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1996 Electronics Industry Environmental Roadmap - Civil and ...

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Appendix A<br />

SIA/SEMATECH The roadmap also discusses thermal/thin film processing<br />

contamination-free manufacturing <strong>and</strong> metrology. Regarding<br />

metrology, the report notes that processes need to be moved on-line<br />

(in-line, in situ) <strong>and</strong> notes the importance of data management systems<br />

that are an integral part of process control, defect detection, <strong>and</strong> data<br />

reduction methods.<br />

NEMI<br />

IPC<br />

OIDA<br />

St<strong>and</strong>ards<br />

SIA/SEMATECH New st<strong>and</strong>ards include software st<strong>and</strong>ards for CAD tools <strong>and</strong> operating<br />

platforms, as well as hardware st<strong>and</strong>ards in areas such as supply<br />

voltages, input/output level voltages, <strong>and</strong> other electrical parameters<br />

relating to the off-chip world. These st<strong>and</strong>ards are of paramount<br />

importance in that they allow/restrict h<strong>and</strong>-offs between design<br />

phases. Smooth h<strong>and</strong>-offs avoid loss of design detail that can lead to<br />

failure or lack of an optimal solution.<br />

TO BE COMPLETED<br />

NEMI TO BE COMPLETED<br />

IPC Some of the more important include design st<strong>and</strong>ards, material<br />

definitions, product specifications, reliability requirements, test<br />

methods, <strong>and</strong> data st<strong>and</strong>ards.<br />

A key consideration in st<strong>and</strong>ards development is the ability to rapidly<br />

respond to innovation at no increased cost.<br />

Another key area is the need for comprehensive material property data.<br />

There are presently several databases for material property information.<br />

However, data at important temperatures such as Tg <strong>and</strong> Tx are<br />

lacking. Designers <strong>and</strong> model designers need these data.<br />

End product acceptance methods must be eliminated <strong>and</strong> replaced by<br />

end process controls which maintain a high confidence level through<br />

the use of process control. For improved test accuracy, higher<br />

productivity, <strong>and</strong> increased reliability, the industry must move forward<br />

in automating the testing of critical product parameters.<br />

Currently materials <strong>and</strong> reliability data are generated by directly<br />

affected parties. The result is the data are often incomplete, not shared,<br />

<strong>and</strong> not broadly accepted. As companies reduce research efforts, it<br />

becomes vital to promote increased use of other resources such as<br />

universities.<br />

IPC also recommends development of a framework for electronic<br />

development <strong>and</strong> delivery of st<strong>and</strong>ards.<br />

Consider using chart on page C-18.<br />

OIDA<br />

148

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