1996 Electronics Industry Environmental Roadmap - Civil and ...

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Electronics Industry Environmental Roadmap 4.4.1 DFE Metrics .....................................................................................................43 4.4.2 DFE Analysis Methods.....................................................................................43 4.5 Closing Comments.......................................................................................................44 5.0 Disposition ............................................................................................................................49 5.1 Objective......................................................................................................................49 5.2 The Importance of Achieving the Goal is Increasing ....................................................49 5.3 Existing Practices and Infrastructure Fall Short of Meeting the Goal ...........................51 5.4 Obstacles to Improved Disposition...............................................................................51 5.4.1 The Consumer/Commercial Collection and Processing Infrastructure.............52 5.4.2 Recycled Material Market Immaturity..............................................................53 5.4.3 Lack of Data .....................................................................................................53 5.4.4 Regulatory Issues .............................................................................................53 5.4.5 Technology.......................................................................................................54 5.5 Opportunities in Product End-of-Life Management .....................................................54 5.5.1 Nature and Volume of Waste from Electronic Products ...................................55 5.5.2 PELM Business Opportunities .........................................................................55 5.5.3 Model and Pilot Programs ................................................................................56 5.5.4 Survey of Foreign PELM Programs..................................................................58 5.5.5 Summary: Lessons from Program Examples ...................................................61 5.6 Recommendations for Achieving the Goal...................................................................61 5.6.1 “Triage” Techniques: An Integrated Sorting and Assessment Center ..............63 5.6.2 Technology Development ................................................................................63 5.7 Definitions....................................................................................................................65 6.0 Emerging Technologies.........................................................................................................69 6.1 The Changing Nature of Electronic Components .........................................................69 6.2 Overview of Current Processes ....................................................................................70 6.2.1 IC Fabrication...................................................................................................70 6.2.2 Packaging.........................................................................................................74 6.2.3 Interconnect......................................................................................................75 6.2.4 Attachment.......................................................................................................80 6.2.5 Displays............................................................................................................81 6.3 Key Trends as Reflected in Industry Roadmaps............................................................81 6.4 Grand Challenges for Environmental Excellence.........................................................86 ii
Electronics Industry Environmental Roadmap 6.4.1 “Dry” Wafers....................................................................................................86 6.4.2 The Packageless Chip.......................................................................................87 6.4.3 Zero Emissions Processes.................................................................................87 6.4.4 Fully Additive Substrates for PWBs.................................................................87 6.4.5 Point-of-Use Generation ..................................................................................87 6.4.6 Integrated Design for Environment ..................................................................88 6.4.7 Computer System End-Of-Life Management...................................................88 6.5 Conclusion ...................................................................................................................88 Appendix A. Other Industry Roadmaps.........................................................................................91 Appendix B. The Ten Ceres Principles ........................................................................................113 Appendix C. The ICC Business Charter for Sustainable Development........................................115 Appendix D. Statistical Data Associated with Commerce for Major Selected Sectors of the U.S. Electronics Industry....................................................................................................117 Appendix E. Development of a “Meta Matrix” for Evaluation of Sources of Data and Information Related to Environmental Factors ......................................................................155 Appendix F. Survey of Tool Characteristics and Usage for Design-for-Environment .................181 Appendix G. Building Blocks for Environmental Tradeoff Assessments to Support DFE—A Sample of European Projects.........................................................................................187 Danish Environmental Protection Agency ..........................................................................187 Swedish Electronics LCA Project .......................................................................................188 The Nordic Council of Ministers .........................................................................................188 IMEC...................................................................................................................................189 Closing Comments..............................................................................................................190 Appendix H. Contingent Liabilities Related to Mandatory Disposition.......................................191 Germany..............................................................................................................................191 Japan ...................................................................................................................................191 The Netherlands ..................................................................................................................191 Sweden................................................................................................................................192 Switzerland .........................................................................................................................192 United States .......................................................................................................................192 International Accounting Standards Relating to Disclosure of Contingent Liabilities.........193 Appendix I. Composition of Typical Desktop Computer System ................................................195 Appendix J. European Disposition Initiatives..............................................................................197 Austria: A Reserve Distribution Model ..............................................................................197 iii
Page 1 and 2: MCC TECHNICAL REPORT MCC-ECESM-001-
Page 3 and 4: MCC Technical Report Document No. M
Page 5: Table of Contents Electronics Indus
Page 9: Electronics Industry Environmental
Page 12 and 13: Electronics Industry Environmental
Page 15 and 16: Executive Summary Electronics Indus
Page 17 and 18: Electronics Industry Environmental
Page 19 and 20: 1.0 Introduction Introduction 1.1 O
Page 21 and 22: Introduction These kinds of cross-c
Page 23 and 24: Introduction Strategic Priority Nee
Page 25 and 26: Introduction Tactical Priority Need
Page 27 and 28: 2.0 Strategic Business Opportunitie
Page 29 and 30: Strategic Business Opportunities To
Page 31 and 32: Strategic Business Opportunities Go
Page 33 and 34: Strategic Business Opportunities co
Page 35 and 36: Strategic Business Opportunities Th
Page 37 and 38: Strategic Business Opportunities -
Page 39 and 40: Environmental Cost Accounting at AT
Page 41 and 42: Strategic Business Opportunities Pr
Page 43 and 44: Strategic Business Opportunities sm
Page 45 and 46: Strategic Business Opportunities pr
Page 47 and 48: Strategic Business Opportunities en
Page 49: Priority Need Task 1. Knowledge of
Page 52 and 53: Information and Knowledge Systems m
Page 54 and 55: Information and Knowledge Systems T
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Information and Knowledge Systems T
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Information and Knowledge Systems 4
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Information and Knowledge Systems A
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Information and Knowledge Systems m
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Design for Environment: Evolution a
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5. Models to support more comprehen
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5.0 Disposition Disposition 5.1 Obj
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Disposition due date are called con
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Disposition 5.4.1 The Consumer/Comm
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Disposition 5.4.2 Recycled Material
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Disposition One of the greatest cha
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Disposition Assistance (OEA) submit
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Disposition provision in other inst
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Disposition The proposals strongly
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5.5.5 Summary: Lessons from Program
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Disposition The left side of the mo
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Disposition and government for esta
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Disposition Recycling: The collecti
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Disposition 87
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Emerging Technologies self-aligned
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Emerging Technologies wafer. 18 Gen
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Emerging Technologies 94 Planarizat
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Emerging Technologies Therefore, gi
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Emerging Technologies Printed Wirin
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Emerging Technologies 100 ensures f
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Emerging Technologies Etch Chemical
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Emerging Technologies 104 Fully Sub
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Emerging Technologies adhesives and
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Emerging Technologies 108 have sign
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Emerging Technologies 110 of automa
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Emerging Technologies 112 managemen
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Emerging Technologies 6.4.4 Fully A
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Emerging Technologies 116 Priority
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Appendix A. Other Industry Roadmaps
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Appendix A Overriding Issue SIA/SEM
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Appendix A Integrated Circuit Fabri
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IPC OIDA SIA/SEMATECH Interconnect
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Appendix A IPC Substrate thickness
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SIA/SEMATECH Precision Electromecha
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Appendix A SIA/SEMATECH As CMOS tec
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Appendix A IPC “The coordination
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Appendix A OIDA Specific technical
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Appendix A NEMI Photonics Critical
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Appendix A SIA/SEMATECH In a steady
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Appendix A SIA/SEMATECH Hand-in-han
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Appendix A SIA/SEMATECH Chemical, e
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Appendix A IPC Several approaches m
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Appendix A SIA/SEMATECH Conversion
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SIA/SEMATECH Benchmarking NEMI Need
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Appendix A IPC Purchasing Suppliers
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Appendix B. The Ten Ceres Principle
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Appendix C. The ICC Business Charte
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Appendix D Appendix D. Statistical
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SIC CODE Table 1. Demographic and w
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Appendix D Table 2. Correlation of
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SIC Code Table 3. Costs of fuels an
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3672 Printed Circuit Boards 3674 Se
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1 Value of shipments for product by
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3676- Electronic resistors 3677- El
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Appendix D Product Product Company
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Appendix D 183
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Appendix D Table 9. Quantity and va
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Key to Table 9: - Represents zero.
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SIC Code 36 361 Table 10. Air pollu
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SIC Code 36 361 362 Table 11. Pollu
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SIC Code 36 Appendix D Table 12. Po
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Appendix E Appendix E. Development
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Appendix E releases with component
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Appendix E 2 1 ITEM: Common Sense I
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Appendix E 6 1 ITEM: U.S. Industria
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Appendix E 1 ITEM: Waste Wi$e 2 SOU
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Appendix E 14 1 ITEM: 33/50 Program
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Appendix E 3 CONTENT: This Departme
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Appendix E clearinghouses, database
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5 COST: Free access to all data/inf
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Appendix E 34 1 ITEM: EMPF (Electro
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Appendix E 37 1 ITEM: I3LA (Initiat
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Appendix E 40 1 ITEM: Access EPA 2
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Appendix E 7 PERTINENCE: Probably n
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Appendix E 3 CONTENT: Large indexed
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Appendix E 55 1 ITEM: UCLA Center f
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Item # Type Source of Item Access C
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Appendix F. Survey of Tool Characte
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[Definitions for the design activit
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Human Interface (Please rank the im
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Appendix F 5 Quantifies and reports
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Appendix G Appendix G. Building Blo
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Appendix G The Nordic cooperation g
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Appendix G undertaken to assess env
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Appendix H If no accrual is made be
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Appendix H 248
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Appendix I 250
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Appendix J The ordinance requires U
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Appendix J 254 150,001 to 600,000 1
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Appendix J Germany (Proposed; effec
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References [16] Waitz and Corbet,
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References 260
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