1996 Electronics Industry Environmental Roadmap - Civil and ...

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Appendix A SIA/SEMATECH The effects of specific molecular contaminants on semiconductor manufacturing processes are not well understood and the capability to measure and control molecular contamination is not well developed. Improvements are required in the level of standardization and tool interfaces, wafer carrier orientation, ergonomic compliance, wafer-tocassette precision, and high precision mechanical couplings between wafer carriers and process tools. Priorities include developing accurate contamination measuring and modeling techniques, standardizing carriers and carrier interfaces, defining cost effective, contamination-free material movement mechanization approaches, and modularizing contamination control and material movement systems. NEMI IPC OIDA Displays SIA/SEMATECH NEMI IPC OIDA Key market targets for displays include today’s high volume, high value market for flat panel displays for laptop computers and other portable information devices and the market likely to emerge later this decade for larger TV/HDTV displays. Key areas for expanded R&D include large area photolithography, high resolution printing techniques, packaging/integration of displays and drive electronics, low cost drive electronics, inspection and repair techniques, and inprocess measurement techniques. 134 (continued)
Appendix A OIDA Specific technical priorities by display type: CRT: multi-beam electron guns for higher resolution; alternative color selection technologies; higher efficiency phosphors, better deflection yokes, including new yoke materials and lightweight glass. PMLCDs: lower viscosity liquid crystals; thinner cells; plastic substrates for lower cost and larger sizes; lower cost polarizers and color filters; and improved retardation films. AMLCDs: low temperature polysilicon process for thin film transistors; simplified amorphous silicon TFT process with fewer mask steps; and scale-up of the manufacturing process to larger substrate sizes. Electroluminescence: development of a blue phosphor with high luminous efficiency that does not require high temperature deposition and thus does not require expensive high temperature substrates; reduced IC costs; and higher density interconnect technology. Plasma: new materials for barriers and phosphors that would provide an increase in the luminous efficiency by a factor of ten and would have longer lives; low cost IC drivers; longer-lived secondary electron emitters. FEDs: cathode plates, either microtip or structureless thin film; efficient low voltage phosphors; spacers; vacuum assembly techniques. Light emitting diodes: high efficiency blue and green emitters; development of alternatives to SiC blue such as ZnSe and GaN. Holographic: high resolution, high speed liquid crystal light valves; high brightness, electroluminescent arrays; precision electronically steerable light sources, spatial light modulators based on LCDs; solid state red, green, and blue lasers. Projection: high liquid crystal light valves; efficient solid state red, green, and blue lasers, high density, low cost integrated drivers. Optical Technologies, Photonics, RF SIA/SEMATECH 135
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
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Introduction These kinds of cross-c
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Introduction Strategic Priority Nee
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Introduction Tactical Priority Need
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2.0 Strategic Business Opportunitie
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Strategic Business Opportunities To
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Strategic Business Opportunities Go
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Strategic Business Opportunities co
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Strategic Business Opportunities Th
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Strategic Business Opportunities -
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Environmental Cost Accounting at AT
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Strategic Business Opportunities Pr
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Strategic Business Opportunities sm
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Strategic Business Opportunities pr
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Strategic Business Opportunities en
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Priority Need Task 1. Knowledge of
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Information and Knowledge Systems m
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Information and Knowledge Systems T
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Information and Knowledge Systems T
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Information and Knowledge Systems 4
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Information and Knowledge Systems A
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Information and Knowledge Systems m
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Design for Environment: Evolution a
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5. Models to support more comprehen
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5.0 Disposition Disposition 5.1 Obj
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Disposition due date are called con
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Disposition 5.4.1 The Consumer/Comm
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Disposition 5.4.2 Recycled Material
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Disposition One of the greatest cha
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Disposition Assistance (OEA) submit
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Disposition provision in other inst
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Disposition The proposals strongly
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5.5.5 Summary: Lessons from Program
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Disposition The left side of the mo
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Page 103 and 104: Disposition Recycling: The collecti
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Page 108 and 109: Emerging Technologies self-aligned
Page 110 and 111: Emerging Technologies wafer. 18 Gen
Page 112 and 113: Emerging Technologies 94 Planarizat
Page 114 and 115: Emerging Technologies Therefore, gi
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Page 118 and 119: Emerging Technologies 100 ensures f
Page 120 and 121: Emerging Technologies Etch Chemical
Page 122 and 123: Emerging Technologies 104 Fully Sub
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Page 126 and 127: Emerging Technologies 108 have sign
Page 128 and 129: Emerging Technologies 110 of automa
Page 130 and 131: Emerging Technologies 112 managemen
Page 132 and 133: Emerging Technologies 6.4.4 Fully A
Page 134 and 135: Emerging Technologies 116 Priority
Page 137 and 138: Appendix A. Other Industry Roadmaps
Page 139 and 140: Appendix A Overriding Issue SIA/SEM
Page 141 and 142: Appendix A Integrated Circuit Fabri
Page 143 and 144: IPC OIDA SIA/SEMATECH Interconnect
Page 145 and 146: Appendix A IPC Substrate thickness
Page 147 and 148: SIA/SEMATECH Precision Electromecha
Page 149 and 150: Appendix A SIA/SEMATECH As CMOS tec
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Page 155 and 156: Appendix A NEMI Photonics Critical
Page 157 and 158: Appendix A SIA/SEMATECH In a steady
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Page 161 and 162: Appendix A SIA/SEMATECH Chemical, e
Page 163 and 164: Appendix A IPC Several approaches m
Page 165 and 166: Appendix A SIA/SEMATECH Conversion
Page 167 and 168: SIA/SEMATECH Benchmarking NEMI Need
Page 169 and 170: Appendix A IPC Purchasing Suppliers
Page 171 and 172: Appendix B. The Ten Ceres Principle
Page 173 and 174: Appendix C. The ICC Business Charte
Page 175 and 176: Appendix D Appendix D. Statistical
Page 177 and 178: SIC CODE Table 1. Demographic and w
Page 179 and 180: Appendix D Table 2. Correlation of
Page 181 and 182: SIC Code Table 3. Costs of fuels an
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Page 185 and 186: 1 Value of shipments for product by
Page 187 and 188: 3676- Electronic resistors 3677- El
Page 189 and 190: Appendix D Product Product Company
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Appendix D Table 9. Quantity and va
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Appendix D Product Product Company
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Appendix D Product Product Company
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Key to Table 9: - Represents zero.
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SIC Code 36 361 Table 10. Air pollu
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SIC Code 36 361 362 Table 11. Pollu
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SIC Code 36 Appendix D Table 12. Po
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Appendix E Appendix E. Development
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Appendix E releases with component
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Appendix E 2 1 ITEM: Common Sense I
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Appendix E 6 1 ITEM: U.S. Industria
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Appendix E 1 ITEM: Waste Wi$e 2 SOU
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Appendix E 14 1 ITEM: 33/50 Program
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Appendix E 3 CONTENT: This Departme
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Appendix E clearinghouses, database
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5 COST: Free access to all data/inf
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Appendix E 34 1 ITEM: EMPF (Electro
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Appendix E 37 1 ITEM: I3LA (Initiat
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Appendix E 40 1 ITEM: Access EPA 2
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Appendix E 7 PERTINENCE: Probably n
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Appendix E 3 CONTENT: Large indexed
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Appendix E 55 1 ITEM: UCLA Center f
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Item # Type Source of Item Access C
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Appendix F. Survey of Tool Characte
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[Definitions for the design activit
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Human Interface (Please rank the im
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Appendix F 5 Quantifies and reports
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Appendix G Appendix G. Building Blo
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Appendix G The Nordic cooperation g
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Appendix G undertaken to assess env
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Appendix H If no accrual is made be
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Appendix H 248
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Appendix I 250
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Appendix J The ordinance requires U
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Appendix J 254 150,001 to 600,000 1
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Appendix J Germany (Proposed; effec
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References [16] Waitz and Corbet,
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References 260
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