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1996 Electronics Industry Environmental Roadmap - Civil and ...

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Design for Environment: Evolution <strong>and</strong> Tool Needs<br />

companies use overall environmental indices to guide material selection, part selection, <strong>and</strong><br />

process design. In ongoing manufacturing activities, DFE checklists are often integrated into<br />

other concurrent engineering activities, <strong>and</strong> detailed waste <strong>and</strong> emission tracking is incorporated<br />

into process materials accounting practices.<br />

In surveying the use of these DFE analysis methods, a common theme that emerged is the need<br />

for information on material <strong>and</strong> energy use—particularly the usage rates of environmentally<br />

hazardous materials. Although data needs are, to some degree, company dependent, there is value<br />

in gathering <strong>and</strong> assessing data that will benefit if not the entire electronics industry, certain<br />

sectors within the industry. One such example comes from within EPA’s <strong>Environmental</strong><br />

Technology Initiative program, which supports the “Design for the Environment Printed Wiring<br />

Board Project.” This project has released a profile of the PWB industry, a profile of the<br />

processes involved in the manufacturing of printed wiring boards, <strong>and</strong> an industry survey on<br />

pollution prevention <strong>and</strong> control. The project is examining selected processes <strong>and</strong> potential<br />

alternatives <strong>and</strong> evaluating them based upon environmental impact, human health risk,<br />

performance, <strong>and</strong> cost. 9<br />

Discussions related to the survey revealed that few organizations have the capacity to track<br />

materials (type <strong>and</strong> volume) through their own manufacturing systems, <strong>and</strong> even fewer felt<br />

confident in their abilities to obtain information for the DFE process from their suppliers. While<br />

many respondents to the survey felt that customer dem<strong>and</strong>s are driving the development of DFE<br />

methods, means of communicating DFE achievements to customers were generally ad hoc.<br />

Thus, one major obstacle to the continued development of DFE is the st<strong>and</strong>ardization of material<br />

tracking <strong>and</strong> energy-use data. St<strong>and</strong>ardized methods for tracking material <strong>and</strong> energy use will<br />

facilitate the development of generic DFE computer-aided design tools. St<strong>and</strong>ardization will<br />

also facilitate communication between customers <strong>and</strong> suppliers <strong>and</strong> would lend a higher profile<br />

to DFE activities. Currently, few companies appear to have moved beyond the use of checklists<br />

<strong>and</strong> other semi-quantitative analyses. The lack of data needed to perform more quantitative DFE<br />

analyses is a major roadblock to further integration.<br />

4.5 Closing Comments<br />

The survey results <strong>and</strong> interviews show that many companies in the electronics industry are at the<br />

stage of defining metrics for DFE—determining what level eco-efficiency is desired within the<br />

particular company—rather than fully implementing the process <strong>and</strong> utilizing complex software<br />

tools. Given the state of incorporating DFE principles in various organizations, as revealed by<br />

this exercise, perhaps the most useful DFE tools are precisely those most commonly in use:<br />

checklists, conceptual guides, <strong>and</strong> relatively simple chemical <strong>and</strong> materials databases. Although<br />

some companies need or want to create particular guidelines for specific products, some more<br />

general documents are increasingly available. For example, the American Plastics Council has<br />

published a design guide that discusses such DFE- <strong>and</strong> recycling-related topics as material<br />

selection, use of recycled plastic, basic part-design concepts, fastening <strong>and</strong> joining, coatings <strong>and</strong><br />

finishes, material identification <strong>and</strong> marking, <strong>and</strong> plastics processing, among others [22].<br />

9 Printed Wiring Board <strong>Industry</strong> <strong>and</strong> Use Cluster Profile, #EPA 744-R-95-005; Printed Wiring Board Pollution<br />

Prevention <strong>and</strong> Control: Analysis of Survey Results, #EPA 744-R-95-006; Federal <strong>Environmental</strong> Regulations<br />

Affecting the <strong>Electronics</strong> <strong>Industry</strong>, #EPA 744-B-95-001. #EPA 744-B-95-001 is not a direct result of the<br />

Printed Wiring Board Project, but an updated version of a previously published document.<br />

57

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