1996 Electronics Industry Environmental Roadmap - Civil and ...

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Appendix D Product Product Code Description Other semiconductor devices: 36749 85 Thyristors (SCRs, triacs, PNPN diodes) AND 176 Company Count Quantity (1992) Value (1992) 11 (X) (X) Quantity (1991) Value (1991) 36749 86 Hall effect devices 2 (X) 123,581 (X) 113,311 36749 87 All other semiconductor devices (tunnel diodes, thermoelectric semiconductor junctions, metaloxide varistors, solid-state transducers, and special semiconductor devices n.e.c.) Semiconductor parts: Chips and wafers: 31 (X) 858,219 (X) *730,960 36749 94 For integrated circuits (IC's) 54 (X) 2,912,176 (X) 2,675,542 36749 96 For discrete semiconductors 29 (X) 312,941 (X) *331,553 36749 97 All other semiconductor parts (headers, packages, heat sinks, other accessories, etc.) 46 (X) 1,023,911 (X) 1,204,865 36750 -- Capacitors Fixed: 84 (X) 1,250,592 (X) *1,223,972 36291 Paper, plastic (film), metallized, and dual (film/paper) dielectric: A.C. types: 17 104,769 164,946 71,018 144,634 36291 11 Less than 300 volts 13 10,049 15,702 6,210 11,917 36291 13 300 volts to 599 volts 17 83,082 122,252 53,415 106,351 36291 15 600 volts to 999 volts 11 7,049 12,975 5,844 9,955 36291 17 1,000 volts or over 10 4,589 14,017 5,549 16,411 Capacitors having a reactive power handling capacity of 0.5 KVAR or less: D.C. types/other: 36750 19 Axial lead 29 42,183 47,735 59,211 *56,691 36750 21 Radial lead AND 14 36751 24 Chips and other leaded devices Tantalum electrolytic: 4 114,326 24,313 114,693 *28,184 36750 26 Metal case (incl. foil and wet) 6 47,273 57,665 49,484 73,255 36750 28 Dipped AND 2 36750 31 Chips 4 1,026,598 180,715 736,262 152,104 36750 33 Other leaded (molded axial and molded radial) Aluminum electrolytic: 3 103,271 24,957 188,308 47,422 36750 38 Less than 18mm through 35mm 4 51,510 46,782 50,997 53,625 36750 41 Small can style (over 35mm through 51mm) 5 1,539 7,639 2,599 14,420 36750 43 Other can style (over 51mm) AND 5 36750 45 AC motor start Ceramic dielectric, single layer: 3 25,925 73,976 22,965 60,835 36750 54 Axial and radial AND 7 36750 51 Chips 2 367,880 17,862 552,010 21,901
Appendix D Product Product Company Quantity Value Quantity Value Code Description Ceramic dielectric, multilayer: Count (1992) (1992) (1991) (1991) 36750 53 Axial leads 4 137,267 10,300 141,708 12,002 36750 55 Radial leads 8 2,518,345 154,576 2,425,356 145,891 36750 57 Chips Other: 13 13,226,559 349,598 10,964,093 313,071 36750 59 Mica dielectric 8 76,347 18,924 86,225 21,278 36750 61 All other fixed Variable: 20 101,602 55,212 156,496 72,349 36750 63 Mica, ceramic or glass dielectric 5 21,357 29,370 18,955 26,793 36750 69 Other 7 2,464 10,440 *3,385 *12,901 36750 75 Parts of capacitors (including unfinished chips for further finishing and assembly) 7 (X) 140,528 (X) 111,250 36760 -- Resistors 91 (X) 696,448 (X) *721,459 36760 11 Fixed carbon resistors, composition or film types 6 299,266 28,335 315,464 31,299 Other fixed resistors (power capacity 20W or less): Surface mounted, having two terminals: 36760 24 Flat resistor chips 15 527,584 34,739 600,788 41,053 36760 25 Cylindrical leadless resistors (including metal film, metal oxide, and thick cermet film) 8 50,148 9,227 39,511 6,683 Surface mounted, having more than two terminals (resistor networks): 36760 28 Dual-in-line package 4 102,490 30,721 102,278 27,754 36760 32 Other (including flat packs) Resistors, having two leads: 6 42,391 17,075 47,268 18,998 36760 34 Wirewound 21 192,128 76,255 203,681 79,935 36760 36 Other (including metal film, metal oxide, thick cermet film) 16 1,446,521 83,982 1,648,782 97,365 Resistor networks, having more than two leads: 36760 38 Single-in-line 12 221,296 62,258 *313,347 *56,133 36760 42 Dual-in-line 9 57,859 20,041 *74,318 *28,084 36760 44 Other Variable, non-wirewound: Trimmers: 11 21,772 31,211 *15,367 *26,999 36760 51 Single-turn, carbon, other film 9 115,089 38,788 108,247 40,897 36760 54 Multi-turn, carbon, other film AND 6 36760 58 Surface mounted Potentiometers: 4 76,871 55,133 60,972 45,223 36760 57 Precision type 11 17,505 49,504 *21,220 *57,432 36760 62 Panel type Variable, wirewound: 4 7,684 9,545 *13,388 *15,155 36760 72 Variable wirewound, except potentiometers, including nonprecision and trimmers 6 2,625 8,452 2,994 10,670 36760 57 Potentiometers, precision type 11 6,435 29,457 5,431 20,461 36760 62 Potentiometers panel type 5 3,670 10,658 3,919 18,009 177
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MCC TECHNICAL REPORT MCC-ECESM-001-
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MCC Technical Report Document No. M
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Table of Contents Electronics Indus
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Electronics Industry Environmental
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Executive Summary Electronics Indus
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1.0 Introduction Introduction 1.1 O
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Introduction These kinds of cross-c
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Introduction Strategic Priority Nee
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Introduction Tactical Priority Need
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2.0 Strategic Business Opportunitie
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Strategic Business Opportunities To
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Strategic Business Opportunities Go
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Strategic Business Opportunities co
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Strategic Business Opportunities Th
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Strategic Business Opportunities -
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Environmental Cost Accounting at AT
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Strategic Business Opportunities Pr
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Strategic Business Opportunities sm
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Strategic Business Opportunities pr
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Strategic Business Opportunities en
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Priority Need Task 1. Knowledge of
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Information and Knowledge Systems m
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Information and Knowledge Systems T
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Information and Knowledge Systems T
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Information and Knowledge Systems 4
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Information and Knowledge Systems A
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Information and Knowledge Systems m
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Design for Environment: Evolution a
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5. Models to support more comprehen
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5.0 Disposition Disposition 5.1 Obj
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Disposition due date are called con
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Disposition 5.4.1 The Consumer/Comm
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Disposition 5.4.2 Recycled Material
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Disposition One of the greatest cha
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Disposition Assistance (OEA) submit
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Disposition provision in other inst
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Disposition The proposals strongly
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5.5.5 Summary: Lessons from Program
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Disposition The left side of the mo
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Disposition and government for esta
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Disposition Recycling: The collecti
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Disposition 87
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Emerging Technologies self-aligned
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Emerging Technologies wafer. 18 Gen
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Emerging Technologies 94 Planarizat
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Emerging Technologies Therefore, gi
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Emerging Technologies Printed Wirin
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Emerging Technologies 100 ensures f
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Emerging Technologies Etch Chemical
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Emerging Technologies 104 Fully Sub
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Emerging Technologies adhesives and
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Emerging Technologies 108 have sign
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Emerging Technologies 110 of automa
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Emerging Technologies 112 managemen
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Emerging Technologies 6.4.4 Fully A
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Emerging Technologies 116 Priority
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Appendix A. Other Industry Roadmaps
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Appendix A Overriding Issue SIA/SEM
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Appendix A Integrated Circuit Fabri
Page 143 and 144: IPC OIDA SIA/SEMATECH Interconnect
Page 145 and 146: Appendix A IPC Substrate thickness
Page 147 and 148: SIA/SEMATECH Precision Electromecha
Page 149 and 150: Appendix A SIA/SEMATECH As CMOS tec
Page 151 and 152: Appendix A IPC “The coordination
Page 153 and 154: Appendix A OIDA Specific technical
Page 155 and 156: Appendix A NEMI Photonics Critical
Page 157 and 158: Appendix A SIA/SEMATECH In a steady
Page 159 and 160: Appendix A SIA/SEMATECH Hand-in-han
Page 161 and 162: Appendix A SIA/SEMATECH Chemical, e
Page 163 and 164: Appendix A IPC Several approaches m
Page 165 and 166: Appendix A SIA/SEMATECH Conversion
Page 167 and 168: SIA/SEMATECH Benchmarking NEMI Need
Page 169 and 170: Appendix A IPC Purchasing Suppliers
Page 171 and 172: Appendix B. The Ten Ceres Principle
Page 173 and 174: Appendix C. The ICC Business Charte
Page 175 and 176: Appendix D Appendix D. Statistical
Page 177 and 178: SIC CODE Table 1. Demographic and w
Page 179 and 180: Appendix D Table 2. Correlation of
Page 181 and 182: SIC Code Table 3. Costs of fuels an
Page 183 and 184: 3672 Printed Circuit Boards 3674 Se
Page 185 and 186: 1 Value of shipments for product by
Page 187 and 188: 3676- Electronic resistors 3677- El
Page 189 and 190: Appendix D Product Product Company
Page 193: Appendix D Product Product Company
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Page 203 and 204: Appendix D Table 9. Quantity and va
Page 209 and 210: Key to Table 9: - Represents zero.
Page 211 and 212: SIC Code 36 361 Table 10. Air pollu
Page 213 and 214: SIC Code 36 361 362 Table 11. Pollu
Page 215 and 216: SIC Code 36 Appendix D Table 12. Po
Page 217 and 218: Appendix E Appendix E. Development
Page 219 and 220: Appendix E releases with component
Page 221 and 222: Appendix E 2 1 ITEM: Common Sense I
Page 223 and 224: Appendix E 6 1 ITEM: U.S. Industria
Page 225 and 226: Appendix E 1 ITEM: Waste Wi$e 2 SOU
Page 227 and 228: Appendix E 14 1 ITEM: 33/50 Program
Page 229 and 230: Appendix E 3 CONTENT: This Departme
Page 231 and 232: Appendix E clearinghouses, database
Page 233 and 234: 5 COST: Free access to all data/inf
Page 235 and 236: Appendix E 34 1 ITEM: EMPF (Electro
Page 237 and 238: Appendix E 37 1 ITEM: I3LA (Initiat
Page 239 and 240: Appendix E 40 1 ITEM: Access EPA 2
Page 241 and 242: Appendix E 7 PERTINENCE: Probably n
Page 243 and 244: Appendix E 3 CONTENT: Large indexed
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Appendix E 55 1 ITEM: UCLA Center f
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Item # Type Source of Item Access C
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Appendix F. Survey of Tool Characte
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[Definitions for the design activit
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Human Interface (Please rank the im
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Appendix F 5 Quantifies and reports
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Appendix G Appendix G. Building Blo
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Appendix G The Nordic cooperation g
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Appendix G undertaken to assess env
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Appendix H If no accrual is made be
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Appendix H 248
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Appendix I 250
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Appendix J The ordinance requires U
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Appendix J 254 150,001 to 600,000 1
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Appendix J Germany (Proposed; effec
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References [16] Waitz and Corbet,
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References 260
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