1996 Electronics Industry Environmental Roadmap - Civil and ...

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Appendix A NEMI Integrate the enterprise from design to delivery. Improve software research for industry. Improve computer-assisted decision support. Development of intelligence sensors and actuators - in many cases it is impossible to capture, transmit, and act on needed information because the sensor-actuated technology does not exist or is not affordable. (continued) NEMI Develop a MIMS capability that supports the use of so-called business rules that allows the user to tune the factory’s behavior in response to current conditions with little or no reprogramming. The roadmap also calls for centers of modeling excellence, development of appropriate standards to support MIMS technology, leveraging the factory integration roadmap, and building on national information infrastructure, and education and training for factory management Three-dimensional imaging will become a critical technology to electronics assembly as current trends in miniaturization continue. Examples where 3-D imaging is currently being attempted include scanning solder-paced profiles for correct volume distribution and determining the coplanarity of surface mount device leads. Thermal imaging offers opportunities in electronic process control. An example is control into solder reflow process. Thermal imaging would allow automatic sensing of thermal distributions and finer control of heating elements. Among other options, the roadmap notes that environmental restoration and waste management activities within DoD and DoE have developed significant technical programs focused on sensors required to complete activities. ER and WM detectors/monitors use a chemically sensitive transduction mechanism that enables the sensor to select the chemical/gases of interest. 132
Appendix A IPC “The coordination of all resources involved in operating a manufacturing business with the objective of insuring the most efficient use of, and maximum effectiveness of, all inputs to, from, and between the manufacturing processes.” Total quality management is a critical aspect of effective factory integration. The roadmap stresses the importance of self-directed work teams, training and education. Another critical element of factory integration is systematic benchmarking process. However, the roadmap notes the electronic interconnection industry does very little comprehensive benchmarking. Another key element of factory integration is a strategic process for cycle time reduction (CTR). Information systems (CIM/MIS) are also fundamental. Costing systems which are used to estimate the real costs of a manufactured part could be better integrated with the manufacturing control systems that manage the series of processing steps that add value to a part. EDI Systems which can provide enhanced communication with business partners by replacing traditional paper order processing are not commonly used in the interconnect industry. Also stressed are manufacturing control systems, tooling systems, modeling and simulation systems, and process control systems. (continued) IPC Improved factory automation is also essential to factory integration. Automated material handling systems eliminate the need for manual intervention for the conveyance of product through the manufacturing process. Automated process control and monitoring systems utilize electronic sensors that monitor process variables and convert the level of measured variable into a proportional electrical output. Integration of the process control system with the manufacturing control/information system allows the automatic storage and retrieval of processed data and part-specific information. The roadmap stresses the need for improved leadership/management, strategic planning, and better finance/accounting procedures, including activity-based costing. OIDA Product and Material Handling 133
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
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Introduction These kinds of cross-c
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Introduction Strategic Priority Nee
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Introduction Tactical Priority Need
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2.0 Strategic Business Opportunitie
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Strategic Business Opportunities To
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Strategic Business Opportunities Go
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Strategic Business Opportunities co
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Strategic Business Opportunities Th
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Strategic Business Opportunities -
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Environmental Cost Accounting at AT
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Strategic Business Opportunities Pr
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Strategic Business Opportunities sm
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Strategic Business Opportunities pr
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Strategic Business Opportunities en
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Priority Need Task 1. Knowledge of
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Information and Knowledge Systems m
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Information and Knowledge Systems T
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Information and Knowledge Systems T
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Information and Knowledge Systems 4
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Information and Knowledge Systems A
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Information and Knowledge Systems m
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Design for Environment: Evolution a
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5. Models to support more comprehen
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5.0 Disposition Disposition 5.1 Obj
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Disposition due date are called con
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Disposition 5.4.1 The Consumer/Comm
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Disposition 5.4.2 Recycled Material
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Disposition One of the greatest cha
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Disposition Assistance (OEA) submit
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Disposition provision in other inst
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Disposition The proposals strongly
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5.5.5 Summary: Lessons from Program
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Page 108 and 109: Emerging Technologies self-aligned
Page 110 and 111: Emerging Technologies wafer. 18 Gen
Page 112 and 113: Emerging Technologies 94 Planarizat
Page 114 and 115: Emerging Technologies Therefore, gi
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Page 118 and 119: Emerging Technologies 100 ensures f
Page 120 and 121: Emerging Technologies Etch Chemical
Page 122 and 123: Emerging Technologies 104 Fully Sub
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Page 126 and 127: Emerging Technologies 108 have sign
Page 128 and 129: Emerging Technologies 110 of automa
Page 130 and 131: Emerging Technologies 112 managemen
Page 132 and 133: Emerging Technologies 6.4.4 Fully A
Page 134 and 135: Emerging Technologies 116 Priority
Page 137 and 138: Appendix A. Other Industry Roadmaps
Page 139 and 140: Appendix A Overriding Issue SIA/SEM
Page 141 and 142: Appendix A Integrated Circuit Fabri
Page 143 and 144: IPC OIDA SIA/SEMATECH Interconnect
Page 145 and 146: Appendix A IPC Substrate thickness
Page 147 and 148: SIA/SEMATECH Precision Electromecha
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Page 153 and 154: Appendix A OIDA Specific technical
Page 155 and 156: Appendix A NEMI Photonics Critical
Page 157 and 158: Appendix A SIA/SEMATECH In a steady
Page 159 and 160: Appendix A SIA/SEMATECH Hand-in-han
Page 161 and 162: Appendix A SIA/SEMATECH Chemical, e
Page 163 and 164: Appendix A IPC Several approaches m
Page 165 and 166: Appendix A SIA/SEMATECH Conversion
Page 167 and 168: SIA/SEMATECH Benchmarking NEMI Need
Page 169 and 170: Appendix A IPC Purchasing Suppliers
Page 171 and 172: Appendix B. The Ten Ceres Principle
Page 173 and 174: Appendix C. The ICC Business Charte
Page 175 and 176: Appendix D Appendix D. Statistical
Page 177 and 178: SIC CODE Table 1. Demographic and w
Page 179 and 180: Appendix D Table 2. Correlation of
Page 181 and 182: SIC Code Table 3. Costs of fuels an
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Page 187 and 188: 3676- Electronic resistors 3677- El
Page 189 and 190: Appendix D Product Product Company
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Appendix D 183
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Appendix D Table 9. Quantity and va
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Appendix D Product Product Company
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Appendix D Product Product Company
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Key to Table 9: - Represents zero.
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SIC Code 36 361 Table 10. Air pollu
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SIC Code 36 361 362 Table 11. Pollu
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SIC Code 36 Appendix D Table 12. Po
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Appendix E Appendix E. Development
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Appendix E releases with component
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Appendix E 2 1 ITEM: Common Sense I
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Appendix E 6 1 ITEM: U.S. Industria
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Appendix E 1 ITEM: Waste Wi$e 2 SOU
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Appendix E 14 1 ITEM: 33/50 Program
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Appendix E 3 CONTENT: This Departme
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Appendix E clearinghouses, database
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5 COST: Free access to all data/inf
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Appendix E 34 1 ITEM: EMPF (Electro
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Appendix E 37 1 ITEM: I3LA (Initiat
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Appendix E 40 1 ITEM: Access EPA 2
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Appendix E 7 PERTINENCE: Probably n
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Appendix E 3 CONTENT: Large indexed
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Appendix E 55 1 ITEM: UCLA Center f
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Item # Type Source of Item Access C
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Appendix F. Survey of Tool Characte
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[Definitions for the design activit
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Human Interface (Please rank the im
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Appendix F 5 Quantifies and reports
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Appendix G Appendix G. Building Blo
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Appendix G The Nordic cooperation g
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Appendix G undertaken to assess env
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Appendix H If no accrual is made be
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Appendix H 248
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Appendix I 250
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Appendix J The ordinance requires U
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Appendix J 254 150,001 to 600,000 1
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Appendix J Germany (Proposed; effec
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References [16] Waitz and Corbet,
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References 260
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