1996 Electronics Industry Environmental Roadmap - Civil and ...

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Emerging Technologies 100 ensures fully exposed copper of the internal layers and a glaze-free hole surface to promote adhesion of subsequent plating. This is usually accomplished using a wet chemical process. Through-hole Plate: To render the drilled and desmeared holes conductive, copper is plated onto the wall of the drilled holes. A variety of techniques are used at the hole plating step, each incorporating differing chemical processes.
Emerging Technologies Outerlayer Processing: Outerlayer processing represents the final major process step to complete a multilayer circuit board. Through-hole plating adds metal not only to the hole walls themselves, but also to the outer layers of the laminated innerlayer cores. These exterior surfaces must ultimately be patterned to provide the necessary connections for circuit components later added to the PWB. Most PWB outerlayers are produced through a subtractive process, in which copper is selectively removed from the plated PWB to form a circuit [35]. Semi-additive or fully-additive processing, in which the manufacturer forms the copper image by selectively plating copper onto the substrate, are alternative outerlayer processes emerging in the manufacturing base. Improvement of additive metal deposition technology, according to the IPC, requires higher precision, consistency in resolution, and demands a focused program of research for new equipment, processes, and infrastructure [36]. Figures 6-3 through 6-4 summarizes the overall multilayering process including lamination, drilling, and outerlayer processing. Subtractive, semi-additive, and fully-additive techniques for outerlayer processing are detailed. Final Surface Preparation: Numerous surface finishes are possible once all copper circuitry has been patterned on the PWB. Depending on the component assembly processes to be used on the circuit board, gold, solder, or bare copper (with a anti-tarnish coating) are possible. In one common process termed hot-air solder leveling (HASL), the panel is dipped into molten solder, and then blasted with hot air to even out the solder coating on which customers will mount parts. Environmental Impacts: PWB manufacturing is a complicated process and includes several steps that use significant quantities of chemicals and metals. On average, the waste stream constitutes 92%—and the final product just 8%—of the total weight of the materials used in the PWB production process. Approximately 80% of the waste produced is hazardous [37], and most of the waste is aqueous, including a range of hazardous chemicals. Table 6-3 illustrates some example environmental issues resulting from the more common process steps as outlined above. Process Environmental Issues/Impact Base material manufacturing Chemical waste stream from copper foil manufacturing, resin production Lamination Energy consumption Drilling Solid waste products from drilling Desmear Chemical and/or gaseous waste from etchback of drilled PWB Through hole/outerlayer plating Chemical waste from electrolytic and electroless copper baths Resist develop Chemical waste from dissolved resist and spent developer Resist strip Chemical waste from dissolved resist and spent stripper 101
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
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Introduction These kinds of cross-c
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Introduction Strategic Priority Nee
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Introduction Tactical Priority Need
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2.0 Strategic Business Opportunitie
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Strategic Business Opportunities To
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Strategic Business Opportunities Go
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Strategic Business Opportunities co
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Strategic Business Opportunities Th
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Strategic Business Opportunities -
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Environmental Cost Accounting at AT
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Strategic Business Opportunities Pr
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Strategic Business Opportunities sm
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Strategic Business Opportunities pr
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Strategic Business Opportunities en
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Priority Need Task 1. Knowledge of
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Information and Knowledge Systems m
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Information and Knowledge Systems T
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Information and Knowledge Systems T
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Information and Knowledge Systems 4
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Information and Knowledge Systems A
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Information and Knowledge Systems m
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Page 69 and 70: Design for Environment: Evolution a
Page 79 and 80: 5. Models to support more comprehen
Page 81 and 82: 5.0 Disposition Disposition 5.1 Obj
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Page 85 and 86: Disposition 5.4.1 The Consumer/Comm
Page 87 and 88: Disposition 5.4.2 Recycled Material
Page 89 and 90: Disposition One of the greatest cha
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Page 93 and 94: Disposition provision in other inst
Page 95 and 96: Disposition The proposals strongly
Page 97 and 98: 5.5.5 Summary: Lessons from Program
Page 99 and 100: Disposition The left side of the mo
Page 101 and 102: Disposition and government for esta
Page 103 and 104: Disposition Recycling: The collecti
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Page 108 and 109: Emerging Technologies self-aligned
Page 110 and 111: Emerging Technologies wafer. 18 Gen
Page 112 and 113: Emerging Technologies 94 Planarizat
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Page 120 and 121: Emerging Technologies Etch Chemical
Page 122 and 123: Emerging Technologies 104 Fully Sub
Page 124 and 125: Emerging Technologies adhesives and
Page 126 and 127: Emerging Technologies 108 have sign
Page 128 and 129: Emerging Technologies 110 of automa
Page 130 and 131: Emerging Technologies 112 managemen
Page 132 and 133: Emerging Technologies 6.4.4 Fully A
Page 134 and 135: Emerging Technologies 116 Priority
Page 137 and 138: Appendix A. Other Industry Roadmaps
Page 139 and 140: Appendix A Overriding Issue SIA/SEM
Page 141 and 142: Appendix A Integrated Circuit Fabri
Page 143 and 144: IPC OIDA SIA/SEMATECH Interconnect
Page 145 and 146: Appendix A IPC Substrate thickness
Page 147 and 148: SIA/SEMATECH Precision Electromecha
Page 149 and 150: Appendix A SIA/SEMATECH As CMOS tec
Page 151 and 152: Appendix A IPC “The coordination
Page 153 and 154: Appendix A OIDA Specific technical
Page 155 and 156: Appendix A NEMI Photonics Critical
Page 157 and 158: Appendix A SIA/SEMATECH In a steady
Page 159 and 160: Appendix A SIA/SEMATECH Hand-in-han
Page 161 and 162: Appendix A SIA/SEMATECH Chemical, e
Page 163 and 164: Appendix A IPC Several approaches m
Page 165 and 166: Appendix A SIA/SEMATECH Conversion
Page 167 and 168: SIA/SEMATECH Benchmarking NEMI Need
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Appendix A IPC Purchasing Suppliers
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Appendix B. The Ten Ceres Principle
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Appendix C. The ICC Business Charte
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Appendix D Appendix D. Statistical
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SIC CODE Table 1. Demographic and w
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Appendix D Table 2. Correlation of
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SIC Code Table 3. Costs of fuels an
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3672 Printed Circuit Boards 3674 Se
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1 Value of shipments for product by
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3676- Electronic resistors 3677- El
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Appendix D Product Product Company
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Appendix D 183
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Appendix D Table 9. Quantity and va
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Key to Table 9: - Represents zero.
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SIC Code 36 361 Table 10. Air pollu
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SIC Code 36 361 362 Table 11. Pollu
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SIC Code 36 Appendix D Table 12. Po
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Appendix E Appendix E. Development
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Appendix E releases with component
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Appendix E 2 1 ITEM: Common Sense I
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Appendix E 6 1 ITEM: U.S. Industria
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Appendix E 1 ITEM: Waste Wi$e 2 SOU
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Appendix E 14 1 ITEM: 33/50 Program
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Appendix E 3 CONTENT: This Departme
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Appendix E clearinghouses, database
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5 COST: Free access to all data/inf
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Appendix E 34 1 ITEM: EMPF (Electro
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Appendix E 37 1 ITEM: I3LA (Initiat
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Appendix E 40 1 ITEM: Access EPA 2
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Appendix E 7 PERTINENCE: Probably n
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Appendix E 3 CONTENT: Large indexed
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Appendix E 55 1 ITEM: UCLA Center f
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Item # Type Source of Item Access C
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Appendix F. Survey of Tool Characte
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[Definitions for the design activit
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Human Interface (Please rank the im
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Appendix F 5 Quantifies and reports
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Appendix G Appendix G. Building Blo
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Appendix G The Nordic cooperation g
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Appendix G undertaken to assess env
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Appendix H If no accrual is made be
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Appendix H 248
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Appendix I 250
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Appendix J The ordinance requires U
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Appendix J 254 150,001 to 600,000 1
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Appendix J Germany (Proposed; effec
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References [16] Waitz and Corbet,
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References 260
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