1996 Electronics Industry Environmental Roadmap - Civil and ...
1996 Electronics Industry Environmental Roadmap - Civil and ...
1996 Electronics Industry Environmental Roadmap - Civil and ...
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Appendix A<br />
SIA/SEMATECH The roadmap also discusses thermal/thin film processing<br />
contamination-free manufacturing <strong>and</strong> metrology. Regarding<br />
metrology, the report notes that processes need to be moved on-line<br />
(in-line, in situ) <strong>and</strong> notes the importance of data management systems<br />
that are an integral part of process control, defect detection, <strong>and</strong> data<br />
reduction methods.<br />
NEMI<br />
IPC<br />
OIDA<br />
St<strong>and</strong>ards<br />
SIA/SEMATECH New st<strong>and</strong>ards include software st<strong>and</strong>ards for CAD tools <strong>and</strong> operating<br />
platforms, as well as hardware st<strong>and</strong>ards in areas such as supply<br />
voltages, input/output level voltages, <strong>and</strong> other electrical parameters<br />
relating to the off-chip world. These st<strong>and</strong>ards are of paramount<br />
importance in that they allow/restrict h<strong>and</strong>-offs between design<br />
phases. Smooth h<strong>and</strong>-offs avoid loss of design detail that can lead to<br />
failure or lack of an optimal solution.<br />
TO BE COMPLETED<br />
NEMI TO BE COMPLETED<br />
IPC Some of the more important include design st<strong>and</strong>ards, material<br />
definitions, product specifications, reliability requirements, test<br />
methods, <strong>and</strong> data st<strong>and</strong>ards.<br />
A key consideration in st<strong>and</strong>ards development is the ability to rapidly<br />
respond to innovation at no increased cost.<br />
Another key area is the need for comprehensive material property data.<br />
There are presently several databases for material property information.<br />
However, data at important temperatures such as Tg <strong>and</strong> Tx are<br />
lacking. Designers <strong>and</strong> model designers need these data.<br />
End product acceptance methods must be eliminated <strong>and</strong> replaced by<br />
end process controls which maintain a high confidence level through<br />
the use of process control. For improved test accuracy, higher<br />
productivity, <strong>and</strong> increased reliability, the industry must move forward<br />
in automating the testing of critical product parameters.<br />
Currently materials <strong>and</strong> reliability data are generated by directly<br />
affected parties. The result is the data are often incomplete, not shared,<br />
<strong>and</strong> not broadly accepted. As companies reduce research efforts, it<br />
becomes vital to promote increased use of other resources such as<br />
universities.<br />
IPC also recommends development of a framework for electronic<br />
development <strong>and</strong> delivery of st<strong>and</strong>ards.<br />
Consider using chart on page C-18.<br />
OIDA<br />
148