1996 Electronics Industry Environmental Roadmap - Civil and ...

Emerging Technologies
of-use chemical generation, water recycling, process material minimization, and chemical
reprocessing.
The IPC roadmap identifies a specific agenda of material and chemical replacement,
including brominated materials, solder replacements, ODS and VOC elimination in
cleaning, and the development of aqueous solder masks. The IPC roadmap also
emphasizes the importance of solvent recovery and closed loop techniques and additive
processes and direct plating [36].
The SIA roadmap also calls for hazardous chemical use reductions, reducing use and
waste-at-the-point-of-use through process efficiency, reuse, substitution, and additive
technologies [31]. This includes total phase-outs of ozone-depleting substances and
ethylene glycol ethers. Establishment of specific emission reduction goals is
recommended, including efforts to use control technologies for emissions reductions until
source reductions take effect. The roadmap also recommends efforts to reduce natural
resources required to produce wafers and devices, with specific emphasis on water and
energy.
Other challenges also remain, and are reflected in the recommendations of the individual
roadmaps. For example:
– Alternatives should be found to lead-based solders, including lead-free solders and
conductive adhesives.
– New coatings or chemical formulations, used to improve processes or to enhance performance,
are beginning to emerge and require environmental characterization. In IC
manufacturing, for example, increased aspect ratios in lithography may require chemically
amplified resists to maintain the requirements of process latitude, etch
resistance, implant blocking, and mechanical stability [31]. In the fabrication of
substrates and displays, diamond coatings have received considerable attention due to
the manufacturability and performance benefits they promise. Effective
environmental characterization methods must be applied early in the development
process in order to avoid problems in later stages of production.
– Emission abatement, processing optimization, and replacement chemicals for atmospherically
long-lived process gases, such as perfluoro compounds.
– Alternative chemicals and safer delivery methods for silane, dopants, and hazardous
solvents and degreasers.
– Evaluation of OEM/government specifications to ensure support for reduction or
elimination of targeted chemicals.
– Recycling or end-of-life management for cupric chloride and ammoniacal etchants,
the largest single waste stream for most PWB manufacturers [36].
Processes: The SIA roadmap notes that “There will not be radical changes in the process
technology used to manufacture semiconductors throughout this decade. Rather, there
will be expansion and refinement of current processes.” [31].
Adapting to the rapid evolution of technology will require its own set of technology advancements
to ensure that processes and materials are suited to the technologies that they
must address. NEMI succinctly states the goal: “Cost-effectiveness implies high levels
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