerations are not driving technology evolution. The real forces driving technology advancement are price, cost, performance, and market/user requirements. The exceptions to this occur when an externally imposed mandate forces attention on a specific challenge—for example, CFC elimination or alternatives to lead-based solders. However, to the extent that the trend is toward smaller devices, fewer processing steps, increased automation, etc., these evolving technologies will likely have a positive environmental impact at the unit production level—i.e., less materials, less chemicals, less waste related to each unit produced. The impact of this may be outweighed, somewhat, by the increasing demand for electronic devices in every conceivable product, and the resulting increase in total unit output. Generally speaking, the interest of environmental process improvement will be served by the continuing development of new technologies. Furthermore, technology advances that have environmental implications at the upstream processing stage may well have significant benefits in the later stages of systems development and production. For example, material substitution in early production stages may decrease waste implications throughout the entire process. 6.2.1 IC Fabrication The complex process of manufacturing semiconductor integrated circuits (ICs) often consists of over a hundred steps, during which many copies of an individual IC are formed on a single 17 Appendix A presents a comprehensive matrix detailing the primary findings and conclusions of each of these roadmaps. We believe that this matrix also represents a template to which the findings from other roadmaps can be added as they become available, i.e., USDC. 91
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
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Introduction These kinds of cross-c
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Introduction Strategic Priority Nee
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Introduction Tactical Priority Need
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2.0 Strategic Business Opportunitie
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Strategic Business Opportunities To
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Strategic Business Opportunities Go
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Strategic Business Opportunities co
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Strategic Business Opportunities Th
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Strategic Business Opportunities -
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Environmental Cost Accounting at AT
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Strategic Business Opportunities Pr
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Strategic Business Opportunities sm
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Strategic Business Opportunities pr
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Strategic Business Opportunities en
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Priority Need Task 1. Knowledge of
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Information and Knowledge Systems m
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Information and Knowledge Systems T
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Information and Knowledge Systems T
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Page 69 and 70: Design for Environment: Evolution a
Page 79 and 80: 5. Models to support more comprehen
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Page 85 and 86: Disposition 5.4.1 The Consumer/Comm
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Page 95 and 96: Disposition The proposals strongly
Page 97 and 98: 5.5.5 Summary: Lessons from Program
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Page 103 and 104: Disposition Recycling: The collecti
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Page 128 and 129: Emerging Technologies 110 of automa
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Page 132 and 133: Emerging Technologies 6.4.4 Fully A
Page 134 and 135: Emerging Technologies 116 Priority
Page 137 and 138: Appendix A. Other Industry Roadmaps
Page 139 and 140: Appendix A Overriding Issue SIA/SEM
Page 141 and 142: Appendix A Integrated Circuit Fabri
Page 143 and 144: IPC OIDA SIA/SEMATECH Interconnect
Page 145 and 146: Appendix A IPC Substrate thickness
Page 147 and 148: SIA/SEMATECH Precision Electromecha
Page 149 and 150: Appendix A SIA/SEMATECH As CMOS tec
Page 151 and 152: Appendix A IPC “The coordination
Page 153 and 154: Appendix A OIDA Specific technical
Page 155 and 156: Appendix A NEMI Photonics Critical
Page 157 and 158: Appendix A SIA/SEMATECH In a steady
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Appendix A SIA/SEMATECH Hand-in-han
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Appendix A SIA/SEMATECH Chemical, e
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Appendix A IPC Several approaches m
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Appendix A SIA/SEMATECH Conversion
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SIA/SEMATECH Benchmarking NEMI Need
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Appendix A IPC Purchasing Suppliers
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Appendix B. The Ten Ceres Principle
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Appendix C. The ICC Business Charte
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Appendix D Appendix D. Statistical
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SIC CODE Table 1. Demographic and w
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Appendix D Table 2. Correlation of
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SIC Code Table 3. Costs of fuels an
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3672 Printed Circuit Boards 3674 Se
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1 Value of shipments for product by
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3676- Electronic resistors 3677- El
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Appendix D Product Product Company
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Appendix D 183
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Appendix D Table 9. Quantity and va
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Key to Table 9: - Represents zero.
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SIC Code 36 361 Table 10. Air pollu
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SIC Code 36 361 362 Table 11. Pollu
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SIC Code 36 Appendix D Table 12. Po
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Appendix E Appendix E. Development
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Appendix E releases with component
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Appendix E 2 1 ITEM: Common Sense I
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Appendix E 6 1 ITEM: U.S. Industria
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Appendix E 1 ITEM: Waste Wi$e 2 SOU
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Appendix E 14 1 ITEM: 33/50 Program
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Appendix E 3 CONTENT: This Departme
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Appendix E clearinghouses, database
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5 COST: Free access to all data/inf
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Appendix E 34 1 ITEM: EMPF (Electro
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Appendix E 37 1 ITEM: I3LA (Initiat
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Appendix E 40 1 ITEM: Access EPA 2
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Appendix E 7 PERTINENCE: Probably n
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Appendix E 3 CONTENT: Large indexed
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Appendix E 55 1 ITEM: UCLA Center f
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Item # Type Source of Item Access C
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Appendix F. Survey of Tool Characte
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[Definitions for the design activit
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Human Interface (Please rank the im
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Appendix F 5 Quantifies and reports
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Appendix G Appendix G. Building Blo
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Appendix G The Nordic cooperation g
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Appendix G undertaken to assess env
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Appendix H If no accrual is made be
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Appendix H 248
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Appendix I 250
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Appendix J The ordinance requires U
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Appendix J 254 150,001 to 600,000 1
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Appendix J Germany (Proposed; effec
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References [16] Waitz and Corbet,
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References 260
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