1996 Electronics Industry Environmental Roadmap - Civil and ...

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Emerging Technologies 104 Fully Subtractive: Panel Plate Semi-additive: Pattern Plate Drill Cu-clad laminate Resist coat and pattern (no via tent) Catalyze and pattern plate Strip resist Strip "field" plating interconnect foil Fully-additive: Pattern Plate Drill unclad laminate Drill Cu-clad laminate Catalyze and plate panel Resist coat and pattern (tent holes) Etch Cu and and strip resist Resist coat and pattern (no via tent) Catalyze exposed laminate and pattern plate (electroless) Strip resist Figure 6-4. Outerlayer manufacturing options (internal layers are optional and not shown).
Emerging Technologies Multichip Modules: A significant trend affecting advanced electronics, packaging, and the PWB industry is the emergence of a new class of devices known as multichip modules (MCMs). MCMs are basically of three types [35]: Ceramic multichip modules (MCM-C), which use ceramic materials as a substrate; Deposited dielectric multichip modules (MCM-D), which use deposited organic and inorganic dielectric films and metal conductors, often using processes similar to IC technologies; and Laminate multichip modules (MCM-L), which use existing PWB materials, technologies, and facilities. MCM-L assemblies are essentially higher precision PWBs with a high packaging density. The emergence of multichip modules brings with it environmental issues that are fairly well understood within the context of the emerging processes. For example, MCM-C, like other ceramic processes, introduces issues of high-temperature processing and energy usage. MCM-Ds and MCM-Ls share chemical and material issues with other IC or PWB technology processes. 6.2.4 Attachment For many years, the attachment of advanced circuits used a through-hole approach in which small wires from the packaged IC were inserted through holes in the PWB and connected to its back side. The predominant attach technology today is surface mount in which devices are directly attached to the surface of the PWB. In this process, principal issues concern the materials used to complete the attachment, with a particular emphasis on the elimination of lead-based solders, and the processes for cleaning the circuit board after attachment to remove waste materials. Demands for increased density and performance, however, require acceleration of advanced approaches. There is a fundamental transition underway from packaged ICs to unpackaged ICs that are directly attached to boards. It is especially reflected in the emergence of multichip modules of various types, as well as 3-D packages and new PCMCIA technologies. In the short run, these demands will be met by the accelerated adoption of ball grid array packaging approaches. In the longer run, direct chip attach approaches will become far more common and accepted. NEMI explains that solder-based direct chip attach processes substrates will likely be used for systems requiring high reliability, while adhesive-based direct chip attach processes and thin PWBs or flex circuits will likely be used where cost is a dominant factor in system design [33]. The NEMI roadmap points out that: “One key implication is that bare die will begin to dominate over time. This will be driven by the movement to multi-chip modules and chip-on-board for a wide variety of systems.” Therefore, finding new materials that enable direct chip attach and other advanced methods must be a high priority, since there is a strong consensus that the best environmental practices, as well as regulatory requirements, may demand the elimination of lead-based solders. Anisotropic 105
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
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Introduction These kinds of cross-c
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Introduction Strategic Priority Nee
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Introduction Tactical Priority Need
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2.0 Strategic Business Opportunitie
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Strategic Business Opportunities To
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Strategic Business Opportunities Go
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Strategic Business Opportunities co
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Strategic Business Opportunities Th
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Strategic Business Opportunities -
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Environmental Cost Accounting at AT
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Strategic Business Opportunities Pr
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Strategic Business Opportunities sm
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Strategic Business Opportunities pr
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Strategic Business Opportunities en
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Priority Need Task 1. Knowledge of
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Information and Knowledge Systems m
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Information and Knowledge Systems T
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Information and Knowledge Systems T
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Information and Knowledge Systems 4
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Information and Knowledge Systems A
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Information and Knowledge Systems m
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Design for Environment: Evolution a
Page 71 and 72: Design for Environment: Evolution a
Page 79 and 80: 5. Models to support more comprehen
Page 81 and 82: 5.0 Disposition Disposition 5.1 Obj
Page 83 and 84: Disposition due date are called con
Page 85 and 86: Disposition 5.4.1 The Consumer/Comm
Page 87 and 88: Disposition 5.4.2 Recycled Material
Page 89 and 90: Disposition One of the greatest cha
Page 91 and 92: Disposition Assistance (OEA) submit
Page 93 and 94: Disposition provision in other inst
Page 95 and 96: Disposition The proposals strongly
Page 97 and 98: 5.5.5 Summary: Lessons from Program
Page 99 and 100: Disposition The left side of the mo
Page 101 and 102: Disposition and government for esta
Page 103 and 104: Disposition Recycling: The collecti
Page 105: Disposition 87
Page 108 and 109: Emerging Technologies self-aligned
Page 110 and 111: Emerging Technologies wafer. 18 Gen
Page 112 and 113: Emerging Technologies 94 Planarizat
Page 114 and 115: Emerging Technologies Therefore, gi
Page 116 and 117: Emerging Technologies Printed Wirin
Page 118 and 119: Emerging Technologies 100 ensures f
Page 120 and 121: Emerging Technologies Etch Chemical
Page 124 and 125: Emerging Technologies adhesives and
Page 126 and 127: Emerging Technologies 108 have sign
Page 128 and 129: Emerging Technologies 110 of automa
Page 130 and 131: Emerging Technologies 112 managemen
Page 132 and 133: Emerging Technologies 6.4.4 Fully A
Page 134 and 135: Emerging Technologies 116 Priority
Page 137 and 138: Appendix A. Other Industry Roadmaps
Page 139 and 140: Appendix A Overriding Issue SIA/SEM
Page 141 and 142: Appendix A Integrated Circuit Fabri
Page 143 and 144: IPC OIDA SIA/SEMATECH Interconnect
Page 145 and 146: Appendix A IPC Substrate thickness
Page 147 and 148: SIA/SEMATECH Precision Electromecha
Page 149 and 150: Appendix A SIA/SEMATECH As CMOS tec
Page 151 and 152: Appendix A IPC “The coordination
Page 153 and 154: Appendix A OIDA Specific technical
Page 155 and 156: Appendix A NEMI Photonics Critical
Page 157 and 158: Appendix A SIA/SEMATECH In a steady
Page 159 and 160: Appendix A SIA/SEMATECH Hand-in-han
Page 161 and 162: Appendix A SIA/SEMATECH Chemical, e
Page 163 and 164: Appendix A IPC Several approaches m
Page 165 and 166: Appendix A SIA/SEMATECH Conversion
Page 167 and 168: SIA/SEMATECH Benchmarking NEMI Need
Page 169 and 170: Appendix A IPC Purchasing Suppliers
Page 171 and 172: Appendix B. The Ten Ceres Principle
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Appendix C. The ICC Business Charte
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Appendix D Appendix D. Statistical
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SIC CODE Table 1. Demographic and w
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Appendix D Table 2. Correlation of
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SIC Code Table 3. Costs of fuels an
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3672 Printed Circuit Boards 3674 Se
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1 Value of shipments for product by
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3676- Electronic resistors 3677- El
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Appendix D Product Product Company
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Appendix D 183
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Appendix D Table 9. Quantity and va
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Key to Table 9: - Represents zero.
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SIC Code 36 361 Table 10. Air pollu
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SIC Code 36 361 362 Table 11. Pollu
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SIC Code 36 Appendix D Table 12. Po
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Appendix E Appendix E. Development
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Appendix E releases with component
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Appendix E 2 1 ITEM: Common Sense I
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Appendix E 6 1 ITEM: U.S. Industria
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Appendix E 1 ITEM: Waste Wi$e 2 SOU
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Appendix E 14 1 ITEM: 33/50 Program
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Appendix E 3 CONTENT: This Departme
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Appendix E clearinghouses, database
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5 COST: Free access to all data/inf
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Appendix E 34 1 ITEM: EMPF (Electro
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Appendix E 37 1 ITEM: I3LA (Initiat
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Appendix E 40 1 ITEM: Access EPA 2
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Appendix E 7 PERTINENCE: Probably n
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Appendix E 3 CONTENT: Large indexed
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Appendix E 55 1 ITEM: UCLA Center f
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Item # Type Source of Item Access C
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Appendix F. Survey of Tool Characte
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[Definitions for the design activit
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Human Interface (Please rank the im
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Appendix F 5 Quantifies and reports
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Appendix G Appendix G. Building Blo
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Appendix G The Nordic cooperation g
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Appendix G undertaken to assess env
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Appendix H If no accrual is made be
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Appendix H 248
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Appendix I 250
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Appendix J The ordinance requires U
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Appendix J 254 150,001 to 600,000 1
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Appendix J Germany (Proposed; effec
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References [16] Waitz and Corbet,
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References 260
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