1996 Electronics Industry Environmental Roadmap - Civil and ...

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Introduction 4 Design for the Environment, Disposition, and Emerging Technologies. The discussion and recommendations in this document are intended to provide an agenda for a set of activities that can be launched in the near term, executed through a focused program of cross-industry collaboration, that provide a basis for the next generation of environmental management in the electronics industry. Ultimately, the results will manifest themselves at the bottom line—of the corporation, the industry, and the environment.
Introduction Strategic Priority Need Task Possible Organizations Business Strategies Characterize elements of environmental decision making Incorporate environmental principles into existing business infrastructure Assist small- to mediumsize companies implement environmental management systems Decision Making Tools Enhance voluntary implementation of designfor-environment (DFE) Disposition Create guides to incorporate DFE into product design and manufacturing Capture and disseminate information on disposition options Establish metrics to ensure environmental quality in design processes Conduct benchmarking of corporate integration of DFE practices Analyze existing environmental financial and accounting systems for performance/cost metrics Develop guidelines to assist supply-chain company managers to incorporate environmental principles Devise decision-making and financial analytical tools to support the understanding of DFE benefits Analyze existing design tools applicable to DFE practices Create software-based DFE tools Provide designers with design guides, using the APC’s “A Design Guide for Information and Technology Equipment” as a model Develop markets for disposition options Develop information in a format that is Web accessible Industry/MCC/EIA Industry/University/ Consortium MCC EIA/Industry Decision Focus/MCC/ Industry Pacific Northwest Laboratories (PNL)/MCC PNL/MCC/Software vendors EIA/MCC Recycling industry Product and information suppliers 5
Page 1 and 2: MCC TECHNICAL REPORT MCC-ECESM-001-
Page 3 and 4: MCC Technical Report Document No. M
Page 5 and 6: Table of Contents Electronics Indus
Page 7 and 8: Electronics Industry Environmental
Page 9: Electronics Industry Environmental
Page 15 and 16: Executive Summary Electronics Indus
Page 19 and 20: 1.0 Introduction Introduction 1.1 O
Page 21: Introduction These kinds of cross-c
Page 25 and 26: Introduction Tactical Priority Need
Page 27 and 28: 2.0 Strategic Business Opportunitie
Page 29 and 30: Strategic Business Opportunities To
Page 31 and 32: Strategic Business Opportunities Go
Page 33 and 34: Strategic Business Opportunities co
Page 35 and 36: Strategic Business Opportunities Th
Page 37 and 38: Strategic Business Opportunities -
Page 39 and 40: Environmental Cost Accounting at AT
Page 41 and 42: Strategic Business Opportunities Pr
Page 43 and 44: Strategic Business Opportunities sm
Page 45 and 46: Strategic Business Opportunities pr
Page 47 and 48: Strategic Business Opportunities en
Page 49: Priority Need Task 1. Knowledge of
Page 52 and 53: Information and Knowledge Systems m
Page 54 and 55: Information and Knowledge Systems T
Page 56 and 57: Information and Knowledge Systems T
Page 58 and 59: Information and Knowledge Systems 4
Page 60 and 61: Information and Knowledge Systems A
Page 64 and 65: Information and Knowledge Systems m
Page 69 and 70: Design for Environment: Evolution a
Page 71 and 72: Design for Environment: Evolution a
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Design for Environment: Evolution a
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5. Models to support more comprehen
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5.0 Disposition Disposition 5.1 Obj
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Disposition due date are called con
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Disposition 5.4.1 The Consumer/Comm
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Disposition 5.4.2 Recycled Material
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Disposition One of the greatest cha
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Disposition Assistance (OEA) submit
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Disposition provision in other inst
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Disposition The proposals strongly
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5.5.5 Summary: Lessons from Program
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Disposition The left side of the mo
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Disposition and government for esta
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Disposition Recycling: The collecti
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Disposition 87
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Emerging Technologies self-aligned
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Emerging Technologies wafer. 18 Gen
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Emerging Technologies 94 Planarizat
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Emerging Technologies Therefore, gi
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Emerging Technologies Printed Wirin
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Emerging Technologies 100 ensures f
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Emerging Technologies Etch Chemical
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Emerging Technologies 104 Fully Sub
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Emerging Technologies adhesives and
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Emerging Technologies 108 have sign
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Emerging Technologies 110 of automa
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Emerging Technologies 112 managemen
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Emerging Technologies 6.4.4 Fully A
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Emerging Technologies 116 Priority
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Appendix A. Other Industry Roadmaps
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Appendix A Overriding Issue SIA/SEM
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Appendix A Integrated Circuit Fabri
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IPC OIDA SIA/SEMATECH Interconnect
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Appendix A IPC Substrate thickness
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SIA/SEMATECH Precision Electromecha
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Appendix A SIA/SEMATECH As CMOS tec
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Appendix A IPC “The coordination
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Appendix A OIDA Specific technical
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Appendix A NEMI Photonics Critical
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Appendix A SIA/SEMATECH In a steady
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Appendix A SIA/SEMATECH Hand-in-han
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Appendix A SIA/SEMATECH Chemical, e
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Appendix A IPC Several approaches m
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Appendix A SIA/SEMATECH Conversion
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SIA/SEMATECH Benchmarking NEMI Need
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Appendix A IPC Purchasing Suppliers
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Appendix B. The Ten Ceres Principle
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Appendix C. The ICC Business Charte
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Appendix D Appendix D. Statistical
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SIC CODE Table 1. Demographic and w
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Appendix D Table 2. Correlation of
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SIC Code Table 3. Costs of fuels an
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3672 Printed Circuit Boards 3674 Se
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1 Value of shipments for product by
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3676- Electronic resistors 3677- El
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Appendix D Product Product Company
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Appendix D 183
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Appendix D Table 9. Quantity and va
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Key to Table 9: - Represents zero.
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SIC Code 36 361 Table 10. Air pollu
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SIC Code 36 361 362 Table 11. Pollu
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SIC Code 36 Appendix D Table 12. Po
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Appendix E Appendix E. Development
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Appendix E releases with component
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Appendix E 2 1 ITEM: Common Sense I
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Appendix E 6 1 ITEM: U.S. Industria
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Appendix E 1 ITEM: Waste Wi$e 2 SOU
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Appendix E 14 1 ITEM: 33/50 Program
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Appendix E 3 CONTENT: This Departme
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Appendix E clearinghouses, database
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5 COST: Free access to all data/inf
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Appendix E 34 1 ITEM: EMPF (Electro
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Appendix E 37 1 ITEM: I3LA (Initiat
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Appendix E 40 1 ITEM: Access EPA 2
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Appendix E 7 PERTINENCE: Probably n
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Appendix E 3 CONTENT: Large indexed
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Appendix E 55 1 ITEM: UCLA Center f
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Item # Type Source of Item Access C
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Appendix F. Survey of Tool Characte
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[Definitions for the design activit
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Human Interface (Please rank the im
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Appendix F 5 Quantifies and reports
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Appendix G Appendix G. Building Blo
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Appendix G The Nordic cooperation g
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Appendix G undertaken to assess env
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Appendix H If no accrual is made be
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Appendix H 248
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Appendix I 250
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Appendix J The ordinance requires U
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Appendix J 254 150,001 to 600,000 1
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Appendix J Germany (Proposed; effec
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References [16] Waitz and Corbet,
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References 260
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