1996 Electronics Industry Environmental Roadmap - Civil and ...

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References [16] Waitz and Corbet, “Developing an Integrated Environmental Performance Management System,” Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment, pp. 29-33, 1995. [17] J. Fiksel, Design for Environment: Creating Eco-Efficient Products and Processes, Mc- Graw-Hill, New York, September, 1995. [18] Curtis Moore and Alan Miller, Green Gold: Japan, Germany, the United States, and the Race for Environmental Technology, Beacon Press, Boston, MA, 1994. [19] Stephan Schmidheiny, Changing Course: A Global Perspective on Development and the Environment, MIT Press, Cambridge, MA, 1992. [20] Life Cycle Review, PLUS 1115, ID# 4604, Canadian Standards Association. [21] ISO/TC 207/SC5 Lifecycle Assessment-Principles and Framework, November 15, 1995. [22] Designing for the Environment: A Design Guide for Information and Technology Equipment, American Plastics Council, 1995, Tel: 1-800-2-HELP-90. [23] “Design Issues in Waste Avoidance,” Carnegie Mellon University, Department of Engineering and Public Policy, December 1991. [24] Hilary Eustace, Glenn Goulet, David Harden, and Roy Patelli, “A Business Assessment of Electronics Recycling for The Gordon Institute,” A thesis presented to Tufts University, August 1, 1995. [25] George Burris, Bill Rowe, and Jeffrey Lowry, “Green Paper on the Environmental Issues and Needed Research in Color Displays,” draft paper presented to EPA CSI, Federal Advisory Committee Meeting, Sept. 27-28, 1995, and EIA Draft, December 1995. [26] The Information Technology Industry Data Book 1960-2002, CBEMA, 1992. [27] Minnesota Laws, Minnesota Office of Environmental Assistance (OEA), August 1995, pg. 5. [28] Michael Winka, Frank Peluso, and Joseph Carpenter, “Demanufacturing-Redefining Solid Waste/Product Management,” NJ Department of Environmental Protection, Trenton, New Jersey, draft, n.d. [29] Modern Plastics, January, 1993, pp. 83-94 and Garbage, Trash, Refuse, Waste, Discards, Rubbish, & Junk, The Book 2, Nicholas and Dezenhall Communications Management Group, 1992, p. 40. [30] C. Bast, C. Johnson, T. Korpalski, and J.C. Vanderstraeten, “Globalization of and ‘Guiding Principles’ for Environmental Legislation and Public Policy Development,” 1995 IEEE International Symposium on Electronics and the Environment Proc., May 1-3, 1995, pg. 221. [31] The National Technology Roadmap for Semiconductors, published by the Semiconductor Industry Association, 4300 Stevens Creek Blvd., Suite 271, San Jose, California, 408-246- 2830. [32] Dennis Herrell, “Passing 2000 - AD and I/O,” Advanced Packaging, July-August 1995, p 102. 258
References [33] Electronics Manufacturing Technology Roadmaps, published by the National Electronics Manufacturing Framework Committee of the Electronic Industries Association, 2500 Wilson Blvd., Arlington, Virginia 22201-3834, 703-907-7500, December 1994. [34] Environmental Protection Agency, “Printed Wiring Board Pollution Prevention and Control: Analysis of Survey Results,” EPA 744-R-95-006, September 1995, p. 17. [35] U.S. Environmental Protection Agency, “Printed Wiring Board Industry and Use Cluster Profile,” EPA 744-R-95-005, September 1995. [36] The National Technology Roadmap for Electronic Interconnections, published by the Institute for Interconnecting and Packaging Electronic Circuits, 2214 Sanders Rd., Suite 250, Northbrook, Illinois 60062-6135, 708-509-9700, 1995. [37] “The development and diffusion of innovative environmental technologies in the printed wiring board industry,” draft working paper prepared by the Office of Technology Assessment, February 1995, citing the Microelectronics and Computer Technology Cooperation, “Environmental Consciousness: A Strategic Competitiveness Issue for the Electronics and Computer Technology Industry,” MCC, Austin, Texas: March 1993. [38] Conclusions and Recommendations: Optoelectronic Technology Roadmap, Optoelectronics Industry Development Association, 900 17th Street, Suite 1050, Washington, D.C. 20006, 1994. [39] Hedemalm Per, et al., “Waste from Electrical and Electronic Products: A Survey of the Contents of Materials and Hazardous Substances in Electric and Electronic Products,” Temanord, 1995: 554. [40] R. Goering, “New EDA Standards Join Industry Road Map,” Electronic Engineering Times, November 6, 1995, p. 16. [41] Coopers & Lybrand’s (International), International Accounting Summaries: A Guide for Interpretation and Comparison, Second Edition, John Wiley & Sons. New York, 1993. [42] R.S. Roussey, “Auditing Environmental Liabilities,” Auditing: A Journal of Practice and Theory, 1992. [43] R. Abelson, “Messy accounting,” Forbes, 14 October 1991, pp. 172-173. [44] SEC Staff Accounting Bulletin No. 92, 1993. [45] American Institute of Certified Public Accountants (AICPA) Environmental Accounting Task Force, 1995, New York Environmental Accounting Task Force, Exposure Draft: Proposed Statement of Position: Environmental Remediation Liabilities (including Auditing Guidance). 259
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
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Introduction These kinds of cross-c
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Introduction Strategic Priority Nee
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Introduction Tactical Priority Need
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2.0 Strategic Business Opportunitie
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Strategic Business Opportunities To
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Strategic Business Opportunities Go
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Strategic Business Opportunities co
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Strategic Business Opportunities Th
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Strategic Business Opportunities -
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Environmental Cost Accounting at AT
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Strategic Business Opportunities Pr
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Strategic Business Opportunities sm
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Strategic Business Opportunities pr
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Strategic Business Opportunities en
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Priority Need Task 1. Knowledge of
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Information and Knowledge Systems m
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Information and Knowledge Systems T
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Information and Knowledge Systems T
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Information and Knowledge Systems 4
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Information and Knowledge Systems A
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Information and Knowledge Systems m
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Design for Environment: Evolution a
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5. Models to support more comprehen
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5.0 Disposition Disposition 5.1 Obj
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Disposition due date are called con
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Disposition 5.4.1 The Consumer/Comm
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Disposition 5.4.2 Recycled Material
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Disposition One of the greatest cha
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Disposition Assistance (OEA) submit
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Disposition provision in other inst
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Disposition The proposals strongly
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5.5.5 Summary: Lessons from Program
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Disposition The left side of the mo
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Disposition and government for esta
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Disposition Recycling: The collecti
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Disposition 87
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Emerging Technologies self-aligned
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Emerging Technologies wafer. 18 Gen
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Emerging Technologies 94 Planarizat
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Emerging Technologies Therefore, gi
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Emerging Technologies Printed Wirin
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Emerging Technologies 100 ensures f
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Emerging Technologies Etch Chemical
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Emerging Technologies 104 Fully Sub
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Emerging Technologies adhesives and
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Emerging Technologies 108 have sign
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Emerging Technologies 110 of automa
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Emerging Technologies 112 managemen
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Emerging Technologies 6.4.4 Fully A
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Emerging Technologies 116 Priority
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Appendix A. Other Industry Roadmaps
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Appendix A Overriding Issue SIA/SEM
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Appendix A Integrated Circuit Fabri
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IPC OIDA SIA/SEMATECH Interconnect
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Appendix A IPC Substrate thickness
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SIA/SEMATECH Precision Electromecha
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Appendix A SIA/SEMATECH As CMOS tec
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Appendix A IPC “The coordination
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Appendix A OIDA Specific technical
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Appendix A NEMI Photonics Critical
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Appendix A SIA/SEMATECH In a steady
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Appendix A SIA/SEMATECH Hand-in-han
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Appendix A SIA/SEMATECH Chemical, e
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Appendix A IPC Several approaches m
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Appendix A SIA/SEMATECH Conversion
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SIA/SEMATECH Benchmarking NEMI Need
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Appendix A IPC Purchasing Suppliers
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Appendix B. The Ten Ceres Principle
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Appendix C. The ICC Business Charte
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Appendix D Appendix D. Statistical
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SIC CODE Table 1. Demographic and w
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Appendix D Table 2. Correlation of
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SIC Code Table 3. Costs of fuels an
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3672 Printed Circuit Boards 3674 Se
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1 Value of shipments for product by
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3676- Electronic resistors 3677- El
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Appendix D Product Product Company
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Appendix D 183
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Appendix D Table 9. Quantity and va
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Key to Table 9: - Represents zero.
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SIC Code 36 361 Table 10. Air pollu
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SIC Code 36 361 362 Table 11. Pollu
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SIC Code 36 Appendix D Table 12. Po
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Appendix E Appendix E. Development
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Appendix E releases with component
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Appendix E 2 1 ITEM: Common Sense I
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Appendix E 6 1 ITEM: U.S. Industria
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Page 231 and 232: Appendix E clearinghouses, database
Page 233 and 234: 5 COST: Free access to all data/inf
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Page 241 and 242: Appendix E 7 PERTINENCE: Probably n
Page 243 and 244: Appendix E 3 CONTENT: Large indexed
Page 245 and 246: Appendix E 55 1 ITEM: UCLA Center f
Page 247 and 248: Item # Type Source of Item Access C
Page 249 and 250: Appendix F. Survey of Tool Characte
Page 251 and 252: [Definitions for the design activit
Page 253 and 254: Human Interface (Please rank the im
Page 255 and 256: Appendix F 5 Quantifies and reports
Page 257 and 258: Appendix G Appendix G. Building Blo
Page 259 and 260: Appendix G The Nordic cooperation g
Page 261: Appendix G undertaken to assess env
Page 264 and 265: Appendix H If no accrual is made be
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Page 268 and 269: Appendix I 250
Page 270 and 271: Appendix J The ordinance requires U
Page 272 and 273: Appendix J 254 150,001 to 600,000 1
Page 274 and 275: Appendix J Germany (Proposed; effec
Page 278: References 260
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